Author: H. Jagannathan
Publisher:
ISBN: 9781713863397
Category :
Languages : en
Pages : 0
Book Description
Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and PostCMOS Applications 12
Author: H. Jagannathan
Publisher:
ISBN: 9781713863397
Category :
Languages : en
Pages : 0
Book Description
Publisher:
ISBN: 9781713863397
Category :
Languages : en
Pages : 0
Book Description
Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post-CMOS Applications 11
Author: H. Jagannathan
Publisher:
ISBN: 9781713830504
Category :
Languages : en
Pages : 178
Book Description
Publisher:
ISBN: 9781713830504
Category :
Languages : en
Pages : 178
Book Description
Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post-CMOS Applications 10
Author: F. Roozeboom
Publisher:
ISBN: 9781713811985
Category :
Languages : en
Pages :
Book Description
Publisher:
ISBN: 9781713811985
Category :
Languages : en
Pages :
Book Description
Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post-CMOS Applications 9
Author: Fred Roozeboom
Publisher:
ISBN: 9781510886476
Category :
Languages : en
Pages : 166
Book Description
Publisher:
ISBN: 9781510886476
Category :
Languages : en
Pages : 166
Book Description
Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post-CMOS Applications 13 & Advanced CMOS-Compatible Semiconductor Devices 20
Author: H. Jagannathan
Publisher:
ISBN: 9781713875512
Category :
Languages : en
Pages : 0
Book Description
Publisher:
ISBN: 9781713875512
Category :
Languages : en
Pages : 0
Book Description
Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post-CMOS Applications 9
Author: F. Roozeboom
Publisher: The Electrochemical Society
ISBN: 1607688689
Category : Science
Languages : en
Pages : 176
Book Description
This issue of ECS Transactions includes papers based on presentations from the symposium "Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post-CMOS Applications 9," originally held at the 235th ECS Meeting in Dallas, Texas, May 26-30, 2019.
Publisher: The Electrochemical Society
ISBN: 1607688689
Category : Science
Languages : en
Pages : 176
Book Description
This issue of ECS Transactions includes papers based on presentations from the symposium "Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post-CMOS Applications 9," originally held at the 235th ECS Meeting in Dallas, Texas, May 26-30, 2019.
Emerging Materials for Post CMOS Devices/Sensing and Applications 8
Author: Durgamadhab Misra
Publisher: The Electrochemical Society
ISBN: 1607688050
Category : Science
Languages : en
Pages : 119
Book Description
Publisher: The Electrochemical Society
ISBN: 1607688050
Category : Science
Languages : en
Pages : 119
Book Description
3D and Circuit Integration of MEMS
Author: Masayoshi Esashi
Publisher: John Wiley & Sons
ISBN: 3527823255
Category : Technology & Engineering
Languages : en
Pages : 528
Book Description
Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Publisher: John Wiley & Sons
ISBN: 3527823255
Category : Technology & Engineering
Languages : en
Pages : 528
Book Description
Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
CMOS - MEMS
Author: Henry Baltes
Publisher: John Wiley & Sons
ISBN: 3527616934
Category : Technology & Engineering
Languages : en
Pages : 612
Book Description
Microstructures, electronics, nanotechnology - these vast fields of research are growing together as the size gap narrows and many different materials are combined. Current research, engineering sucesses and newly commercialized products hint at the immense innovative potentials and future applications that open up once mankind controls shape and function from the atomic level right up to the visible world without any gaps. Sensor systems, microreactors, nanostructures, nanomachines, functional surfaces, integrated optics, displays, communications technology, biochips, human/machine interfaces, prosthetics, miniaturized medical and surgery equipment and many more opportunities are being explored. This new series, Advanced Micro and Nano Systems, provides cutting-edge reviews from top authors on technologies, devices and advanced systems from the micro and nano worlds.
Publisher: John Wiley & Sons
ISBN: 3527616934
Category : Technology & Engineering
Languages : en
Pages : 612
Book Description
Microstructures, electronics, nanotechnology - these vast fields of research are growing together as the size gap narrows and many different materials are combined. Current research, engineering sucesses and newly commercialized products hint at the immense innovative potentials and future applications that open up once mankind controls shape and function from the atomic level right up to the visible world without any gaps. Sensor systems, microreactors, nanostructures, nanomachines, functional surfaces, integrated optics, displays, communications technology, biochips, human/machine interfaces, prosthetics, miniaturized medical and surgery equipment and many more opportunities are being explored. This new series, Advanced Micro and Nano Systems, provides cutting-edge reviews from top authors on technologies, devices and advanced systems from the micro and nano worlds.
Magnetic Materials, Processes, and Devices VI
Author:
Publisher: The Electrochemical Society
ISBN: 9781566772969
Category : Magnetic disks
Languages : en
Pages : 636
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566772969
Category : Magnetic disks
Languages : en
Pages : 636
Book Description