Process Engineering Analysis in Semiconductor Device Fabrication PDF Download
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Author: Stanley Middleman
Publisher: McGraw-Hill Companies
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 802
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Book Description
Written primarily for chemical engineering students, the material included in this new text is an extension of upper level chemical engineering courses. Covering a range of processes in semiconductor device fabrication, the authors try to present traditional chemical engineering methodology in a non-traditional context. The text covers such topics as crystal growth and filtration and contains over 300 worked examples and problems.
Author: Stanley Middleman
Publisher: McGraw-Hill Companies
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 802
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Book Description
Written primarily for chemical engineering students, the material included in this new text is an extension of upper level chemical engineering courses. Covering a range of processes in semiconductor device fabrication, the authors try to present traditional chemical engineering methodology in a non-traditional context. The text covers such topics as crystal growth and filtration and contains over 300 worked examples and problems.
Author: Stanley Middleman
Publisher:
ISBN: 9780070418547
Category : Semiconductors
Languages : en
Pages : 198
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Book Description
This solutions manual accompanies a text which covers a range of processes in semiconductor device fabrication. The authors try to present traditional chemical engineering methodology in a non-traditional context. The text covers topics such as crystal growth and filtration.
Author: Gary S. May
Publisher: John Wiley & Sons
ISBN: 0471790273
Category : Technology & Engineering
Languages : en
Pages : 428
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Book Description
A practical guide to semiconductor manufacturing from processcontrol to yield modeling and experimental design Fundamentals of Semiconductor Manufacturing and Process Controlcovers all issues involved in manufacturing microelectronic devicesand circuits, including fabrication sequences, process control,experimental design, process modeling, yield modeling, and CIM/CAMsystems. Readers are introduced to both the theory and practice ofall basic manufacturing concepts. Following an overview of manufacturing and technology, the textexplores process monitoring methods, including those that focus onproduct wafers and those that focus on the equipment used toproduce wafers. Next, the text sets forth some fundamentals ofstatistics and yield modeling, which set the foundation for adetailed discussion of how statistical process control is used toanalyze quality and improve yields. The discussion of statistical experimental design offers readers apowerful approach for systematically varying controllable processconditions and determining their impact on output parameters thatmeasure quality. The authors introduce process modeling concepts,including several advanced process control topics such asrun-by-run, supervisory control, and process and equipmentdiagnosis. Critical coverage includes the following: * Combines process control and semiconductor manufacturing * Unique treatment of system and software technology and managementof overall manufacturing systems * Chapters include case studies, sample problems, and suggestedexercises * Instructor support includes electronic copies of the figures andan instructor's manual Graduate-level students and industrial practitioners will benefitfrom the detailed exami?nation of how electronic materials andsupplies are converted into finished integrated circuits andelectronic products in a high-volume manufacturingenvironment. An Instructor's Manual presenting detailed solutions to all theproblems in the book is available from the Wiley editorialdepartment. An Instructor Support FTP site is also available.
Author: Sami Franssila
Publisher: John Wiley & Sons
ISBN: 1119991897
Category : Technology & Engineering
Languages : en
Pages : 534
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Book Description
This accessible text is now fully revised and updated, providing an overview of fabrication technologies and materials needed to realize modern microdevices. It demonstrates how common microfabrication principles can be applied in different applications, to create devices ranging from nanometer probe tips to meter scale solar cells, and a host of microelectronic, mechanical, optical and fluidic devices in between. Latest developments in wafer engineering, patterning, thin films, surface preparation and bonding are covered. This second edition includes: expanded sections on MEMS and microfluidics related fabrication issues new chapters on polymer and glass microprocessing, as well as serial processing techniques 200 completely new and 200 modified figures more coverage of imprinting techniques, process integration and economics of microfabrication 300 homework exercises including conceptual thinking assignments, order of magnitude estimates, standard calculations, and device design and process analysis problems solutions to homework problems on the complementary website, as well as PDF slides of the figures and tables within the book With clear sections separating basic principles from more advanced material, this is a valuable textbook for senior undergraduate and beginning graduate students wanting to understand the fundamentals of microfabrication. The book also serves as a handy desk reference for practicing electrical engineers, materials scientists, chemists and physicists alike. www.wiley.com/go/Franssila_Micro2e
Author: Linda F. Atherton
Publisher: Springer Science & Business Media
ISBN: 9780792396192
Category : Technology & Engineering
Languages : en
Pages : 498
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Book Description
This book is concerned with wafer fabrication and the factories that manufacture microprocessors and other integrated circuits. With the invention of the transistor in 1947, the world as we knew it changed. The transistor led to the microprocessor, and the microprocessor, the guts of the modern computer, has created an epoch of virtually unlimited information processing. The electronics and computer revolution has brought about, for better or worse, a new way of life. This revolution could not have occurred without wafer fabrication, and its associated processing technologies. A microprocessor is fabricated via a lengthy, highly-complex sequence of chemical processes. The success of modern chip manufacturing is a miracle of technology and a tribute to the hundreds of engineers who have contributed to its development. This book will delineate the magnitude of the accomplishment, and present methods to analyze and predict the performance of the factories that make the chips. The set of topics covered juxtaposes several disciplines of engineering. A primary subject is the chemical engineering aspects of the electronics industry, an industry typically thought to be strictly an electrical engineer's playground. The book also delves into issues of manufacturing, operations performance, economics, and the dynamics of material movement, topics often considered the domain of industrial engineering and operations research. Hopefully, we have provided in this work a comprehensive treatment of both the technology and the factories of wafer fabrication. Novel features of these factories include long process flows and a dominance of processing over operational issues.
