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Author: Markku Tilli
Publisher: William Andrew
ISBN: 0323312233
Category : Technology & Engineering
Languages : en
Pages : 827
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Book Description
The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs. - Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques - Shows how to protect devices from the environment and decrease package size for a dramatic reduction in packaging costs - Discusses properties, preparation, and growth of silicon crystals and wafers - Explains the many properties (mechanical, electrostatic, optical, etc.), manufacturing, processing, measuring (including focused beam techniques), and multiscale modeling methods of MEMS structures - Geared towards practical applications rather than theory
Author: Markku Tilli
Publisher: William Andrew
ISBN: 0323312233
Category : Technology & Engineering
Languages : en
Pages : 827
Get Book Here
Book Description
The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs. - Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques - Shows how to protect devices from the environment and decrease package size for a dramatic reduction in packaging costs - Discusses properties, preparation, and growth of silicon crystals and wafers - Explains the many properties (mechanical, electrostatic, optical, etc.), manufacturing, processing, measuring (including focused beam techniques), and multiscale modeling methods of MEMS structures - Geared towards practical applications rather than theory
Author: Dimitris Tsoukalas
Publisher: Springer Science & Business Media
ISBN: 3709162440
Category : Technology & Engineering
Languages : en
Pages : 463
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Book Description
This volume contains the Proceedings of the International Conference on Simulation of Semiconductor Devices and Processes, SISPAD 01, held on September 5–7, 2001, in Athens. The conference provided an open forum for the presentation of the latest results and trends in process and device simulation. The trend towards shrinking device dimensions and increasing complexity in process technology demands the continuous development of advanced models describing basic physical phenomena involved. New simulation tools are developed to complete the hierarchy in the Technology Computer Aided Design simulation chain between microscopic and macroscopic approaches. The conference program featured 8 invited papers, 60 papers for oral presentation and 34 papers for poster presentation, selected from a total of 165 abstracts from 30 countries around the world. These papers disclose new and interesting concepts for simulating processes and devices.
Author: Tibor Grasser
Publisher: Springer Science & Business Media
ISBN: 3211728600
Category : Computers
Languages : en
Pages : 472
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Book Description
The "Twelfth International Conference on Simulation of Semiconductor Processes and Devices" (SISPAD 2007) continues a long series of conferences and is held in September 2007 at the TU Wien, Vienna, Austria. The conference is the leading forum for Technology Computer-Aided Design (TCAD) held alternatingly in the United States, Japan, and Europe. The first SISPAD conference took place in Tokyo in 1996 as the successor to three preceding conferences NUPAD, VPAD, and SISDEP. With its longstanding history SISPAD provides a world-wide forum for the presentaƯ tion and discussion of outstanding recent advances and developments in the field of numerical process and device simulation. Driven by the ongoing miniaturization in semiconductor fabrication technology, the variety of topics discussed at this meeting reflects the ever-growing complexity of the subject. Apart from the classic topics like process, device, and interconnect simulation, mesh generation, a broad specƯ trum of numerical issues, and compact modeling, new simulation approaches like atomistic and first-principles methods have emerged as important fields of research and are currently making their way into standard TCAD suites
Author: Yevgeny Perelman
Publisher: Springer Science & Business Media
ISBN: 1402087268
Category : Technology & Engineering
Languages : en
Pages : 126
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Book Description
Understanding brain structure and principles of operation is one of the major challengesofmodernscience.SincetheexperimentsbyGalvanionfrogmuscle contraction in 1792, it is known that electrical impulses lie at the core of the brain activity. The technology of neuro-electronic interfacing, besides its importance for neurophysiological research, has also clinical potential, so called neuropr- thetics. Sensory prostheses are intended to feed sensory data into patient’s brain by means of neurostimulation. Cochlear prostheses [1] are one example of sensory prostheses that are already used in patients. Retinal prostheses are currently under research [2]. Recent neurophysiological experiments [3, 4] show that brain signals recorded from motor cortex carry information regarding the movement of subject’s limbs (Fig. 1.1). These signals can be further used to control ext- nal machines [4] that will replace missing limbs, opening the ?eld of motor prosthetics, devices that will restore lost limbs or limb control. Fig. 1.1. Robotic arm controlled by monkey motor cortex signals. MotorLab, U- versity of Pittsburgh. Prof Andy Schwartz, U. Pitt 2 1 Introduction Another group of prostheses would provide treatment for brain diseases, such as prevention of epileptic seizure or the control of tremor associated with Parkinson disease [5]. Brain implants for treatment of Epilepsy and Parkinson symptoms (Fig. 1.2) are already available commercially [6, 7]. Fig. 1.2. Implantable device for Epilepsy seizures treatment [7]. Cyberonics, Inc.
Author: Electrochemical Society. Meeting
Publisher: The Electrochemical Society
ISBN: 9781566772846
Category : Science
Languages : en
Pages : 720
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Book Description
"... papers that were presented at the Sixth Symposium on High Purity Silicon held in Phoenix, Arizona at the 198th Meeting of the Electrochemical Society, October 22-27, 2000."--Preface.
Author: David Harame
Publisher: The Electrochemical Society
ISBN: 1566776562
Category : Electronic apparatus and appliances
Languages : en
Pages : 1136
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Book Description
Advanced semiconductor technology is depending on innovation and less on "classical" scaling. SiGe, Ge, and Related Compounds have become a key component of the arsenal in improving semiconductor performance. This issue of ECS Transactions discusses the technology to form these materials, process them, FET devices incorporating them, Surfaces and Interfaces, Optoelectronic devices, and HBT devices.
Author:
Publisher:
ISBN:
Category : Administrative law
Languages : en
Pages : 784
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Book Description
Special edition of the Federal Register, containing a codification of documents of general applicability and future effect ... with ancillaries.
Author: Peter Pichler
Publisher: Springer Science & Business Media
ISBN: 3709105978
Category : Technology & Engineering
Languages : en
Pages : 576
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Book Description
This book contains the first comprehensive review of intrinsic point defects, impurities and their complexes in silicon. Besides compiling the structures, energetic properties, identified electrical levels and spectroscopic signatures, and the diffusion behaviour from investigations, it gives a comprehensive introduction into the relevant fundamental concepts.
Author: Joachim Burghartz
Publisher: Springer Science & Business Media
ISBN: 1441972765
Category : Technology & Engineering
Languages : en
Pages : 471
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Book Description
Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.
Author: Marc Heyns
Publisher: Trans Tech Publications Ltd
ISBN: 3035707006
Category : Technology & Engineering
Languages : en
Pages : 332
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Book Description
UCPSS 2000
