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Author: Miko Elwenspoek
Publisher: Cambridge University Press
ISBN: 9780521607674
Category : Art
Languages : en
Pages : 424
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Book Description
A comprehensive overview of the key techniques used in the fabrication of micron-scale structures in silicon; for graduate students and researchers.
Author: Miko Elwenspoek
Publisher: Cambridge University Press
ISBN: 9780521607674
Category : Art
Languages : en
Pages : 424
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Book Description
A comprehensive overview of the key techniques used in the fabrication of micron-scale structures in silicon; for graduate students and researchers.
Author: Alexandros D. Margomenos
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 394
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Book Description
Author: Prem Pal
Publisher: CRC Press
ISBN: 1315341271
Category : Science
Languages : en
Pages : 315
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Book Description
Microelectromechanical systems (MEMS)-based sensors and actuators have become remarkably popular in the past few decades. Rapid advances have taken place in terms of both technologies and techniques of fabrication of MEMS structures. Wet chemical–based silicon bulk micromachining continues to be a widely used technique for the fabrication of microstructures used in MEMS devices. Researchers all over the world have contributed significantly to the advancement of wet chemical–based micromachining, from understanding the etching mechanism to exploring its application to the fabrication of simple to complex MEMS structures. In addition to its various benefits, one of the unique features of wet chemical–based bulk micromachining is the ability to fabricate slanted sidewalls, such as 45° walls as micromirrors, as well as freestanding structures, such as cantilevers and diaphragms. This makes wet bulk micromachining necessary for the fabrication of structures for myriad applications. This book provides a comprehensive understating of wet bulk micromachining for the fabrication of simple to advanced microstructures for various applications in MEMS. It includes introductory to advanced concepts and covers research on basic and advanced topics on wet chemical–based silicon bulk micromachining. The book thus serves as an introductory textbook for undergraduate- and graduate-level students of physics, chemistry, electrical and electronic engineering, materials science, and engineering, as well as a comprehensive reference for researchers working or aspiring to work in the area of MEMS and for engineers working in microfabrication technology.
Author: Zdravko Stanimirović
Publisher: BoD – Books on Demand
ISBN: 1789238099
Category : Technology & Engineering
Languages : en
Pages : 174
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Book Description
To present their work in the field of micromachining, researchers from distant parts of the world have joined their efforts and contributed their ideas according to their interest and engagement. Their articles will give you the opportunity to understand the concepts of micromachining of advanced materials. Surface texturing using pico- and femto-second laser micromachining is presented, as well as the silicon-based micromachining process for flexible electronics. You can learn about the CMOS compatible wet bulk micromachining process for MEMS applications and the physical process and plasma parameters in a radio frequency hybrid plasma system for thin-film production with ion assistance. Last but not least, study on the specific coefficient in the micromachining process and multiscale simulation of influence of surface defects on nanoindentation using quasi-continuum method provides us with an insight in modelling and the simulation of micromachining processes. The editors hope that this book will allow both professionals and readers not involved in the immediate field to understand and enjoy the topic.
Author: Markku Tilli
Publisher: Elsevier
ISBN: 0815519885
Category : Technology & Engineering
Languages : en
Pages : 670
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Book Description
A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications. Key topics covered include: - Silicon as MEMS material - Material properties and measurement techniques - Analytical methods used in materials characterization - Modeling in MEMS - Measuring MEMS - Micromachining technologies in MEMS - Encapsulation of MEMS components - Emerging process technologies, including ALD and porous silicon Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities. - Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland. - Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland. - Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland. - Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan. - Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques - Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs - Discusses properties, preparation, and growth of silicon crystals and wafers - Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures
Author: Dongqing Li
Publisher: Springer Science & Business Media
ISBN: 0387324682
Category : Technology & Engineering
Languages : en
Pages : 2242
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Book Description
Covering all aspects of transport phenomena on the nano- and micro-scale, this encyclopedia features over 750 entries in three alphabetically-arranged volumes including the most up-to-date research, insights, and applied techniques across all areas. Coverage includes electrical double-layers, optofluidics, DNC lab-on-a-chip, nanosensors, and more.
Author: Vijay K. Varadan
Publisher: John Wiley & Sons
ISBN: 0470846194
Category : Technology & Engineering
Languages : en
Pages : 406
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Book Description
Microelectromechanical systems (MEMS) refer to a collection of micro-sensors and actuators, which can react to environmental change under micro- circuit control. The integration of MEMS into traditional Radio Frequency (RF) circuits has resulted in systems with superior performance levels and lower manufacturing costs. The incorporation of MEMS based fabrication technologies into micro and millimeter wave systems offers viable routes to ICs with MEMS actuators, antennas, switches and transmission lines. The resultant systems operate with an increased bandwidth and increased radiation efficiency and have considerable scope for implementation within the expanding area of wireless personal communication devices. This text provides leading edge coverage of this increasingly important area and highlights the overlapping information requirements of the RF and MEMS research and development communities. * Provides an introduction to micromachining techniques and their use in the fabrication of micro switches, capacitors and inductors * Includes coverage of MEMS devices for wireless and Bluetooth enabled systems Essential reading for RF Circuit design practitioners and researchers requiring an introduction to MEMS technologies, as well as practitioners and researchers in MEMS and silicon technology requiring an introduction to RF circuit design.
Author: Masayoshi Esashi
Publisher: John Wiley & Sons
ISBN: 3527823255
Category : Technology & Engineering
Languages : en
Pages : 528
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Book Description
Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Author:
Publisher: Allied Publishers
ISBN: 9788177643282
Category :
Languages : en
Pages : 262
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Book Description
Author: Nava Setter
Publisher: Springer Science & Business Media
ISBN: 0387233199
Category : Technology & Engineering
Languages : en
Pages : 416
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Book Description
The book is focused on the use of functional oxide and nitride films to enlarge the application range of MEMS (microelectromechanical systems), including micro-sensors, micro-actuators, transducers, and electronic components for microwaves and optical communications systems. Applications, emerging applications, fabrication technology and functioning issues are presented and discussed. The book covers the following topics: Part A: Applications and devices with electroceramic-based MEMS: Chemical microsensors Microactuators based on thin films Micromachined ultrasonic transducers Thick-film piezoelectric and magnetostrictive devices Pyroelectric microsystems RF bulk acoustic wave resonators and filters High frequency tunable devices MEMS for optical functionality Part B: Materials, fabrication technology, and functionality: Ceramic thick films for MEMS Piezoelectric thin films for MEMS Materials and technology in thin films for tunable high frequency devices Permittivity, tunability and loss in ferroelectrics for reconfigurable high frequency electronics Microfabrication of piezoelectric MEMS Nano patterning methods for electroceramics Soft lithography emerging techniques The book is addressed to engineers, scientists and researchers of various disciplines, device engineers, materials engineers, chemists, physicists and microtechnologists who are working and/or interested in this fast growing and highly promising field. The publication of this book follows a Special Issue on electroceramic-based MEMS that was published in the Journal of Electroceramics at the beginning of 2004. The ten invited papers of that special issue were adapted by the authors into chapters of the present book and five additional chapters were added.
