Author: Madhav Datta
Publisher: The Electrochemical Society
ISBN: 9781566771719
Category : Science
Languages : en
Pages : 312
Book Description
Proceedings of the Symposium on Environmental Aspects of Electrochemical Technology: Applications in Electronics
Author: Madhav Datta
Publisher: The Electrochemical Society
ISBN: 9781566771719
Category : Science
Languages : en
Pages : 312
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566771719
Category : Science
Languages : en
Pages : 312
Book Description
The Cumulative Book Index
Author:
Publisher:
ISBN:
Category : American literature
Languages : en
Pages : 2348
Book Description
A world list of books in the English language.
Publisher:
ISBN:
Category : American literature
Languages : en
Pages : 2348
Book Description
A world list of books in the English language.
Microelectronic Packaging
Author: M. Datta
Publisher: CRC Press
ISBN: 020347368X
Category : Technology & Engineering
Languages : en
Pages : 564
Book Description
Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.
Publisher: CRC Press
ISBN: 020347368X
Category : Technology & Engineering
Languages : en
Pages : 564
Book Description
Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.
Index of Conference Proceedings
Author: British Library. Document Supply Centre
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 696
Book Description
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 696
Book Description
Energy Research Abstracts
Author:
Publisher:
ISBN:
Category : Power resources
Languages : en
Pages : 1744
Book Description
Publisher:
ISBN:
Category : Power resources
Languages : en
Pages : 1744
Book Description
Monthly Catalogue, United States Public Documents
Author:
Publisher:
ISBN:
Category : Government publications
Languages : en
Pages : 1100
Book Description
Publisher:
ISBN:
Category : Government publications
Languages : en
Pages : 1100
Book Description
ERDA Energy Research Abstracts
Author: United States. Energy Research and Development Administration
Publisher:
ISBN:
Category : Medicine
Languages : en
Pages : 852
Book Description
Publisher:
ISBN:
Category : Medicine
Languages : en
Pages : 852
Book Description
Monthly Catalog of United States Government Publications
Author:
Publisher:
ISBN:
Category : Government publications
Languages : en
Pages :
Book Description
Publisher:
ISBN:
Category : Government publications
Languages : en
Pages :
Book Description
NASA SP-7500
Author: United States. National Aeronautics and Space Administration
Publisher:
ISBN:
Category :
Languages : en
Pages : 596
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 596
Book Description
Electrical Contacts
Author: Milenko Braunovic
Publisher: CRC Press
ISBN: 1351838083
Category : Technology & Engineering
Languages : en
Pages : 640
Book Description
Various factors affect the performance of electrical contacts, including tribological, mechanical, electrical, and materials aspects. Although these behaviors have been studied for many years, they are not widely used or understood in practice. Combining approaches used across the globe, Electrical Contacts: Fundamentals, Applications, and Technology integrates advances in research and development in the tribological, material, and analytical aspects of electrical contacts with new data on electrical current transfer at the micro- and nanoscales. Taking an application-oriented approach, the authors illustrate how material characteristics, tribological behavior, and loading impact the degradation of contacts, formation of intermetallics, and overall reliability and performance. Coverage is divided broadly into three sections, with the first focused on mechanics, tribology, materials, current and heat transfer, and basic reliability issues of electrical contacts. The next section explores applications, such as power connections, electronic connections, and sliding contacts, while the final section presents the diagnostic and monitoring techniques used to investigate and measure phenomena occurring at electrical contact interfaces. Numerous references to current literature reflect the fact that this book is the most comprehensive survey in the field. Explore an impressive collection of data, theory, and practical applications in Electrical Contacts: Fundamentals, Applications, and Technology, a critical tool for anyone investigating or designing electrical equipment with improved performance and reliability in mind.
Publisher: CRC Press
ISBN: 1351838083
Category : Technology & Engineering
Languages : en
Pages : 640
Book Description
Various factors affect the performance of electrical contacts, including tribological, mechanical, electrical, and materials aspects. Although these behaviors have been studied for many years, they are not widely used or understood in practice. Combining approaches used across the globe, Electrical Contacts: Fundamentals, Applications, and Technology integrates advances in research and development in the tribological, material, and analytical aspects of electrical contacts with new data on electrical current transfer at the micro- and nanoscales. Taking an application-oriented approach, the authors illustrate how material characteristics, tribological behavior, and loading impact the degradation of contacts, formation of intermetallics, and overall reliability and performance. Coverage is divided broadly into three sections, with the first focused on mechanics, tribology, materials, current and heat transfer, and basic reliability issues of electrical contacts. The next section explores applications, such as power connections, electronic connections, and sliding contacts, while the final section presents the diagnostic and monitoring techniques used to investigate and measure phenomena occurring at electrical contact interfaces. Numerous references to current literature reflect the fact that this book is the most comprehensive survey in the field. Explore an impressive collection of data, theory, and practical applications in Electrical Contacts: Fundamentals, Applications, and Technology, a critical tool for anyone investigating or designing electrical equipment with improved performance and reliability in mind.