Author: Michael Andrew Vyvoda
Publisher:
ISBN:
Category :
Languages : en
Pages : 446

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Book Description

Author: Terry R. Turner
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 710

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Book Description

Author: James Wei
Publisher: Elsevier
ISBN: 0080488269
Category : Technology & Engineering
Languages : en
Pages : 508

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Book Description
In recent years chemical engineers have become increasingly involved in the design and synthesis of new materials and products as well as the development of biological processes and biomaterials. Such applications often demand that product properties be controlled with precision. Molecular modeling, simulating chemical and molecular structures or processes by computer, aids scientists in this endeavor. Volume 28 of Advances in Chemical Engineering presents discussions of theoretical and computational methods as well as their applications to specific technologies.

Author: Bruce Kennon Kellerman
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 540

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Author: M. Meyyappan
Publisher: The Electrochemical Society
ISBN: 9781566770965
Category : Technology & Engineering
Languages : en
Pages : 644

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Author:
Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 842

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Author: Kazuo Kondo
Publisher: The Electrochemical Society
ISBN:
Category : Copper plating
Languages : en
Pages : 422

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Book Description
Papers in this volume are from the 199th ECS Meeting, held in Washington, DC, Spring 2001. Morphology evolution encompasses electrochemical processing in ULSI fabrication, shape evolution, growth habit, and microstructure of electrodeposits. The most prominent example at present is the electrochemical deposition of copper for ULSI interconnects. Many other electrochemical processes at various stages of emergence and development hold promise for the electronics industry and beyond.

Author:
Publisher:
ISBN:
Category : Dielectric films
Languages : en
Pages : 278

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Book Description

Author: Vasilis F. Pavlidis
Publisher: Newnes
ISBN: 0124104843
Category : Technology & Engineering
Languages : en
Pages : 770

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Book Description
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization

Author: Paul R. Gray
Publisher: John Wiley & Sons
ISBN: 1394220065
Category : Technology & Engineering
Languages : en
Pages : 981

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Book Description
ANALYSIS AND DESIGN OF ANALOG INTEGRATED CIRCUITS Authoritative and comprehensive textbook on the fundamentals of analog integrated circuits, with learning aids included throughout Written in an accessible style to ensure complex content can be appreciated by both students and professionals, this Sixth Edition of Analysis and Design of Analog Integrated Circuits is a highly comprehensive textbook on analog design, offering in-depth coverage of the fundamentals of circuits in a single volume. To aid in reader comprehension and retention, supplementary material includes end of chapter problems, plus a Solution Manual for instructors. In addition to the well-established concepts, this Sixth Edition introduces a new super-source follower circuit and its large-signal behavior, frequency response, stability, and noise properties. New material also introduces replica biasing, describes and analyzes two op amps with replica biasing, and provides coverage of weighted zero-value time constants as a method to estimate the location of dominant zeros, pole-zero doublets (including their effect on settling time and three examples of circuits that create doublets), the effect of feedback on pole-zero doublets, and MOS transistor noise performance (including a thorough treatment on thermally induced gate noise). Providing complete coverage of the subject, Analysis and Design of Analog Integrated Circuits serves as a valuable reference for readers from many different types of backgrounds, including senior undergraduates and first-year graduate students in electrical and computer engineering, along with analog integrated-circuit designers.