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Author: Johan Liu
Publisher: Springer Science & Business Media
ISBN: 144195760X
Category : Technology & Engineering
Languages : en
Pages : 216
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Book Description
Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also includes exercises and detailed solutions at the end of each chapter.
Author: Johan Liu
Publisher: Springer Science & Business Media
ISBN: 144195760X
Category : Technology & Engineering
Languages : en
Pages : 216
Get Book Here
Book Description
Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also includes exercises and detailed solutions at the end of each chapter.
Author: Tomasz Nowakowski
Publisher: CRC Press
ISBN: 1315736977
Category : Technology & Engineering
Languages : en
Pages : 408
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Book Description
Within the last fifty years the performance requirements for technical objects and systems were supplemented with: customer expectations (quality), abilities to prevent the loss of the object properties in operation time (reliability and maintainability), protection against the effects of undesirable events (safety and security) and the ability to
Author: H.P. Rossmanith
Publisher: Routledge
ISBN: 1135814112
Category : Architecture
Languages : en
Pages : 584
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Book Description
The interaction between engineering and the law is undergoing dramatic changes. Product liability, laws have been introduced in Japan, patent claims over living organisms have been made in bioengineering and the differing national laws of copyright protection and liability are in the process of harmonisation, especially in the European Union. The pace and complexity of these changes make it essential for technologists, lawyers, engineers and insurance experts to establish a common basis for understanding, co-operation and exchange of expertise. The recently founded International Society for Technology, Law and Insurance aims to foster such co-operation. This volume features 46 selected contributions which address various topical issues and the law. The most important issues relate to engineering risks, quality assurance and assessment and legal implications assiciated with them. Recent failure cases are explained and the technical, legal and insurance-related issues discussed in detail.
Author:
Publisher:
ISBN:
Category : Electrooptical devices
Languages : en
Pages : 294
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Book Description
Author: National Research Council
Publisher: National Academies Press
ISBN: 030908623X
Category : Technology & Engineering
Languages : en
Pages : 267
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Book Description
Expansion of micro-technology applications and rapid advances in nano-science have generated considerable interest by the Air Force in how these developments will affect the nature of warfare and how it could exploit these trends. The report notes four principal themes emerging from the current technological trends: increased information capability, miniaturization, new materials, and increased functionality. Recommendations about Air Force roles in micro- and nanotechnology research are presented including those areas in which the Air Force should take the lead. The report also provides a number of technical and policy findings and recommendations that are critical for effective development of the Air Force's micro- and nano-science and technology program
Author: Abhijit Kar
Publisher: BoD – Books on Demand
ISBN: 1789854598
Category : Technology & Engineering
Languages : en
Pages : 96
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Book Description
This book provides some of the most advanced research observations and in-depth knowledge behind lead-free soldering. Readers will find a description of different cutting-edge techniques used for improving the reliability of interconnects manufacturing. Some of the most unconventional topics covered in this book include solder joint formation for microelectronic devices at room temperature and the possibility of soldering ceramic materials, which is limited due to the poor wettability of ceramic substrates with commercial solders following classical soldering techniques. We also discuss the possibilities of nanoscale preparation of solder joints for bringing down the processing temperature so that it does not affect the packaging technologies. Readers will find that precise, systematic discussion of solder joint formation and its interfacial characterization has been depicted for each technique used in different chapters. This book is of interest to both fundamental researchers and also to practicing scientists and will prove invaluable to all those working in industry and academia.
Author: Ahmed Sharif
Publisher: John Wiley & Sons
ISBN: 3527813993
Category : Technology & Engineering
Languages : en
Pages : 400
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Book Description
Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.
Author: E.E. Gdoutos
Publisher: Springer Science & Business Media
ISBN: 1402049722
Category : Science
Languages : en
Pages : 1452
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Book Description
The 16th European Conference of Fracture (ECF16) was held in Greece, July, 2006. It focused on all aspects of structural integrity with the objective of improving the safety and performance of engineering structures, components, systems and their associated materials. Emphasis was given to the failure of nanostructured materials and nanostructures including micro- and nano-electromechanical systems (MEMS and NEMS).
Author: Aaron T. Scanlan
Publisher: MDPI
ISBN: 3039216945
Category : Science
Languages : en
Pages : 106
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Book Description
Despite being one of the most popular sports worldwide, basketball has received limited research attention compared to other team sports. Establishing a strong evidence base with high-quality and impactful research is essential in enhancing decision-making processes to optimize player performance for basketball professionals. Consequently, the book entitled Improving Performance and Practice in Basketball provides a collection of novel research studies to increase the available evidence on various topics with strong translation to practice in basketball. The book includes work by 40 researchers from 16 institutions or professional organizations from 9 countries. In keeping with notable topics in basketball research, the book contains 2 reviews focused on monitoring strategies to detect player fatigue and considerations for travel in National Basketball Association players. In addition, 8 applied studies are also included in the book, focused on workload monitoring, game-related statistics, and the measurement of physical and skill attributes in basketball players. This book also has a strong focus on increasing the evidence available for female basketball players, who have traditionally been under-represented in the literature. The outcomes generated from this book should provide new insights to inform practice in many areas for professionals working in various roles with basketball teams.
Author: Titu I. Băjenescu
Publisher: Artech House
ISBN: 1596934360
Category : Technology & Engineering
Languages : en
Pages : 706
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Book Description
The main reason for the premature breakdown of today's electronic products (computers, cars, tools, appliances, etc.) is the failure of the components used to build these products. Today professionals are looking for effective ways to minimize the degradation of electronic components to help ensure longer-lasting, more technically sound products and systems. This practical book offers engineers specific guidance on how to design more reliable components and build more reliable electronic systems. Professionals learn how to optimize a virtual component prototype, accurately monitor product reliability during the entire production process, and add the burn-in and selection procedures that are the most appropriate for the intended applications. Moreover, the book helps system designers ensure that all components are correctly applied, margins are adequate, wear-out failure modes are prevented during the expected duration of life, and system interfaces cannot lead to failure.
