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Author: Edoardo Charbon
Publisher: Springer Science & Business Media
ISBN: 0306481715
Category : Technology & Engineering
Languages : en
Pages : 178
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Book Description
In the past decade, substrate noise has had a constant and significant impact on the design of analog and mixed-signal integrated circuits. Only recently, with advances in chip miniaturization and innovative circuit design, has substrate noise begun to plague fully digital circuits as well. To combat the effects of substrate noise, heavily over-designed structures are generally adopted, thus seriously limiting the advantages of innovative technologies. Substrate Noise: Analysis and Optimization for IC Design addresses the main problems posed by substrate noise from both an IC and a CAD designer perspective. The effects of substrate noise on performance in digital, analog, and mixed-signal circuits are presented, along with the mechanisms underlying noise generation, injection, and transport. Popular solutions to the substrate noise problem and the trade-offs often debated by designers are extensively discussed. Non-traditional approaches as well as semi-automated techniques to combat substrate noise are also addressed. Substrate Noise: Analysis and Optimization for IC Design will be of interest to researchers and professionals interested in signal integrity, as well as to mixed signal and RF designers.
Author: Edoardo Charbon
Publisher: Springer Science & Business Media
ISBN: 0306481715
Category : Technology & Engineering
Languages : en
Pages : 178
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Book Description
In the past decade, substrate noise has had a constant and significant impact on the design of analog and mixed-signal integrated circuits. Only recently, with advances in chip miniaturization and innovative circuit design, has substrate noise begun to plague fully digital circuits as well. To combat the effects of substrate noise, heavily over-designed structures are generally adopted, thus seriously limiting the advantages of innovative technologies. Substrate Noise: Analysis and Optimization for IC Design addresses the main problems posed by substrate noise from both an IC and a CAD designer perspective. The effects of substrate noise on performance in digital, analog, and mixed-signal circuits are presented, along with the mechanisms underlying noise generation, injection, and transport. Popular solutions to the substrate noise problem and the trade-offs often debated by designers are extensively discussed. Non-traditional approaches as well as semi-automated techniques to combat substrate noise are also addressed. Substrate Noise: Analysis and Optimization for IC Design will be of interest to researchers and professionals interested in signal integrity, as well as to mixed signal and RF designers.
Author: Stephane Bronckers
Publisher: Artech House
ISBN: 1596932724
Category : Technology & Engineering
Languages : en
Pages : 272
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Book Description
This book presents case studies to illustrate that careful modeling of the assembly characteristics and layout details is required to bring simulations and measurements into agreement. Engineers learn how to use a proper combination of isolation structures and circuit techniques to make analog/RF circuits more immune to substrate noise. Topics include substrate noise propagation, passive isolation structures, noise couple in active devices, measuring the coupling mechanisms in analog/RF circuits, prediction of the impact of substrate noise on analog/RF circuits, and noise coupling in analog/RF systems.
Author: Ahmed Helmy
Publisher: Springer Science & Business Media
ISBN: 1402081669
Category : Technology & Engineering
Languages : en
Pages : 129
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Book Description
The book reports modeling and simulation techniques for substrate noise coupling effects in RFICs and introduces isolation structures and design guides to mitigate such effects with the ultimate goal of enhancing the yield of RF and mixed signal SoCs. The book further reports silicon measurements, and new test and noise isolation structures. To the authors’ knowledge, this is the first title devoted to the topic of substrate noise coupling in RFICs as part of a large SoC.
