Author: Robert Leon Opila
Publisher: The Electrochemical Society
ISBN: 9781566772013
Category : Science
Languages : en
Pages : 290
Book Description
Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing
Author: Robert Leon Opila
Publisher: The Electrochemical Society
ISBN: 9781566772013
Category : Science
Languages : en
Pages : 290
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566772013
Category : Science
Languages : en
Pages : 290
Book Description
Cumulated Index to the Books
Author:
Publisher:
ISBN:
Category : American literature
Languages : en
Pages : 1134
Book Description
Publisher:
ISBN:
Category : American literature
Languages : en
Pages : 1134
Book Description
American Book Publishing Record
Author:
Publisher:
ISBN:
Category : Books
Languages : en
Pages : 734
Book Description
Publisher:
ISBN:
Category : Books
Languages : en
Pages : 734
Book Description
Grinding And Lapping
Author: Oskar Kylin
Publisher: Legare Street Press
ISBN: 9781020957062
Category :
Languages : en
Pages : 0
Book Description
This book is a comprehensive guide to grinding and lapping techniques. It covers everything from basic concepts to advanced tips and tricks, making it an essential resource for professionals and hobbyists alike. This work has been selected by scholars as being culturally important, and is part of the knowledge base of civilization as we know it. This work is in the "public domain in the United States of America, and possibly other nations. Within the United States, you may freely copy and distribute this work, as no entity (individual or corporate) has a copyright on the body of the work. Scholars believe, and we concur, that this work is important enough to be preserved, reproduced, and made generally available to the public. We appreciate your support of the preservation process, and thank you for being an important part of keeping this knowledge alive and relevant.
Publisher: Legare Street Press
ISBN: 9781020957062
Category :
Languages : en
Pages : 0
Book Description
This book is a comprehensive guide to grinding and lapping techniques. It covers everything from basic concepts to advanced tips and tricks, making it an essential resource for professionals and hobbyists alike. This work has been selected by scholars as being culturally important, and is part of the knowledge base of civilization as we know it. This work is in the "public domain in the United States of America, and possibly other nations. Within the United States, you may freely copy and distribute this work, as no entity (individual or corporate) has a copyright on the body of the work. Scholars believe, and we concur, that this work is important enough to be preserved, reproduced, and made generally available to the public. We appreciate your support of the preservation process, and thank you for being an important part of keeping this knowledge alive and relevant.
Chemical Mechanical Planarization in IC Device Manufacturing III
Author: Robert Leon Opila
Publisher: The Electrochemical Society
ISBN: 9781566772600
Category : Technology & Engineering
Languages : en
Pages : 664
Book Description
This volume contains the proceedings of the third international symposium on Chemical Mechanical Planarization integrated circuit device manufacturing held at the 196th Meeting of the Electrochemical Society in Honolulu, Hawaii. ( October 20 -22 1999).
Publisher: The Electrochemical Society
ISBN: 9781566772600
Category : Technology & Engineering
Languages : en
Pages : 664
Book Description
This volume contains the proceedings of the third international symposium on Chemical Mechanical Planarization integrated circuit device manufacturing held at the 196th Meeting of the Electrochemical Society in Honolulu, Hawaii. ( October 20 -22 1999).
Chemical Mechanical Planarization VI
Author: Sudipta Seal
Publisher: The Electrochemical Society
ISBN: 9781566774048
Category : Technology & Engineering
Languages : en
Pages : 370
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566774048
Category : Technology & Engineering
Languages : en
Pages : 370
Book Description
Chemical Mechanical Planarization IV
Author: R. L. Opila
Publisher: The Electrochemical Society
ISBN: 9781566772938
Category : Technology & Engineering
Languages : en
Pages : 350
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566772938
Category : Technology & Engineering
Languages : en
Pages : 350
Book Description
Proceedings of the Fifth Symposium on Automated Integrated Circuits Manufacturing
Author: Vaughn E. Akins
Publisher:
ISBN:
Category : Electronic industries
Languages : en
Pages : 302
Book Description
Publisher:
ISBN:
Category : Electronic industries
Languages : en
Pages : 302
Book Description
Proceedings of the Second International Symposium on Ultra-Clean Processing of Silicon Surfaces
Author: Marc Heyns
Publisher:
ISBN:
Category : Contamination control
Languages : en
Pages : 388
Book Description
Publisher:
ISBN:
Category : Contamination control
Languages : en
Pages : 388
Book Description
16th European Symposium on Computer Aided Process Engineering and 9th International Symposium on Process Systems Engineering
Author: Wolfgang Marquardt
Publisher: Elsevier
ISBN: 0080525806
Category : Science
Languages : en
Pages : 1127
Book Description
This proceedings book contains the papers presented at the joint conference event of the 9th Symposium on Process Systems Engineering (PSE'2006) and the 16th European Symposium on Computer Aided Process Engineering (ESCAPE-16), held in Garmisch-Partenkirchen, Germany, from July 9 – July 13, 2006. The symposium follows the first joint event PSE'97 / ESCAPE-7 in Trondheim, Norway (1997). The last two venues of the ESCAPE symposia were Barcelona, Spain (2005) and Lisbon, Portugal (2004) and the most recent PSE symposia were held in Kunming, China (2003) and Keystone, Colorado, USA (2000). The purpose of both series is to bring together the international community of researchers engineers who are interested in computing-based methods in process engineering. The main objective of the symposium is to review and present the latest developments and current state in Process Systems Engineering and Computer Aided Process Engineering. The focus of PSE'2006 / ESCAPE-16 has been on Modelling and Numerical Methods, Product and Process Design, Operations and Control, Biological Systems, Infrastructure Systems, and Business decision support.* reviews and presents the latest developments and current state of Process Systems Engineering and Computer Aided Process Engineering * contains papers presented at a joint conference event * bringing together an international community of researchers and engineers interested in computing-based methods in Process Engineering
Publisher: Elsevier
ISBN: 0080525806
Category : Science
Languages : en
Pages : 1127
Book Description
This proceedings book contains the papers presented at the joint conference event of the 9th Symposium on Process Systems Engineering (PSE'2006) and the 16th European Symposium on Computer Aided Process Engineering (ESCAPE-16), held in Garmisch-Partenkirchen, Germany, from July 9 – July 13, 2006. The symposium follows the first joint event PSE'97 / ESCAPE-7 in Trondheim, Norway (1997). The last two venues of the ESCAPE symposia were Barcelona, Spain (2005) and Lisbon, Portugal (2004) and the most recent PSE symposia were held in Kunming, China (2003) and Keystone, Colorado, USA (2000). The purpose of both series is to bring together the international community of researchers engineers who are interested in computing-based methods in process engineering. The main objective of the symposium is to review and present the latest developments and current state in Process Systems Engineering and Computer Aided Process Engineering. The focus of PSE'2006 / ESCAPE-16 has been on Modelling and Numerical Methods, Product and Process Design, Operations and Control, Biological Systems, Infrastructure Systems, and Business decision support.* reviews and presents the latest developments and current state of Process Systems Engineering and Computer Aided Process Engineering * contains papers presented at a joint conference event * bringing together an international community of researchers and engineers interested in computing-based methods in Process Engineering