Proceedings of the 1987 International Symposium on Microelectronics, September 28-30, 1987, Minneapolis Auditorium and Convention Center, Minneapolis, Minnesota PDF Download
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Author: International Society for Hybrid Microelectronics
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 746
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Book Description
Author: International Society for Hybrid Microelectronics
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 746
Get Book Here
Book Description
Author: International Society for Hybrid Microelectronics
Publisher:
ISBN:
Category :
Languages : en
Pages : 718
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Book Description
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Author:
Publisher:
ISBN: 9780930815196
Category :
Languages : en
Pages :
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Author:
Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 592
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Book Description
Author: International Society for Hybrid Microelectronics
Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 708
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Book Description
Author: International Symposium on Microelectronics
Publisher:
ISBN: 9780930815448
Category : Microelectronics
Languages : en
Pages : 584
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Author:
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 588
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Author: John H. Lau
Publisher: Springer Nature
ISBN: 9811613761
Category : Technology & Engineering
Languages : en
Pages : 513
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Book Description
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Author:
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 1722
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Book Description
