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Author: R.A. Levy
Publisher: Springer Science & Business Media
ISBN: 1461305411
Category : Science
Languages : en
Pages : 444
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Book Description
As feature dimensions of integrated circuits shrink, the associated geometrical constraints on junction depth impose severe restrictions on the thermal budget for processing such devices. Furthermore, due to the relatively low melting point of the first aluminum metallization level, such restrictions extend to the fabrication of multilevel structures that are now essential in increasing packing density of interconnect lines. The fabrication of ultra large scale integrated (ULSI) devices under thermal budget restrictions requires the reassessment of existing and the development of new microelectronic materials and processes. This book addresses three broad but interrelated areas. The first area focuses on the subject of rapid thermal processing (RTP), a technology that allows minimization of processing time while relaxing the constraints on high temperature. Initially developed to limit dopant redistribution, current applications of RTP are shown here to encompass annealing, oxidation, nitridation, silicidation, glass reflow, and contact sintering. In a second but complementary area, advances in equipment design and performance of rapid thermal processing equipment are presented in conjunction with associated issues of temperature measurement and control. Defect mechanisms are assessed together with the resulting properties of rapidly deposited and processed films. The concept of RTP integration for a full CMOS device process is also examined together with its impact on device characteristics.
Author: R.A. Levy
Publisher: Springer Science & Business Media
ISBN: 1461305411
Category : Science
Languages : en
Pages : 444
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Book Description
As feature dimensions of integrated circuits shrink, the associated geometrical constraints on junction depth impose severe restrictions on the thermal budget for processing such devices. Furthermore, due to the relatively low melting point of the first aluminum metallization level, such restrictions extend to the fabrication of multilevel structures that are now essential in increasing packing density of interconnect lines. The fabrication of ultra large scale integrated (ULSI) devices under thermal budget restrictions requires the reassessment of existing and the development of new microelectronic materials and processes. This book addresses three broad but interrelated areas. The first area focuses on the subject of rapid thermal processing (RTP), a technology that allows minimization of processing time while relaxing the constraints on high temperature. Initially developed to limit dopant redistribution, current applications of RTP are shown here to encompass annealing, oxidation, nitridation, silicidation, glass reflow, and contact sintering. In a second but complementary area, advances in equipment design and performance of rapid thermal processing equipment are presented in conjunction with associated issues of temperature measurement and control. Defect mechanisms are assessed together with the resulting properties of rapidly deposited and processed films. The concept of RTP integration for a full CMOS device process is also examined together with its impact on device characteristics.
Author: Giovanni Campardo
Publisher: Springer Science & Business Media
ISBN: 3540265007
Category : Technology & Engineering
Languages : en
Pages : 596
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Book Description
The electronics and information technology revolution continues, but it is a critical time in the development of technology. Once again, we stand on the brink of a new era where emerging research will yield exciting applications and products destined to transform and enrich our daily lives! The potential is staggering and the ultimate impact is unimaginable, considering the continuing marriage of te- nology with fields such as medicine, communications and entertainment, to name only a few. But who will actually be responsible for transforming these potential new pr- ucts into reality? The answer, of course, is today’s (and tomorrow’s) design en- neers! The design of integrated circuits today remains an essential discipline in s- port of technological progress, and the authors of this book have taken a giant step forward in the development of a practice-oriented treatise for design engineers who are interested in the practical, industry-driven world of integrated circuit - sign.
Author: I.W. Boyd
Publisher: Elsevier
ISBN: 0444596801
Category : Technology & Engineering
Languages : en
Pages : 552
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Book Description
The contributions in this volume reflect not only the growing understanding of the underlying mechanisms controlling the various reactions in laser surface processing, but also the potential of several developing applications of direct processing. The most notable trend in the field currently is the technique of laser ablation, which is reported in almost a quarter of the papers in this volume. Whilst by no means a new phenomenon, attention has until recent years remained in the area of lithography and UV-sensitive materials. The growth in interest lies in the use of the technique to grow multi-component thin films and multi-layers. A number of papers on the topic of process diagnostics and in-situ measurements are also included. The theme of these annual meetings is centred around the physical and chemical modification of thin films and surfaces induced by the action of photon, ion, neutral, or electron beams in a variety of environments. Consequently these proceedings provide a comprehensive and unified presentation of the latest developments in this field.
Author: Kenneth A. Jackson
Publisher: John Wiley & Sons
ISBN: 3527604952
Category : Technology & Engineering
Languages : en
Pages : 424
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Book Description
The formation of solids is governed by kinetic processes, which are closely related to the macroscopic behaviour of the resulting materials. With the main focus on ease of understanding, the author begins with the basic processes at the atomic level to illustrate their connections to material properties. Diffusion processes during crystal growth and phase transformations are examined in detail. Since the underlying mathematics are very complex, approximation methods typically used in practice are the prime choice of approach. Apart from metals and alloys, the book places special emphasis on the growth of thin films and bulk crystals, which are the two main pillars of modern device and semiconductor technology. All the presented phenomena are tied back to the basic thermodynamic properties of the materials and to the underlying physical processes for clarity.
Author: Patrick Steglich
Publisher: BoD – Books on Demand
ISBN: 1839681888
Category : Science
Languages : en
Pages : 194
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Book Description
Optical and microwave waveguides have attracted much research interest in both science and industry. The number of potential applications for their use is growing rapidly. This book examines recent advances in the broad field of waveguide technology. It covers current progress and latest breakthroughs in emergent applications in photonics and microwave engineering. The book includes ten contributions on recent developments in waveguide technologies including theory, simulation, and fabrication of novel waveguide concepts as well as reviews on recent advances.
Author: Yoshio Nishi
Publisher: CRC Press
ISBN: 1351829823
Category : Technology & Engineering
Languages : en
Pages : 3276
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Book Description
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Author: F. Ren
Publisher: The Electrochemical Society
ISBN: 9781566771658
Category : Science
Languages : en
Pages : 364
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Book Description
Author: Y. Pauleau
Publisher: Springer Science & Business Media
ISBN: 9401100772
Category : Technology & Engineering
Languages : en
Pages : 652
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Book Description
Materials and Processes for Surface and Interface Engineering, which has been written by experts in the fields of deposition technology and surface modification techniques, offers up to date tutorial papers on the latest advances in surface and interface engineering. The emphasis is on fundamental aspects, principles and applications of plasma and ion beam processing technology. A handbook for the engineer and scientist as well as an introduction for students in several branches of materials science and surface engineering.
Author: Werner Kern
Publisher: Elsevier
ISBN: 0080524214
Category : Technology & Engineering
Languages : en
Pages : 881
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Book Description
This sequel to the 1978 classic, Thin Film Processes, gives a clear, practical exposition of important thin film deposition and etching processes that have not yet been adequately reviewed. It discusses selected processes in tutorial overviews with implementation guide lines and an introduction to the literature. Though edited to stand alone, when taken together, Thin Film Processes II and its predecessor present a thorough grounding in modern thin film techniques. - Provides an all-new sequel to the 1978 classic, Thin Film Processes - Introduces new topics, and several key topics presented in the original volume are updated - Emphasizes practical applications of major thin film deposition and etching processes - Helps readers find the appropriate technology for a particular application
Author:
Publisher:
ISBN:
Category : Rapid thermal processing
Languages : en
Pages : 914
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Book Description
