Advances in Rapid Thermal and Integrated Processing PDF Download
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Author: F. Roozeboom
Publisher: Springer Science & Business Media
ISBN: 9401587116
Category : Science
Languages : en
Pages : 568
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Book Description
Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.
Author: F. Roozeboom
Publisher: Springer Science & Business Media
ISBN: 9401587116
Category : Science
Languages : en
Pages : 568
Get Book Here
Book Description
Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.
Author:
Publisher:
ISBN:
Category : Rapid thermal processing
Languages : en
Pages : 914
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Book Description
Author: Materials Research Society
Publisher:
ISBN:
Category : Chemical vapor deposition
Languages : en
Pages : 432
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Book Description
Author: Jeffrey C. Gelpey
Publisher: Mrs Proceedings
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 448
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: William S. Levine
Publisher: CRC Press
ISBN: 1351838393
Category : Technology & Engineering
Languages : en
Pages : 356
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Book Description
Control technology permeates every aspect of our lives. We rely on them to perform a wide variety of tasks without giving much thought to the origins of the technology or how it became such an important part of our lives. Control System Applications covers the uses of control systems, both in the common and in the uncommon areas of our lives. From the everyday to the unusual, it's all here. From process control to human-in-the-loop control, this book provides illustrations and examples of how these systems are applied. Each chapter contains an introduction to the application, a section defining terms and references, and a section on further readings that help you understand and use the techniques in your work environment. Highly readable and comprehensive, Control System Applications explores the uses of control systems. It illustrates the diversity of control systems and provides examples of how the theory can be applied to specific practical problems. It contains information about aspec ts of control that are not fully captured by the theory, such as techniques for protecting against controller failure and the role of cost and complexity in specifying controller designs.
Author: Rajendra Singh
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 440
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Book Description
Author: Yoshio Nishi
Publisher: CRC Press
ISBN: 1351829823
Category : Technology & Engineering
Languages : en
Pages : 3276
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Book Description
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Author: Cor L. Claeys
Publisher: The Electrochemical Society
ISBN: 9781566772419
Category : Computers
Languages : en
Pages : 408
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Book Description
Author: Electrochemical Society. Meeting
Publisher: The Electrochemical Society
ISBN: 9781566773768
Category : Technology & Engineering
Languages : en
Pages : 620
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Book Description
Author: Richard B. Fair
Publisher: Academic Press
ISBN: 0323139809
Category : Technology & Engineering
Languages : en
Pages : 441
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Book Description
This is the first definitive book on rapid thermal processing (RTP), an essential namufacturing technology for single-wafer processing in highly controlled environments. Written and edited by nine experts in the field, this book covers a range of topics for academics and engineers alike, moving from basic theory to advanced technology for wafer manufacturing. The book also provides new information on the suitability or RTP for thin film deposition, junction formation, silicides, epitaxy, and in situ processing. Complete discussions on equipment designs and comparisons between RTP and other processing approaches also make this book useful for supplemental information on silicon processing, VLSI processing, and integrated circuit engineering.
