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Author: Tetsuzo Yoshimura
Publisher: CRC Press
ISBN: 1000064603
Category : Science
Languages : en
Pages : 381
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Book Description
Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve “short line distances of the cm–mm order” and “large line counts of hundreds-thousands.” This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules. This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.
Author: Tetsuzo Yoshimura
Publisher: CRC Press
ISBN: 1000064603
Category : Science
Languages : en
Pages : 381
Get Book Here
Book Description
Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve “short line distances of the cm–mm order” and “large line counts of hundreds-thousands.” This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules. This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.
Author: Tetsuzo Yoshimura
Publisher: CRC Press
ISBN: 100006462X
Category : Science
Languages : en
Pages : 376
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Book Description
Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve “short line distances of the cm–mm order” and “large line counts of hundreds-thousands.” This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules. This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.
Author: Tetsuzo Yoshimura
Publisher: CRC Press
ISBN: 1351004883
Category : Computers
Languages : en
Pages : 257
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Book Description
This book gives a solution to the problem of constructing lightwave paths in free spaces by proposing the concept of a Self-Organized Lightwave Network (SOLNET). This concept enables us to form self-aligned coupling optical waveguides automatically. SOLNETs are fabricated by self-focusing of lightwaves in photosensitive media, in which the refractive index increases upon light beam exposure, to realize the following functions: 1) Optical solder: Self-aligned optical couplings between misaligned devices with different core sizes 2) Three-dimensional optical wiring 3) Targeting lightwaves onto specific objects SOLNETs are expected to reduce the efforts to implement lightwaves into electronic systems and allow us to create new architectures, thus reducing costs and energy dissipation and improving overall system performance. SOLNETs are also expected to be applied to a wide range of fields where lightwaves are utilized, for example, solar energy conversion systems and biomedical technologies, especially photo-assisted cancer therapies. Readers will systematically learn concepts and features of SOLNETs, SOLNET performance predicted by computer simulations, experimental demonstrations for the proof of concepts, and expected applications. They will also be prepared for future challenges of the applications. This book is intended to be read by scientists, engineers, and graduate students who study advanced optoelectronic systems such as optical interconnects within computers and optical networking systems, and those who produce new ideas or strategies on lightwave-related subjects.
Author: Tetsuzo Yoshimura
Publisher: CRC Press
ISBN: 1000844331
Category : Technology & Engineering
Languages : en
Pages : 429
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Book Description
Reviews various types of MLD processes including vapor-phase MLD, liquid-phase MLD, and selective MLD. Introduces organic multiple quantum dots (Organic MQDs) that are typical tailored organic thin-film materials produced by MLD. Designs light modulators/optical switches, predicts their performance, and discusses impacts of the organic MQDs on them. Discusses impacts of the organic MQDs on optical interconnects within computers and on optical switching systems. Presents proposals of MLD applications to energy conversion systems, molecular targeted drug delivery, photodynamic therapy, and laser surgery for cancer therapy.
Author: Tetsuzo Yoshimura
Publisher: CRC Press
ISBN: 1351833855
Category : Science
Languages : en
Pages : 490
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Book Description
Among the many atomic/molecular assembling techniques used to develop artificial materials, molecular layer deposition (MLD) continues to receive special attention as the next-generation growth technique for organic thin-film materials used in photonics and electronics. Thin-Film Organic Photonics: Molecular Layer Deposition and Applications describes how photonic/electronic properties of thin films can be improved through MLD, which enables precise control of atomic and molecular arrangements to construct a wire network that achieves "three-dimensional growth". MLD facilitates dot-by-dot—or molecule-by-molecule—growth of polymer and molecular wires, and that enhanced level of control creates numerous application possibilities. Explores the wide range of MLD applications in solar energy and optics, as well as proposed uses in biomedical photonics This book addresses the prospects for artificial materials with atomic/molecular-level tailored structures, especially those featuring MLD and conjugated polymers with multiple quantum dots (MQDs), or polymer MQDs. In particular, the author focuses on the application of artificial organic thin films to: Photonics/electronics, particularly in optical interconnects used in computers Optical switching and solar energy conversion systems Bio/ medical photonics, such as photodynamic therapy Organic photonic materials, devices, and integration processes With its clear and concise presentation, this book demonstrates exactly how MLD enables electron wavefunction control, thereby improving material performance and generating new photonic/electronic phenomena.
Author: Tetsuzo Yoshimura
Publisher: CRC Press
ISBN: 9814364088
Category : Science
Languages : en
Pages : 396
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Book Description
This book proposes and reviews comprehensive strategies based on optical electronics for constructing optoelectronic systems with minimized optics excess. It describes the core technologies such as self-organized optical waveguides based on self-organized lightwave network (SOLNET), three-dimensional optical circuits, material-saving heterogeneous
Author: David L. Andrews
Publisher: John Wiley & Sons
ISBN: 1119014018
Category : Technology & Engineering
Languages : en
Pages : 424
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Book Description
Discusses the basic physical principles underlying thescience and technology of nanophotonics, its materials andstructures This volume presents nanophotonic structures and Materials.Nanophotonics is photonic science and technology that utilizeslight/matter interactions on the nanoscale where researchers arediscovering new phenomena and developing techniques that go wellbeyond what is possible with conventional photonics andelectronics.The topics discussed in this volume are: CavityPhotonics; Cold Atoms and Bose-Einstein Condensates; Displays;E-paper; Graphene; Integrated Photonics; Liquid Crystals;Metamaterials; Micro-and Nanostructure Fabrication; Nanomaterials;Nanotubes; Plasmonics; Quantum Dots; Spintronics; Thin FilmOptics Comprehensive and accessible coverage of the whole of modernphotonics Emphasizes processes and applications that specifically exploitphoton attributes of light Deals with the rapidly advancing area of modern optics Chapters are written by top scientists in their field Written for the graduate level student in physical sciences;Industrial and academic researchers in photonics, graduate studentsin the area; College lecturers, educators, policymakers,consultants, Scientific and technical libraries, governmentlaboratories, NIH.
Author: Muhannad S. Bakir
Publisher: Artech House
ISBN: 1596932473
Category : Technology & Engineering
Languages : en
Pages : 551
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Book Description
This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
Author: John H. Lau
Publisher: Springer Nature
ISBN: 9811613761
Category : Technology & Engineering
Languages : en
Pages : 513
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Book Description
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Author: Ishfaq Ahmad
Publisher: CRC Press
ISBN: 1482254441
Category : Computers
Languages : en
Pages : 1216
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Book Description
Implementing energy-efficient CPUs and peripherals as well as reducing resource consumption have become emerging trends in computing. As computers increase in speed and power, their energy issues become more and more prevalent. The need to develop and promote environmentally friendly computer technologies and systems has also come to the forefront