Author: Stéphane Donnay
Publisher: Springer Science & Business Media
ISBN: 0306481707
Category : Technology & Engineering
Languages : en
Pages : 311
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Book Description
This book is the first in a series of three dedicated to advanced topics in Mixed-Signal IC design methodologies. It is one of the results achieved by the Mixed-Signal Design Cluster, an initiative launched in 1998 as part of the TARDIS project, funded by the European Commission within the ESPRIT-IV Framework. This initiative aims to promote the development of new design and test methodologies for Mixed-Signal ICs, and to accelerate their adoption by industrial users. As Microelectronics evolves, Mixed-Signal techniques are gaining a significant importance due to the wide spread of applications where an analog front-end is needed to drive a complex digital-processing subsystem. In this sense, Analog and Mixed-Signal circuits are recognized as a bottleneck for the market acceptance of Systems-On-Chip, because of the inherent difficulties involved in the design and test of these circuits. Specially, problems arising from the use of a common substrate for analog and digital components are a main limiting factor. The Mixed-Signal Cluster has been formed by a group of 11 Research and Development projects, plus a specific action to promote the dissemination of design methodologies, techniques, and supporting tools developed within the Cluster projects. The whole action, ending in July 2002, has been assigned an overall budget of more than 8 million EURO.
Author: Selahattin Sayil
Publisher: Springer Nature
ISBN: 303112751X
Category : Technology & Engineering
Languages : en
Pages : 142
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Book Description
This textbook provides readers with a comprehensive introduction to various noise sources that significantly reduce performance and reliability in nanometer-scale integrated circuits. The author covers different types of noise, such as crosstalk noise caused by signal switching of adjacent wires, power supply noise or IR voltage drop in the power line due to simultaneous buffer / gate switching events, substrate coupling noise, radiation-induced transients, thermally induced noise and noise due to process and environmental Coverages also includes the relationship between some of these noise sources, as well as compound effects, and modeling and mitigation of noise mechanisms.
Author: Apostolos Georgiadis
Publisher: John Wiley & Sons
ISBN: 1118406354
Category : Technology & Engineering
Languages : en
Pages : 552
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Book Description
Microwave and Millimeter Wave Circuits and Systems: Emerging Design, Technologies and Applications provides a wide spectrum of current trends in the design of microwave and millimeter circuits and systems. In addition, the book identifies the state-of-the art challenges in microwave and millimeter wave circuits systems design such as behavioral modeling of circuit components, software radio and digitally enhanced front-ends, new and promising technologies such as substrate-integrated-waveguide (SIW) and wearable electronic systems, and emerging applications such as tracking of moving targets using ultra-wideband radar, and new generation satellite navigation systems. Each chapter treats a selected problem and challenge within the field of Microwave and Millimeter wave circuits, and contains case studies and examples where appropriate. Key Features: Discusses modeling and design strategies for new appealing applications in the domain of microwave and millimeter wave circuits and systems Written by experts active in the Microwave and Millimeter Wave frequency range (industry and academia) Addresses modeling/design/applications both from the circuit as from the system perspective Covers the latest innovations in the respective fields Each chapter treats a selected problem and challenge within the field of Microwave and Millimeter wave circuits, and contains case studies and examples where appropriate This book serves as an excellent reference for engineers, researchers, research project managers and engineers working in R&D, professors, and post-graduates studying related courses. It will also be of interest to professionals working in product development and PhD students.
Author: Dirk Jansen
Publisher: Springer Science & Business Media
ISBN: 0387735437
Category : Computers
Languages : en
Pages : 672
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Book Description
When I attended college we studied vacuum tubes in our junior year. At that time an average radio had ?ve vacuum tubes and better ones even seven. Then transistors appeared in 1960s. A good radio was judged to be one with more thententransistors. Latergoodradioshad15–20transistors and after that everyone stopped counting transistors. Today modern processors runing personal computers have over 10milliontransistorsandmoremillionswillbeaddedevery year. The difference between 20 and 20M is in complexity, methodology and business models. Designs with 20 tr- sistors are easily generated by design engineers without any tools, whilst designs with 20M transistors can not be done by humans in reasonable time without the help of Prof. Dr. Gajski demonstrates the Y-chart automation. This difference in complexity introduced a paradigm shift which required sophisticated methods and tools, and introduced design automation into design practice. By the decomposition of the design process into many tasks and abstraction levels the methodology of designing chips or systems has also evolved. Similarly, the business model has changed from vertical integration, in which one company did all the tasks from product speci?cation to manufacturing, to globally distributed, client server production in which most of the design and manufacturing tasks are outsourced.