Author: Jerzy Rużyłło
Publisher: The Electrochemical Society
ISBN: 9781566771887
Category : Technology & Engineering
Languages : en
Pages : 668
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Book Description
Author: BINAY K. DUTTA
Publisher: PHI Learning Pvt. Ltd.
ISBN: 8120329902
Category : Technology & Engineering
Languages : en
Pages : 957
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Book Description
This textbook is targetted to undergraduate students in chemical engineering, chemical technology, and biochemical engineering for courses in mass transfer, separation processes, transport processes, and unit operations. The principles of mass transfer, both diffusional and convective have been comprehensively discussed. The application of these principles to separation processes is explained. The more common separation processes used in the chemical industries are individually described in separate chapters. The book also provides a good understanding of the construction, the operating principles, and the selection criteria of separation equipment. Recent developments in equipment have been included as far as possible. The procedure of equipment design and sizing has been illustrated by simple examples. An overview of different applications and aspects of membrane separation has also been provided. ‘Humidification and water cooling’, necessary in every process indus-try, is also described. Finally, elementary principles of ‘unsteady state diffusion’ and mass transfer accompanied by a chemical reaction are covered. SALIENT FEATURES : • A balanced coverage of theoretical principles and applications. • Important recent developments in mass transfer equipment and practice are included. • A large number of solved problems of varying levels of complexities showing the applications of the theory are included. • Many end-chapter exercises. • Chapter-wise multiple choice questions. • An Instructors manual for the teachers.
Author: Zhenghao Gan
Publisher: McGraw Hill Professional
ISBN: 007175427X
Category : Technology & Engineering
Languages : en
Pages : 624
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Book Description
Proven processes for ensuring semiconductor device reliability Co-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide. Coverage includes: Basic device physics Process flow for MOS manufacturing Measurements useful for device reliability characterization Hot carrier injection Gate-oxide integrity (GOI) and time-dependent dielectric breakdown (TDDB) Negative bias temperature instability Plasma-induced damage Electrostatic discharge protection of integrated circuits Electromigration Stress migration Intermetal dielectric breakdown
Author: M O Manasreh
Publisher: CRC Press
ISBN: 9789056992644
Category : Technology & Engineering
Languages : en
Pages : 870
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Book Description
InP is a key semiconductor for the production of optoelectronic and photonic devices. Its related compounds, such as InGaAsP alloy, have been realized as very important materials for communication in the 1.3 and 1.55 micron spectral regions. Furthermore, the applications on InP and related compounds have extended to other areas that include laser diodes, light emitting diodes, photodetectors, waveguides, photocathodes, solar cells, and many other applications. The topics presented in this book have been chosen to achieve a balance between the properties of bulk materials, doping, characterization, applications, and devices. This unique volume, featuring chapters written by experts in the field, provides a good starting point for those who are new to the subject and contains detailed results and in depth discussions for those who are experts in the field.
Author: Manijeh Razeghi
Publisher: Springer Science & Business Media
ISBN: 0387287515
Category : Technology & Engineering
Languages : en
Pages : 894
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Book Description
Provides a multidisciplinary introduction to quantum mechanics, solid state physics, advanced devices, and fabrication Covers wide range of topics in the same style and in the same notation Most up to date developments in semiconductor physics and nano-engineering Mathematical derivations are carried through in detail with emphasis on clarity Timely application areas such as biophotonics , bioelectronics
