Proceedings of the 4th International Symposium on Electronic Materials and Packaging PDF Download
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Author:
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages :
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Book Description
Author:
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages :
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Book Description
Author:
Publisher:
ISBN: 9780780376823
Category : Electronic packaging
Languages : en
Pages : 498
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Book Description
Author: Lubomyr Taras Romankiw
Publisher: The Electrochemical Society
ISBN: 9781566771139
Category : Computers
Languages : en
Pages : 820
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Book Description
Author: Suhaiza Hanim Binti Dato Mohamad Zailani
Publisher: Springer Nature
ISBN: 9464632569
Category : Technology & Engineering
Languages : en
Pages : 1820
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Book Description
This is an open access book.Management science aims to study the dynamic study of human use of limited resources in management activities to achieve organizational goals: complex and innovative social behavior and its laws. And engineering management refers to the management of important and complex new products, equipment and devices in the process of development, manufacturing and production, and also includes the study and management of technological innovation, technological transformation, transformation, transformation, layout and strategy of industrial engineering technology development. The development or breakthrough of management theory is accompanied by the development and progress of science and technology, and the level of science and technology and the level of management theory in each historical period are mutually adaptive, and it can be said that the progress of science and technology plays an important role in promoting the development of management. At the same time, the rapid development and progress of science and technology give a strong injection to the development of engineering, and provide the possibility for engineering construction can use new technology, new equipment, new technology and new materials. Modern management is an important development direction of management science nowadays. And the use of modern management in engineering has an important role in saving social costs, ensuring project quality, and improving safety awareness and behavior. ICMSEM 2023 will focus on modern management, discuss about the benefits that modernization brings to engineering. ICMSEM 2023 aims to: Develop and advance management science through the study and application of certain issues. Open up new perspectives in the sharing of speakers and inspire the audience to new ways of managing in engineering. Create a forum for sharing, research and exchange at the international level, so that the participants can be informed of the latest research directions, results and contents of management science, which will inspire them to new ideas for research and practice.
Author: Electronic Device Failure Analysis Society
Publisher: ASM International
ISBN: 1615030891
Category : Technology & Engineering
Languages : en
Pages : 524
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Author: Daniel Lu
Publisher: Springer
ISBN: 3319450980
Category : Technology & Engineering
Languages : en
Pages : 974
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Book Description
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author:
Publisher: IEEE
ISBN: 9780780347953
Category : Technology & Engineering
Languages : en
Pages : 300
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Book Description
This collection of papers from the symposium discusses electrical design, analysis and characterization of electronic interconnections and packaging structures for performance-driven, high-speed/high complexity electronic systems.
Author:
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 498
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Book Description
Topics covered by this title include: flip chip running; solder join reliability; emerging technologies; solder materials; delimitation; polymers for packaging; design and process; modelling and testing; material characterization; and package reliability.
Author: James E. Morris
Publisher: Springer Science & Business Media
ISBN: 0387473262
Category : Technology & Engineering
Languages : en
Pages : 553
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Book Description
This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Author: British Library. Document Supply Centre
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 870
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Book Description
