Proceedings of the Tutorial Symposium on Semiconductor Technology PDF Download
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Author: Daryl Ann Doane
Publisher:
ISBN:
Category : Electronics
Languages : en
Pages : 258
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Book Description
Author: Daryl Ann Doane
Publisher:
ISBN:
Category : Electronics
Languages : en
Pages : 258
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Book Description
Author: Electrochemical Society. Dielectrics and Insulation Division
Publisher: Pennington, NJ : Electrochemical Society
ISBN:
Category : Integrated circuits
Languages : en
Pages : 268
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Book Description
Author: Electrochemical Society. Electronics Division. Dielectrics and Insulation Division
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Author: D.A. Doane
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Author:
Publisher:
ISBN:
Category : Electron beams
Languages : en
Pages : 536
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Book Description
Author: R.M. Mehra
Publisher: Trans Tech Publications Ltd
ISBN: 3035706697
Category : Technology & Engineering
Languages : en
Pages : 260
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Book Description
The subject area of electronic devices has undergone a rapid expansion in recent years. New developments are continually accurring all over the world. Progress in the field of electronic devices is, however, dependent upon the production and characterization of device grade material. The science and technology of electronic materials has attracted somewhat less attention, as compared with device development.
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 260
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Book Description
The subject area of electronic devices has undergone a rapid expansion in recent years. New developments are continually accurring all over the world. Progress in the field of electronic devices is, however, dependent upon the production and characterization of device grade material. The science and technology of electronic materials has attracted somewhat less attention, as compared with device development. The present work closes this gap by concentrating on the materials science aspects of semiconductor technology. The main focus has been directed at low dimensional semiconductor structures, but the latest developments in the overall field of semiconductor materials have also been covered with regard to various topics, such as quantum wells, superlattices and nanostructures, materials for optical memories, sensors, laser induced crystallization and II-VI, III-V and IV-VI semiconductors.
Author: John N. Helbert
Publisher: Cambridge University Press
ISBN: 0080946801
Category : Technology & Engineering
Languages : en
Pages : 1026
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Book Description
This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatingsùincluding optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely coveredùincluding an entire chapter on resist process defectivity and the potential yield limiting effect on device production. Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.
Author: William B. Glendinning
Publisher: William Andrew
ISBN: 1437728227
Category : Technology & Engineering
Languages : en
Pages : 671
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Book Description
This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatings-- including optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely covered -- including an entire chapter on resist process defectivity and the potential yield limiting effect on device production. Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.
Author: National Research Council Canada
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 284
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Book Description
