Author: Harzara S. Rathore
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 516
Book Description
Proceedings of the Symposia on Reliability of Semiconductor Devices and Interconnection and Multilevel Metallization, Interconnection, and Contact Technologies
Author: Harzara S. Rathore
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 516
Book Description
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 516
Book Description
Proceedings of the Symposia on Reliability of Semiconductor Devices/interconnections and Dielectric Breakdown, and Laser Process for Microelectronic Applications
Author: Electrochemical Society. Dielectric Science and Technology Division
Publisher: The Electrochemical Society
ISBN: 9781566770033
Category : Technology & Engineering
Languages : en
Pages : 346
Book Description
Papers in this volume are from the 180th ECS Meeting, held in held in Phoenix, Arizona, Fall 1991. This symposium addresses all aspects of reliability of semiconductor devices, multilevel interconnection and dielectric breakdown in VLSI and ULSI technologies. The symposium establishes reliability from design through manufacturing. The second part of the symposium addresses laser ablation/etching, laser planarization laser/UV. CVD of metal end dielectric films, laser/UV enhanced etching and deposition processesing liquid phase, and photomodification of surfaces.
Publisher: The Electrochemical Society
ISBN: 9781566770033
Category : Technology & Engineering
Languages : en
Pages : 346
Book Description
Papers in this volume are from the 180th ECS Meeting, held in held in Phoenix, Arizona, Fall 1991. This symposium addresses all aspects of reliability of semiconductor devices, multilevel interconnection and dielectric breakdown in VLSI and ULSI technologies. The symposium establishes reliability from design through manufacturing. The second part of the symposium addresses laser ablation/etching, laser planarization laser/UV. CVD of metal end dielectric films, laser/UV enhanced etching and deposition processesing liquid phase, and photomodification of surfaces.
Proceedings of the Symposia on Interconnects, Contact Metallization, and Multilevel Metallization and Reliability for Semiconductor Devices, Interconnects, and Thin Insulator Materials
Author: T. O. Herndon
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 520
Book Description
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 520
Book Description
Handbook of Semiconductor Manufacturing Technology
Author: Yoshio Nishi
Publisher: CRC Press
ISBN: 9780824787837
Category : Technology & Engineering
Languages : en
Pages : 1186
Book Description
The Handbook of Semiconductor Manufacturing Technology describes the individual processes and manufacturing control, support, and infrastructure technologies of silicon-based integrated-circuit manufacturing, many of which are also applicable for building devices on other semiconductor substrates. Discussing ion implantation, rapid thermal processing, photomask fabrication, chip testing, and plasma etching, the editors explore current and anticipated equipment, devices, materials, and practices of silicon-based manufacturing. The book includes a foreword by Jack S. Kilby, cowinner of the Nobel Prize in Physics 2000 "for his part in the invention of the integrated circuit."
Publisher: CRC Press
ISBN: 9780824787837
Category : Technology & Engineering
Languages : en
Pages : 1186
Book Description
The Handbook of Semiconductor Manufacturing Technology describes the individual processes and manufacturing control, support, and infrastructure technologies of silicon-based integrated-circuit manufacturing, many of which are also applicable for building devices on other semiconductor substrates. Discussing ion implantation, rapid thermal processing, photomask fabrication, chip testing, and plasma etching, the editors explore current and anticipated equipment, devices, materials, and practices of silicon-based manufacturing. The book includes a foreword by Jack S. Kilby, cowinner of the Nobel Prize in Physics 2000 "for his part in the invention of the integrated circuit."
Materials Reliability in Microelectronics II: Volume 265
Author: C. V. Thompson
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 352
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 352
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Proceedings of the Symposium on Interconnect and Contact Metallization
Author: Harzara S. Rathore
Publisher: The Electrochemical Society
ISBN: 9781566771849
Category : Computers
Languages : en
Pages : 292
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566771849
Category : Computers
Languages : en
Pages : 292
Book Description
Cumulative Book Index
Author:
Publisher:
ISBN:
Category : American literature
Languages : en
Pages : 2280
Book Description
A world list of books in the English language.
Publisher:
ISBN:
Category : American literature
Languages : en
Pages : 2280
Book Description
A world list of books in the English language.
Handbook of Electronic Package Design
Author: Michael Pecht
Publisher: CRC Press
ISBN: 1351838415
Category : Technology & Engineering
Languages : en
Pages : 904
Book Description
Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Publisher: CRC Press
ISBN: 1351838415
Category : Technology & Engineering
Languages : en
Pages : 904
Book Description
Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Index of Conference Proceedings
Author: British Library. Document Supply Centre
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 836
Book Description
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 836
Book Description
Electromigration and Electronic Device Degradation
Author: A. Christou
Publisher: Wiley-Interscience
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 370
Book Description
Addresses electromigration failure modes in electronics covering both theory and experiments. Reviews silicon and GaAs technologies. Various rate controlling details are summarized including an investigation of temperature dependence. Concludes with a discussion regarding current status and future plans for electromigration resistant advanced metallization systems for VLSI.
Publisher: Wiley-Interscience
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 370
Book Description
Addresses electromigration failure modes in electronics covering both theory and experiments. Reviews silicon and GaAs technologies. Various rate controlling details are summarized including an investigation of temperature dependence. Concludes with a discussion regarding current status and future plans for electromigration resistant advanced metallization systems for VLSI.