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Author: Daniel Adams
Publisher: Springer Science & Business Media
ISBN: 1848000278
Category : Science
Languages : en
Pages : 132
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Book Description
Here is the first book to discuss the current understanding of silver metallization and its potential as a future interconnect material for integrated circuit technology. With the lowest resistivity of all metals, silver is an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the issues that have prevented silver from being used as an interconnect metal. The authors provide details on a wide range of experimental, characterization, and analysis techniques. The book is written for students, scientists, engineers, and technologists in the fields of integrated circuits and microelectronics research and development.
Author: Daniel Adams
Publisher: Springer Science & Business Media
ISBN: 1848000278
Category : Science
Languages : en
Pages : 132
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Book Description
Here is the first book to discuss the current understanding of silver metallization and its potential as a future interconnect material for integrated circuit technology. With the lowest resistivity of all metals, silver is an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the issues that have prevented silver from being used as an interconnect metal. The authors provide details on a wide range of experimental, characterization, and analysis techniques. The book is written for students, scientists, engineers, and technologists in the fields of integrated circuits and microelectronics research and development.
Author: Kash L. Mittal
Publisher: CRC Press
ISBN: 1466562366
Category : Science
Languages : en
Pages : 315
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Book Description
This volume documents the proceedings of the 7th Symposium on Metallized Plastics: Fundamental and Applied Aspects, held in Newark, New Jersey, December 2-3, 1999. This volume contains a total of 16 papers, which were all rigorously peer reviewed and suitably revised before inclusion. The book is divided into two parts: Metallization Techniques and Properties of Metal Deposits, and Interfacial and Adhesion Aspects. The topics covered include: various metallization techniques for a variety of plastics including some novel developments involving suitable plastic pretreatments; modification of polymers by plasma and ion-assisted reactions; metal doped plasma polymer films; metal-polyimide nanocomposite films; investigation of metal/polymer interactions by a variety of techniques; ways to improve adhesion of metal/polymer systems; modeling of metal/polymer interfaces; application of surface analytical techniques in the arena of metallized plastics; and ultrathin films on metal surfaces. This volume offers a wealth of information and represents current commentary on the R&D activity taking place in the technologically highly important field of metallized plastics and is of value and interest to anyone interested in the fundamental or applied aspects of metallized plastics.
Author: David Mitzi
Publisher: John Wiley & Sons
ISBN: 0470407611
Category : Science
Languages : en
Pages : 522
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Book Description
Discover the materials set to revolutionize the electronics industry The search for electronic materials that can be cheaply solution-processed into films, while simultaneously providing quality device characteristics, represents a major challenge for materials scientists. Continuous semiconducting thin films with large carrier mobilities are particularly desirable for high-speed microelectronic applications, potentially providing new opportunities for the development of low-cost, large-area, flexible computing devices, displays, sensors, and solar cells. To date, the majority of solution-processing research has focused on molecular and polymeric organic films. In contrast, this book reviews recent achievements in the search for solution-processed inorganic semiconductors and other critical electronic components. These components offer the potential for better performance and more robust thermal and mechanical stability than comparable organic-based systems. Solution Processing of Inorganic Materials covers everything from the more traditional fields of sol-gel processing and chemical bath deposition to the cutting-edge use of nanomaterials in thin-film deposition. In particular, the book focuses on materials and techniques that are compatible with high-throughput, low-cost, and low-temperature deposition processes such as spin coating, dip coating, printing, and stamping. Throughout the text, illustrations and examples of applications are provided to help the reader fully appreciate the concepts and opportunities involved in this exciting field. In addition to presenting the state-of-the-art research, the book offers extensive background material. As a result, any researcher involved or interested in electronic device fabrication can turn to this book to become fully versed in the solution-processed inorganic materials that are set to revolutionize the electronics industry.
Author: Mahmood Aliofkhazraei
Publisher: John Wiley & Sons
ISBN: 3527674977
Category : Technology & Engineering
Languages : en
Pages : 816
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Book Description
Providing in-depth information on how to obtain high-performance materials by controlling their nanostructures, this ready reference covers both the bottom-up and the top-down approaches to the synthesis and processing of nanostructured materials. The focus is on advanced methods of mechanical nanostructuring such as severe plastic deformation, including high pressure torsion, equal channel angular processing, cyclic extrusion compression, accumulative roll bonding, and surface mechanical attrition treatment. As such, the contents are inherently application-oriented, with the methods presented able to be easily integrated into existing production processes. In addition, the structure-property relationships and ways of influencing the nanostructure in order to exhibit a desired functionality are reviewed in detail. The whole is rounded off by a look at future directions, followed by an overview of applications in various fields of structural and mechanical engineering. With its solutions for successful processing of complex-shaped workpieces and large-scale specimens with desired properties, this is an indispensable tool for purposeful materials design.
Author: United States. Patent and Trademark Office
Publisher:
ISBN:
Category : Patents
Languages : en
Pages : 1430
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Book Description
Author: K.L. Mittal
Publisher: Springer Science & Business Media
ISBN: 146153416X
Category : Science
Languages : en
Pages : 391
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Book Description
This volume chronicles the proceedings of the Third Symposium on Metallized Plastics: Fundamental and Applied Aspects held under the auspices of the Dielectric Science and Technology Division of the Electrochemical Society in Phoenix, Arizona, October 13-18, 1991. This series of symposia to address the subject of metallized plastics was initiated in 1988 and the premier symposium was held in Chicago, October 10-12, 1988, followed by the second event in Montreal, Canada, May 7-10, 1990. The rroceedings of these two symposia have been properly documented ,2. The third symposium was a huge success like the previous two events, and all this is testimonial to the brisk interest and high tempo of R&D activity in the fie14 of metallized plastics. This further bolsters our earlier thinking that there was a conspicuous need to hold symposia on this topic on a regular basis and the fourth is planned for May 16-21, 1993 in Honolulu, Hawaii. The study of metallized plastics constitutes an important human endeavor l and as pointed out earlier there are myriad applications of metallized plastics ranging from very commonplace to exotic. Also a survey of the recent literature will reveal that both the fundamental and applied aspects of metallized plastics are being pursued with great vigor.
Author: Toivo T. Kodas
Publisher: John Wiley & Sons
ISBN: 3527615849
Category : Technology & Engineering
Languages : en
Pages : 562
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Book Description
High purity, thin metal coatings have a variety of important commercial applications, for example, in the microelectronics industry, as catalysts, as protective and decorative coatings as well as in gas-diffusion barriers. This book offers detailed, up- to-date coverage of the chemistry behind the vapor deposition of different metals from organometallic precursors. In nine chapters, the CVD of metals including aluminum, tungsten, gold, silver, platinum, palladium, nickel, as well as copper from copper(I) and copper(II) compounds is covered. The synthesis and properties of the precursors, the growth process, morphology, quality and adhesion of the resulting films as well as laser- assisted, ion- assisted and plasma-assisted methods are discussed. Present applications and prospects for future developments are summarized. With ca. 1000 references and a glossary, this book is a unique source of in-depth information. It is indispensable for chemists, physicists, engineers and materials scientists working with metal- coating processes and technologies. From Reviews: 'I highly recommend this book to anyone interested in learning more about the chemistry of metal CVD.' J. Am Chem. Soc.
Author:
Publisher:
ISBN:
Category : Aluminum
Languages : en
Pages : 440
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Book Description
Author:
Publisher:
ISBN:
Category : Solar energy
Languages : en
Pages : 588
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Book Description
Author: James A. Amick
Publisher:
ISBN:
Category : Electronics
Languages : en
Pages : 504
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Book Description
