Regulation of Power Amplifiers Under VSWR Conditions in CMOS 65nm for 60GHz WLAN Applications PDF Download
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Author: Jean Gorisse
Publisher:
ISBN:
Category :
Languages : en
Pages : 248
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Book Description
Avec l'apparition d'applications grand-public, comme le Wireless-HD, les fréquences millimétriques nécessitent l'utilisation de technologies CMOS faible coût. Cependant, avant d'être commercialisés, les transmetteurs mmW doivent être suffisamment résistants notamment à la désadaptation d'impédance entre l'amplificateur de puissance (AP) et l'antenne qui peut résulter d'un obstacle dans le champ proche de l'antenne. Une telle désadaptation d'impédance se traduit par l'apparition d'ondes stationnaires qui peuvent engendrer des dommages irrémédiables sur l'AP. Cette thèse propose une architecture innovante de régulation qui vise à protéger l'AP de telles dégradations tout en optimisant ses performances. La désadaptation d'impédance peut être évaluée en intégrant plusieurs détecteurs de puissance entre l'AP et l'antenne. Une boucle de régulation numérique peut ensuite établir une stratégie d'optimisation des performances de l'AP. Cette thèse s'intéresse particulièrement aux circuits de détection de puissance qui captent la désadaptation d'impédance de l'antenne. Réalisé en technologie CMOS 65nm de STMicroelectronics, le détecteur de puissance présente 25dB de dynamique à 60GHz et est capable de détecter jusqu'à 3 :1 de TOS. Ces détecteurs de puissance ont ensuite été intégrés dans un second circuit avec un AP et des convertisseurs (CAN & CNA). Une boucle de régulation agissant sur le gain de l'AP permet ainsi de garder une puissance de sortie constante quelle que soit l'impédance d'antenne tandis qu'une seconde boucle protège l'AP de la destruction. Cette thèse couvre également deux projets développés en parallèle de l'architecture de régulation de TOS. D'abord est proposée une nouvelle architecture de convertisseur analogique numérique logarithmique, basée sur l'architecture d'amplificateur logarithmique à compression progressive. Ensuite, une co-simulation sous ADS d'un AP RF/mmW avec sa boucle de régulation numérique permet de simuler l'AP à TOS régulé.
Author: Jean Gorisse
Publisher:
ISBN:
Category :
Languages : en
Pages : 248
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Book Description
Avec l'apparition d'applications grand-public, comme le Wireless-HD, les fréquences millimétriques nécessitent l'utilisation de technologies CMOS faible coût. Cependant, avant d'être commercialisés, les transmetteurs mmW doivent être suffisamment résistants notamment à la désadaptation d'impédance entre l'amplificateur de puissance (AP) et l'antenne qui peut résulter d'un obstacle dans le champ proche de l'antenne. Une telle désadaptation d'impédance se traduit par l'apparition d'ondes stationnaires qui peuvent engendrer des dommages irrémédiables sur l'AP. Cette thèse propose une architecture innovante de régulation qui vise à protéger l'AP de telles dégradations tout en optimisant ses performances. La désadaptation d'impédance peut être évaluée en intégrant plusieurs détecteurs de puissance entre l'AP et l'antenne. Une boucle de régulation numérique peut ensuite établir une stratégie d'optimisation des performances de l'AP. Cette thèse s'intéresse particulièrement aux circuits de détection de puissance qui captent la désadaptation d'impédance de l'antenne. Réalisé en technologie CMOS 65nm de STMicroelectronics, le détecteur de puissance présente 25dB de dynamique à 60GHz et est capable de détecter jusqu'à 3 :1 de TOS. Ces détecteurs de puissance ont ensuite été intégrés dans un second circuit avec un AP et des convertisseurs (CAN & CNA). Une boucle de régulation agissant sur le gain de l'AP permet ainsi de garder une puissance de sortie constante quelle que soit l'impédance d'antenne tandis qu'une seconde boucle protège l'AP de la destruction. Cette thèse couvre également deux projets développés en parallèle de l'architecture de régulation de TOS. D'abord est proposée une nouvelle architecture de convertisseur analogique numérique logarithmique, basée sur l'architecture d'amplificateur logarithmique à compression progressive. Ensuite, une co-simulation sous ADS d'un AP RF/mmW avec sa boucle de régulation numérique permet de simuler l'AP à TOS régulé.
