Author: Jimmie J. Wortman
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 472
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Rapid Thermal and Integrated Processing III: Volume 342
Author: Jimmie J. Wortman
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 472
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 472
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Rapid Thermal and Integrated Processing
Author:
Publisher:
ISBN:
Category : Rapid thermal processing
Languages : en
Pages : 416
Book Description
Publisher:
ISBN:
Category : Rapid thermal processing
Languages : en
Pages : 416
Book Description
Microwave Processing of Materials IV
Author: Magdy F. Iskander
Publisher:
ISBN:
Category : Materials
Languages : en
Pages : 784
Book Description
Publisher:
ISBN:
Category : Materials
Languages : en
Pages : 784
Book Description
Materials for Smart Systems: Volume 360
Author: Easo P. George
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 584
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 584
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Advanced Metallization for Devices and Circuits--science, Technology, and Manufacturability
Author: S. P. Murarka
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 794
Book Description
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 794
Book Description
Advances in Rapid Thermal and Integrated Processing
Author: F. Roozeboom
Publisher: Springer Science & Business Media
ISBN: 9401587116
Category : Science
Languages : en
Pages : 568
Book Description
Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.
Publisher: Springer Science & Business Media
ISBN: 9401587116
Category : Science
Languages : en
Pages : 568
Book Description
Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.
Scintillator and Phosphor Materials: Volume 348
Author: Marvin J. Weber
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 548
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 548
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Applications of Synchrotron Radiation Techniques to Materials Science II: Volume 375
Author: Louis J. Terminello
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 368
Book Description
Volume I in this series promised that the advent of third-generation light sources would enhance synchrotron-based materials research. This second volume fulfills the promise, featuring many experiments that required newer, higher-brightness sources, and could not have been performed with earlier vintage synchrotrons. The book focuses on the characterization of reduced dimensional systems, and highlights studies of surfaces, interfaces, polymers, glasses, thin films, magnetic materials, metal systems, multilayers and electronic materials. Topics include: thin films; magnetic materials; surfaces, clusters, quantum systems, and methods; interfaces (solid/solid, solid/liquid); layered compounds, alloys and novel materials; and microprobe, tomography and microscopy.
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 368
Book Description
Volume I in this series promised that the advent of third-generation light sources would enhance synchrotron-based materials research. This second volume fulfills the promise, featuring many experiments that required newer, higher-brightness sources, and could not have been performed with earlier vintage synchrotrons. The book focuses on the characterization of reduced dimensional systems, and highlights studies of surfaces, interfaces, polymers, glasses, thin films, magnetic materials, metal systems, multilayers and electronic materials. Topics include: thin films; magnetic materials; surfaces, clusters, quantum systems, and methods; interfaces (solid/solid, solid/liquid); layered compounds, alloys and novel materials; and microprobe, tomography and microscopy.
Microwave Processing of Materials
Author:
Publisher:
ISBN:
Category : Materials
Languages : en
Pages : 784
Book Description
Publisher:
ISBN:
Category : Materials
Languages : en
Pages : 784
Book Description
Silicon
Author: Paul Siffert
Publisher: Springer Science & Business Media
ISBN: 3662098970
Category : Technology & Engineering
Languages : en
Pages : 552
Book Description
With topics ranging from epitaxy through lattice defects and doping to quantum computation, this book provides a personalized survey of the development and use of silicon, the basis for the revolutionary changes in our lives sometimes called "The Silicon Age." Beginning with the very first developments more than 50 years ago, this reports on all aspects of silicon and silicon technology up to its use in exciting new technologies, including a glance at possible future developments.
Publisher: Springer Science & Business Media
ISBN: 3662098970
Category : Technology & Engineering
Languages : en
Pages : 552
Book Description
With topics ranging from epitaxy through lattice defects and doping to quantum computation, this book provides a personalized survey of the development and use of silicon, the basis for the revolutionary changes in our lives sometimes called "The Silicon Age." Beginning with the very first developments more than 50 years ago, this reports on all aspects of silicon and silicon technology up to its use in exciting new technologies, including a glance at possible future developments.