Author: Luis Miguel Silveira
Publisher: Springer
ISBN: 0387354980
Category : Technology & Engineering
Languages : en
Pages : 692
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Book Description
For over three decades now, silicon capacity has steadily been doubling every year and a half with equally staggering improvements continuously being observed in operating speeds. This increase in capacity has allowed for more complex systems to be built on a single silicon chip. Coupled with this functionality increase, speed improvements have fueled tremendous advancements in computing and have enabled new multi-media applications. Such trends, aimed at integrating higher levels of circuit functionality are tightly related to an emphasis on compactness in consumer electronic products and a widespread growth and interest in wireless communications and products. These trends are expected to persist for some time as technology and design methodologies continue to evolve and the era of Systems on a Chip has definitely come of age. While technology improvements and spiraling silicon capacity allow designers to pack more functions onto a single piece of silicon, they also highlight a pressing challenge for system designers to keep up with such amazing complexity. To handle higher operating speeds and the constraints of portability and connectivity, new circuit techniques have appeared. Intensive research and progress in EDA tools, design methodologies and techniques is required to empower designers with the ability to make efficient use of the potential offered by this increasing silicon capacity and complexity and to enable them to design, test, verify and build such systems.
Author: Isaac Woungang
Publisher: Springer
ISBN: 3319756265
Category : Technology & Engineering
Languages : en
Pages : 333
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Book Description
This book presents the proceedings of the International Conference on Wireless Intelligent and Distributed Environment for Communication (WIDECOM 2018), organized by SRM University, NCR Campus, New Delhi, India, February 16-18, 2018. The conference focuses on challenges with respect to the dependability of integrated applications and intelligence-driven security threats against the platforms supporting these applications. The WIDECOM 2018 proceedings features papers addressing issues related to the new dependability paradigms, design, control, and management of next generation networks, performance of dependable network computing and mobile systems, protocols that deal with network computing, mobile/ubiquitous systems, cloud systems, and Internet of Things (IoT) systems. The proceeding is a valuable reference for researchers, instructors, students, scientists, engineers, managers, and industry practitioners, in industry, in the aforementioned areas. The book’s structure and content is organized in such a manner that makes it useful at a variety of learning levels. Presents the proceedings of the International Conference on Wireless Intelligent and Distributed Environment for Communication (WIDECOM 2018), organized by SRM University, NCR Campus, New Delhi, India, February 16-18, 2018; Includes an array of topics related to new dependability paradigms, design, control, and management of next generation networks, performance of dependable network computing and mobile systems, protocols that deal with network computing, mobile/ubiquitous systems, cloud systems, and Internet of Things (IoT) systems; Addresses issues related to the design and performance of dependable network computing and systems and to the security of these systems.
Author: R.P.G. Collinson
Publisher: Springer Science & Business Media
ISBN: 9781402072789
Category : Technology & Engineering
Languages : en
Pages : 804
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Book Description
Evaluation copies are available. Please contact
[email protected]. Provide the course number, number of students and present textbook used.Introduction to Avionics Systems, Second Edition explains the basic principles and underlying theory of modern avionic systems and how they are implemented with current technology for both civil and military aircraft in a clear and easy to read manner.All systems are explained so that their design and performance can be understood and analysed. Worked examples are included to illustrate the application of the theory and principles covered. The latest developments and directions of research for future systems are included.This new second edition has approximately 25% new material and takes into account the technology developments which have taken place since the first edition was published in January 1996. The book is well illustrated with line drawings and photos, with some in colour where appropriate.Readership: Graduates (or equivalent) from a range of disciplines entering the avionics and aerospace industries.Engineers at all levels engaged in the design and development of avionic systems and equipment in the avionic and aerospace industries.Students and post graduate students taking avionics and aeronautical engineering courses.Staff in the armed services and civil airlines engaged in the support or operation of aircraft who wish to acquire a deeper understanding of the design and implementation of avionic systems and equipment.
