Author:
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 748
Book Description
Proceedings of the ... International Symposium on Microelectronics
Author:
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 748
Book Description
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 748
Book Description
1995 International Symposium on Microelectronics
Author: International Symposium on Microelectronics
Publisher:
ISBN: 9780930815448
Category : Microelectronics
Languages : en
Pages : 584
Book Description
Publisher:
ISBN: 9780930815448
Category : Microelectronics
Languages : en
Pages : 584
Book Description
Proceedings of the 1989 International Symposium on Microelectronics, October 24-26, 1989, Baltimore Convention Center
Author: International Society for Hybrid Microelectronics
Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 708
Book Description
Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 708
Book Description
Proceedings of the 1992 International Symposium on Microelectronics, October 19-21, 1992, Moscone Center, San Francisco, California
Author: International Society for Hybrid Microelectronics
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 776
Book Description
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 776
Book Description
1995 International Symposium on Microelectronics
Author:
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 588
Book Description
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 588
Book Description
2000 International Symposium on Microelectronics
Author:
Publisher:
ISBN:
Category : Electronic ceramics
Languages : en
Pages : 916
Book Description
This text constitutes proceedings from the International Symposium on Microelectronics that took place in Boston, Massachusetts in September, 2000.
Publisher:
ISBN:
Category : Electronic ceramics
Languages : en
Pages : 916
Book Description
This text constitutes proceedings from the International Symposium on Microelectronics that took place in Boston, Massachusetts in September, 2000.
2003 International Symposium on Microelectronics
Author:
Publisher:
ISBN:
Category : Electronic ceramics
Languages : en
Pages : 1046
Book Description
Publisher:
ISBN:
Category : Electronic ceramics
Languages : en
Pages : 1046
Book Description
Proceedings of the Technical Conference
Author:
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages : 754
Book Description
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages : 754
Book Description
Electronic Materials Handbook
Author:
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Mems/Nems
Author: Cornelius T. Leondes
Publisher: Springer Science & Business Media
ISBN: 0387257861
Category : Technology & Engineering
Languages : en
Pages : 2142
Book Description
This significant and uniquely comprehensive five-volume reference is a valuable source for research workers, practitioners, computer scientists, students, and technologists. It covers all of the major topics within the subject and offers a comprehensive treatment of MEMS design, fabrication techniques, and manufacturing methods. It also includes current medical applications of MEMS technology and provides applications of MEMS to opto-electronic devices. It is clearly written, self-contained, and accessible, with helpful standard features including an introduction, summary, extensive figures and design examples with comprehensive reference lists.
Publisher: Springer Science & Business Media
ISBN: 0387257861
Category : Technology & Engineering
Languages : en
Pages : 2142
Book Description
This significant and uniquely comprehensive five-volume reference is a valuable source for research workers, practitioners, computer scientists, students, and technologists. It covers all of the major topics within the subject and offers a comprehensive treatment of MEMS design, fabrication techniques, and manufacturing methods. It also includes current medical applications of MEMS technology and provides applications of MEMS to opto-electronic devices. It is clearly written, self-contained, and accessible, with helpful standard features including an introduction, summary, extensive figures and design examples with comprehensive reference lists.