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Author:
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 748
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Book Description
Author:
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 748
Get Book Here
Book Description
Author: International Symposium on Microelectronics
Publisher:
ISBN: 9780930815448
Category : Microelectronics
Languages : en
Pages : 584
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Book Description
Author: International Society for Hybrid Microelectronics
Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 708
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Book Description
Author: International Society for Hybrid Microelectronics
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 776
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Book Description
Author:
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 588
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Book Description
Author:
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ISBN:
Category : Electronic ceramics
Languages : en
Pages : 916
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Book Description
This text constitutes proceedings from the International Symposium on Microelectronics that took place in Boston, Massachusetts in September, 2000.
Author:
Publisher:
ISBN:
Category : Electronic ceramics
Languages : en
Pages : 1046
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Book Description
Author:
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ISBN:
Category : Electronic packaging
Languages : en
Pages : 754
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Author:
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
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Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author: Cornelius T. Leondes
Publisher: Springer Science & Business Media
ISBN: 0387257861
Category : Technology & Engineering
Languages : en
Pages : 2142
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Book Description
This significant and uniquely comprehensive five-volume reference is a valuable source for research workers, practitioners, computer scientists, students, and technologists. It covers all of the major topics within the subject and offers a comprehensive treatment of MEMS design, fabrication techniques, and manufacturing methods. It also includes current medical applications of MEMS technology and provides applications of MEMS to opto-electronic devices. It is clearly written, self-contained, and accessible, with helpful standard features including an introduction, summary, extensive figures and design examples with comprehensive reference lists.
