Texas Instruments Technical Journal PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download Texas Instruments Technical Journal PDF full book. Access full book title Texas Instruments Technical Journal by . Download full books in PDF and EPUB format.
Author:
Publisher:
ISBN:
Category : Computer engineering
Languages : en
Pages : 512
Get Book Here
Book Description
Author:
Publisher:
ISBN:
Category : Computer engineering
Languages : en
Pages : 512
Get Book Here
Book Description
Author: Yoshio Nishi
Publisher: CRC Press
ISBN: 1420017667
Category : Technology & Engineering
Languages : en
Pages : 1722
Get Book Here
Book Description
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Author: Hwaiyu Geng
Publisher: John Wiley & Sons
ISBN: 1119173647
Category : Technology & Engineering
Languages : en
Pages : 750
Get Book Here
Book Description
This book examines the Internet of Things (IoT) and Data Analytics from a technical, application, and business point of view. Internet of Things and Data Analytics Handbook describes essential technical knowledge, building blocks, processes, design principles, implementation, and marketing for IoT projects. It provides readers with knowledge in planning, designing, and implementing IoT projects. The book is written by experts on the subject matter, including international experts from nine countries in the consumer and enterprise fields of IoT. The text starts with an overview and anatomy of IoT, ecosystem of IoT, communication protocols, networking, and available hardware, both present and future applications and transformations, and business models. The text also addresses big data analytics, machine learning, cloud computing, and consideration of sustainability that are essential to be both socially responsible and successful. Design and implementation processes are illustrated with best practices and case studies in action. In addition, the book: Examines cloud computing, data analytics, and sustainability and how they relate to IoT overs the scope of consumer, government, and enterprise applications Includes best practices, business model, and real-world case studies Hwaiyu Geng, P.E., is a consultant with Amica Research (www.AmicaResearch.org, Palo Alto, California), promoting green planning, design, and construction projects. He has had over 40 years of manufacturing and management experience, working with Westinghouse, Applied Materials, Hewlett Packard, and Intel on multi-million high-tech projects. He has written and presented numerous technical papers at international conferences. Mr. Geng, a patent holder, is also the editor/author of Data Center Handbook (Wiley, 2015).
Author: Andrew Marshall
Publisher: Springer Science & Business Media
ISBN: 0306481618
Category : Technology & Engineering
Languages : en
Pages : 410
Get Book Here
Book Description
This title introduces state-of-the-art design principles for SOI circuit design, and is primarily concerned with circuit-related issues. It considers SOI material in terms of implementation that is promising or has been used elsewhere in circuit development, with historical perspective where appropriate.
Author: Thomas Moore
Publisher: Elsevier
ISBN: 1483292347
Category : Technology & Engineering
Languages : en
Pages : 293
Get Book Here
Book Description
Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.
Author: Steven H. Voldman
Publisher: John Wiley & Sons
ISBN: 1119233135
Category : Technology & Engineering
Languages : en
Pages : 1172
Get Book Here
Book Description
A practical and comprehensive reference that explores Electrostatic Discharge (ESD) in semiconductor components and electronic systems The ESD Handbook offers a comprehensive reference that explores topics relevant to ESD design in semiconductor components and explores ESD in various systems. Electrostatic discharge is a common problem in the semiconductor environment and this reference fills a gap in the literature by discussing ESD protection. Written by a noted expert on the topic, the text offers a topic-by-topic reference that includes illustrative figures, discussions, and drawings. The handbook covers a wide-range of topics including ESD in manufacturing (garments, wrist straps, and shoes); ESD Testing; ESD device physics; ESD semiconductor process effects; ESD failure mechanisms; ESD circuits in different technologies (CMOS, Bipolar, etc.); ESD circuit types (Pin, Power, Pin-to-Pin, etc.); and much more. In addition, the text includes a glossary, index, tables, illustrations, and a variety of case studies. Contains a well-organized reference that provides a quick review on a range of ESD topics Fills the gap in the current literature by providing information from purely scientific and physical aspects to practical applications Offers information in clear and accessible terms Written by the accomplished author of the popular ESD book series Written for technicians, operators, engineers, circuit designers, and failure analysis engineers, The ESD Handbook contains an accessible reference to ESD design and ESD systems.
