General Technical Report NE PDF Download
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Author:
Publisher:
ISBN:
Category : Forests and forestry
Languages : en
Pages : 494
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Book Description
Author:
Publisher:
ISBN:
Category : Forests and forestry
Languages : en
Pages : 494
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Book Description
Author:
Publisher: DIANE Publishing
ISBN: 1428918744
Category :
Languages : en
Pages : 245
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Book Description
The Office of Environmental Management's (EM) technical reports bibliography is an annual publication that contains information on scientific and technical reports sponsored by the Office of Environmental Management added to the Energy Science and Technology Database from July 1, 1994 through June 30, 1995. This information is divided into the following categories: Focus Areas, Cross-Cutting Programs, and Support Programs. In addition, a category for general information is included. EM's Office of Science and Technology sponsors this bibliography.
Author:
Publisher:
ISBN:
Category : Education
Languages : en
Pages : 872
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Book Description
Author:
Publisher:
ISBN:
Category : Environmental management
Languages : en
Pages : 972
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Book Description
Author:
Publisher:
ISBN:
Category : Government publications
Languages : en
Pages : 840
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Book Description
Author:
Publisher: UNEP/Earthprint
ISBN: 9280720104
Category : Organic water pollutants
Languages : en
Pages : 96
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Book Description
Author: PDL Staff
Publisher: Cambridge University Press
ISBN: 008095040X
Category : Technology & Engineering
Languages : en
Pages : 601
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Book Description
A hands-on guide to choosing and using old and new technologies for joining plastics and elastomers. Includes detailed discussions of over 25 techniques used to join plastics to themselves and to other materials. Advantages and disadvantages of each technique along with detailed discussions of applications are presented. A second section is organized by material and provides details of using different processes with over 50 generic families of plastics and how different techniques and operating parameters affect weld strength and other criteria. This book is an excellent reference and an invaluable resource for novice and expert alike in determining the best joining technique for their application and providing guidance in how to design and prepare for production.
Author: Karl J. Puttlitz
Publisher: Springer Science & Business Media
ISBN: 1461513898
Category : Technology & Engineering
Languages : en
Pages : 1250
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Book Description
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
Author: Joint FAO/WHO Expert Committee on Food Additives. Meeting
Publisher: Food & Agriculture Org.
ISBN: 9789251044742
Category : Business & Economics
Languages : en
Pages : 148
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Book Description
On cover: Cyhalothrin, Cypermethrin, Dicyclanil, Flumequine, Ivermectin, Lincomycin, Melengestrol acetate, Permethrin, Trichlorfon.
Author: Vanessa Watson
Publisher: Routledge
ISBN: 1134489544
Category : Architecture
Languages : en
Pages : 194
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Book Description
Change and Continuity in Spatial Planning addresses a question of enduring interest to planners: can planning really bring about significant and positive change? In South Africa the process of political transition appeared to create the preconditions for planners to demonstrate how their traditional humanitarian and environmental concerns could find concrete expression in the reshaping of the built environment. Integral to this story is how planning practices have been shaped by the past, in a rapidly changing context characterised by a globalising economy, new systems of governance, a changing political ideology, and a culture of intensifying poverty and diversity. More broadly, the book addresses the issue of how planners use power, in situations which themselves represent networks of power relations, where both planners and those they engage with operate through frames of reference fundamentally shaped by place and history.