Author: Ali Afsahi
Publisher:
ISBN: 9781303625022
Category :
Languages : en
Pages : 98
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Book Description
The advancement of CMOS technology has enabled a high level of integration in modern, low cost, small form-factor and low power wireless devices. While power amplifiers (PAs) are key components in wireless transceivers, their realization and integration in standard CMOS technology has shown several challenges. The modern wireless standards such as WLAN and LTE, utilize higher order modulation schemes in order to increase the data rate and efficiently use the limited available spectrum and also provide a robust link in a fading environment. These modulations possess a very high peak-to-average ratio (PAR) and require a very linear power amplifier to preserve the integrity of the signal. In this dissertation several linearization and power combining techniques have been proposed to address the challenges of designing a high power and linear PA in CMOS for WLAN applications. To demonstrate these techniques in silicon, three chips have been designed and fabricated in 65nm standard CMOS. In the first chip, a fully integrated dual-band power amplifiers with on-chip baluns for 802.11n MIMO WLAN applications are implemented. With a 3.3v supply, the PAs produce a saturated output power of 28.3dBm and 26.7dBm with peak drain efficiency of 35.3% and 25.3% for the 2.4GHz and 5GHz bands, respectively. By utilizing multiple fully self-contained linearization algorithms, an EVM of -25dB is achieved at 22.4dBm for the 2.4GHz band and 20.5dBm for the 5GHz band while transmitting 54Mbs OFDM. In the next two designs, two monolithic power combining schemes for CMOS power amplifiers, distributed-LC and current-mode transformer-based, are compared. Fully integrated 2.4GHz power amplifiers (PAs) using these techniques were fabricated. From a 3.3 V supply, the distributed-LC combined PA produces a saturated power of 31.5dBm with peak PAE of 25%. The current-mode transformer based PA combiner produces 33.5dBm saturated power with 37.6% peak PAE. With gm-linearization and digital pre-distortion, these PAs transmit 25.5dBm and 26.4dBm with -25dB EVM for a 54Mb/s OFDM signal respectively.
Author: Payam Masoumi Farahabadi
Publisher:
ISBN:
Category : Power amplifiers
Languages : en
Pages : 164
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Book Description
The availability of an unlicensed 7 GHz bandwidth around 60 GHz offers great potential for establishment of high-data-rate short-range wireless communication links. Although previously left unutilized, recent advances in electronics enable the development of wireless transceivers at millimeter-wave frequencies. Despite offering a large bandwidth, the high signal attenuation caused by oxygen absorption in 60 GHz band requires the wireless transmitters to transmit signals with power as large as 27 dBm, so the receivers can detect greatly attenuated signals. Therefore, the design of power amplifiers capable of generating such large output powers proves to be a major challenge in the development of 60 GHz wireless transceivers, especially if CMOS technology is chosen for implementation of fully integrated 60 GHz wireless systems. In this dissertation, we present new architectures for power combining transformers, as well as new circuit topologies to improve the performance of 60 GHz power amplifiers implemented in CMOS technology. Although CMOS offers a higher level of integration and lower fabrication cost compared to high-speed compound semiconductor technologies, low supply and breakdown voltages, as well as operation near cutoff frequencies of MOSFETs make the design of power amplifier extremely challenging. Optimization of the efficiency/power performance of CMOS power amplifiers operating at millimeter-wave frequencies requires novelty in the design of active/passive structures. An overview on the technological advances and the challenges in millimeter-wave CMOS power amplifiers is presented by comparing previously reported active/passive power combination techniques. A comprehensive analysis and modeling of the matching circuits and on-chip spiral transformers are developed in order to estimate the passive power efficiency of the coupling circuits and power combining transformers. A new area-efficient power-combining configuration is proposed to achieve a high output power per occupied area. A 60 GHz power amplifier is fabricated utilizing the new combining technique with a measured output power of 18.8 dBm. Second we propose a new circuit topology to enable the capability of dual-mode operation. Also, a new enhancement technique is utilized in order to improve the gain-bandwidth product of cascode gain stages. Fabricated in 65 nm technology, the 60 GHz power amplifier could achieve measured maximum power added efficiency of 17.2% while delivering 18.1 dBm output power. Finally, we explore the utilization of a new dual-mode technique in a distributed active transformer power amplifier. A new power amplifier circuit topology and a new DAT layout technique is proposed in order to improve the power added efficiency and output power simultaneously. Fabricated in 65nm CMOS technology, the maximum measured gain of the 60 GHz power amplifier is 22 dB within a wide 3dB bandwidth of 14 GHz. A maximum saturated output power of 19.7 dBm is measured in high-power mode while a high power added efficiency of 25% is achieved.