Author: Steven H. Voldman
Publisher: John Wiley & Sons
ISBN: 1118707141
Category : Technology & Engineering
Languages : en
Pages : 328
Get Book Here
Book Description
With the evolution of semiconductor technology and global diversification of the semiconductor business, testing of semiconductor devices to systems for electrostatic discharge (ESD) and electrical overstress (EOS) has increased in importance. ESD Testing: From Components to Systems updates the reader in the new tests, test models, and techniques in the characterization of semiconductor components for ESD, EOS, and latchup. Key features: Provides understanding and knowledge of ESD models and specifications including human body model (HBM), machine model (MM), charged device model (CDM), charged board model (CBM), cable discharge events (CDE), human metal model (HMM), IEC 61000-4-2 and IEC 61000-4-5. Discusses new testing methodologies such as transmission line pulse (TLP), to very fast transmission line pulse (VF-TLP), and future methods of long pulse TLP, to ultra-fast TLP (UF-TLP). Describes both conventional testing and new testing techniques for both chip and system level evaluation. Addresses EOS testing, electromagnetic compatibility (EMC) scanning, to current reconstruction methods. Discusses latchup characterization and testing methodologies for evaluation of semiconductor technology to product testing. ESD Testing: From Components to Systems is part of the authors’ series of books on electrostatic discharge (ESD) protection; this book will be an invaluable reference for the professional semiconductor chip and system-level ESD and EOS test engineer. Semiconductor device and process development, circuit designers, quality, reliability and failure analysis engineers will also find it an essential reference. In addition, its academic treatment will appeal to both senior and graduate students with interests in semiconductor process, device physics, semiconductor testing and experimental work.
Author: Klaus Finkenzeller
Publisher: John Wiley & Sons
ISBN: 1119991870
Category : Technology & Engineering
Languages : en
Pages : 526
Get Book Here
Book Description
This is the third revised edition of the established and trusted RFID Handbook; the most comprehensive introduction to radio frequency identification (RFID) available. This essential new edition contains information on electronic product code (EPC) and the EPC global network, and explains near-field communication (NFC) in depth. It includes revisions on chapters devoted to the physical principles of RFID systems and microprocessors, and supplies up-to-date details on relevant standards and regulations. Taking into account critical modern concerns, this handbook provides the latest information on: the use of RFID in ticketing and electronic passports; the security of RFID systems, explaining attacks on RFID systems and other security matters, such as transponder emulation and cloning, defence using cryptographic methods, and electronic article surveillance; frequency ranges and radio licensing regulations. The text explores schematic circuits of simple transponders and readers, and includes new material on active and passive transponders, ISO/IEC 18000 family, ISO/IEC 15691 and 15692. It also describes the technical limits of RFID systems. A unique resource offering a complete overview of the large and varied world of RFID, Klaus Finkenzeller’s volume is useful for end-users of the technology as well as practitioners in auto ID and IT designers of RFID products. Computer and electronics engineers in security system development, microchip designers, and materials handling specialists benefit from this book, as do automation, industrial and transport engineers. Clear and thorough explanations also make this an excellent introduction to the topic for graduate level students in electronics and industrial engineering design. Klaus Finkenzeller was awarded the Fraunhofer-Smart Card Prize 2008 for the second edition of this publication, which was celebrated for being an outstanding contribution to the smart card field.
Author: Clarissa Chikiamco
Publisher: National Gallery Singapore
ISBN: 9811878625
Category : Art
Languages : en
Pages : 275
Get Book Here
Book Description
See Me, See You is the world’s first exhibition of early video installation of Southeast Asia, spanning the early 1980s to the early 1990s. This catalogue traces the journeys and evolving identities of the ten artists featured in the show and their pivotal experiments with the moving image, which incorporate readymade objects and cathode-ray tube television monitors as well as performative and participatory elements. Their artworks encapsulate the techniques and materials of their generation and mark the emergence of video installation as a form in the region. The publication features interviews, essays, rare archival images and texts, as well as a timeline that highlights the definitive technological moments and inventions that propelled television and video in global and regional contexts.
Author: Lawrence C. Wagner
Publisher: Springer Science & Business Media
ISBN: 1461549191
Category : Technology & Engineering
Languages : en
Pages : 256
Get Book Here
Book Description
This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.