Author: Dixian Zhao
Publisher:
ISBN: 9783319188409
Category :
Languages : en
Pages :
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Book Description
This book focuses on the development of design techniques and methodologies for 60-GHz and E-band power amplifiers and transmitters at device, circuit and layout levels. The authors show the recent development of millimeter-wave design techniques, especially of power amplifiers and transmitters, and presents novel design concepts, such as "power transistor layout" and "4-way parallel-series power combiner", that can enhance the output power and efficiency of power amplifiers in a compact silicon area. Five state-of-the-art 60-GHz and E-band designs with measured results are demonstrated to prove the effectiveness of the design concepts and hands-on methodologies presented. This book serves as a valuable reference for circuit designers to develop millimeter-wave building blocks for future 5G applications.
Author: Jaco du Preez
Publisher: Springer
ISBN: 3319350684
Category : Technology & Engineering
Languages : en
Pages : 165
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Book Description
This book comprehensively reviews the state of the art in millimeter-wave antennas, traces important recent developments and provides information on a wide range of antenna configurations and applications. While fundamental theoretical aspects are discussed whenever necessary, the book primarily focuses on design principles and concepts, manufacture, measurement techniques, and practical results. Each of the various antenna types scalable to millimeter-wave dimensions is considered individually, with coverage of leaky-wave and surface-wave antennas, printed antennas, integrated antennas, and reflector and lens systems. The final two chapters address the subject from a systems perspective, providing an overview of supporting circuitry and examining in detail diverse millimeter-wave applications, including high-speed wireless communications, radio astronomy, and radar. The vast amount of information now available on millimeter-wave systems can be daunting for researchers and designers entering the field. This book offers readers essential guidance, helping them to gain a thorough understanding based on the most recent research findings and serving as a sound basis for informed decision-making.
Author: Jaco du Preez
Publisher: Springer
ISBN: 3319621661
Category : Technology & Engineering
Languages : en
Pages : 367
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Book Description
This book provides a detailed review of millimeter-wave power amplifiers, discussing design issues and performance limitations commonly encountered in light of the latest research. Power amplifiers, which are able to provide high levels of output power and linearity while being easily integrated with surrounding circuitry, are a crucial component in wireless microwave systems. The book is divided into three parts, the first of which introduces readers to mm-wave wireless systems and power amplifiers. In turn, the second focuses on design principles and EDA concepts, while the third discusses future trends in power amplifier research. The book provides essential information on mm-wave power amplifier theory, as well as the implementation options and technologies involved in their effective design, equipping researchers, circuit designers and practicing engineers to design, model, analyze, test and implement high-performance, spectrally clean and energy-efficient mm-wave systems.
Author: Thomas H. Lee
Publisher: Cambridge University Press
ISBN: 9780521835398
Category : Computers
Languages : en
Pages : 232
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Book Description
This book, first published in 2004, is an expanded and revised edition of Tom Lee's acclaimed RFIC text.
Author: Issa Elfergani
Publisher: Springer
ISBN: 3319639676
Category : Technology & Engineering
Languages : en
Pages : 335
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Book Description
This book highlights technology trends and challenges that trace the evolution of antenna design, starting from 3rd generation phones and moving towards the latest release of LTE-A. The authors explore how the simple monopole and whip antenna from the GSM years have evolved towards what we have today, an antenna design that is compact, multi-band in nature and caters to multiple elements on the same patch to provide high throughput connectivity. The scope of the book targets a broad range of subjects, including the microstrip antenna, PIFA antenna, and the monopole antenna to be used for different applications over three different mobile generations. Beyond that, the authors take a step into the future and look at antenna requirements for 5G communications, which already has the 5G drive in place with prominent scenarios and use-cases emerging. They examine these, and put in place the challenges that lie ahead for antenna design, particularly in mm-Wave design. The book provides a reference for practicing engineers and under/post graduate students working in this field.
Author: Duixian Liu
Publisher: John Wiley & Sons
ISBN: 1119556635
Category : Technology & Engineering
Languages : en
Pages : 416
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Book Description
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Author: Jaume Anguera
Publisher: Springer
ISBN: 9811073295
Category : Technology & Engineering
Languages : en
Pages : 892
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Book Description
The volume contains 94 best selected research papers presented at the Third International Conference on Micro Electronics, Electromagnetics and Telecommunications (ICMEET 2017) The conference was held during 09-10, September, 2017 at Department of Electronics and Communication Engineering, BVRIT Hyderabad College of Engineering for Women, Hyderabad, Telangana, India. The volume includes original and application based research papers on microelectronics, electromagnetics, telecommunications, wireless communications, signal/speech/video processing and embedded systems.
