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Author: Karl J. Puttlitz
Publisher: Springer Science & Business Media
ISBN: 1461513898
Category : Technology & Engineering
Languages : en
Pages : 1250
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Book Description
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
Author: Karl J. Puttlitz
Publisher: Springer Science & Business Media
ISBN: 1461513898
Category : Technology & Engineering
Languages : en
Pages : 1250
Get Book Here
Book Description
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 974
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Book Description
Author:
Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 920
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Book Description
Author: R. Niegel Horspool
Publisher: Springer
ISBN: 3540459375
Category : Computers
Languages : en
Pages : 356
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Book Description
ETAPS 2002 was the ?fth instance of the European Joint Conferences on Theory and Practice of Software. ETAPS is an annual federated conference that was established in 1998by combining a number of existing and new conferences. This year it comprised 5 conferences (FOSSACS, FASE, ESOP, CC, TACAS), 13 satellite workshops (ACL2, AGT, CMCS, COCV, DCC, INT, LDTA, SC, SFEDL, SLAP, SPIN, TPTS, and VISS), 8invited lectures (not including those speci?c to the satellite events), and several tutorials. The events that comprise ETAPS address various aspects of the system - velopment process, including speci?cation, design, implementation, analysis, and improvement. The languages, methodologies, and tools which support these - tivities are all well within its scope. Di?erent blends of theory and practice are represented, with an inclination towards theory with a practical motivation on one hand and soundly-based practice on the other. Many of the issues involved in software design apply to systems in general, including hardware systems, and the emphasis on software is not intended to be exclusive.
Author:
Publisher: Information Gatekeepers Inc
ISBN:
Category :
Languages : en
Pages : 80
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Book Description
Author: David Jonassen
Publisher: Routledge
ISBN: 1135637369
Category : Education
Languages : en
Pages : 1195
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Book Description
First Published in 2008. Routledge is an imprint of Taylor & Francis, an informa company.
Author: Marc J. Madou
Publisher: CRC Press
ISBN: 1482274663
Category : Technology & Engineering
Languages : en
Pages : 1983
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Book Description
Now in its third edition, Fundamentals of Microfabrication and Nanotechnology continues to provide the most complete MEMS coverage available. Thoroughly revised and updated the new edition of this perennial bestseller has been expanded to three volumes, reflecting the substantial growth of this field. It includes a wealth of theoretical and practical information on nanotechnology and NEMS and offers background and comprehensive information on materials, processes, and manufacturing options. The first volume offers a rigorous theoretical treatment of micro- and nanosciences, and includes sections on solid-state physics, quantum mechanics, crystallography, and fluidics. The second volume presents a very large set of manufacturing techniques for micro- and nanofabrication and covers different forms of lithography, material removal processes, and additive technologies. The third volume focuses on manufacturing techniques and applications of Bio-MEMS and Bio-NEMS. Illustrated in color throughout, this seminal work is a cogent instructional text, providing classroom and self-learners with worked-out examples and end-of-chapter problems. The author characterizes and defines major research areas and illustrates them with examples pulled from the most recent literature and from his own work.
Author: Marc J. Madou
Publisher: CRC Press
ISBN: 142005516X
Category : Technology & Engineering
Languages : en
Pages : 652
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Book Description
From MEMS to Bio-MEMS and Bio-NEMS: Manufacturing Techniques and Applications details manufacturing techniques applicable to bionanotechnology. After reviewing MEMS techniques, materials, and modeling, the author covers nanofabrication, genetically engineered proteins, artificial cells, nanochemistry, and self-assembly. He also discusses scaling laws in MEMS and NEMS, actuators, fluidics, and power and brains in miniature devices. He concludes with coverage of various MEMS and NEMS applications. Fully illustrated in color, the text contains end-of-chapter problems, worked examples, extensive references for further reading, and an extensive glossary of terms. Details the Nanotechnology, Biology, and Manufacturing Techniques Applicable to Bionanotechnology Topics include: Nonlithography manufacturing techniques with lithography-based methods Nature as an engineering guide and contrasts top-down and bottom-up approaches Packaging, assembly, and self-assembly from ICs to DNA and biological cells Selected new MEMS and NEMS processes and materials, metrology techniques, and modeling Scaling laws, actuators, power generation, and the implementation of brains in miniaturizes devices Different strategies for making micromachines smarter The transition out of the laboratory and into the marketplace The third volume in Fundamentals of Microfabrication and Nanotechnology, Third Edition, Three-Volume Set, the book discusses top-down and bottom-up manufacturing methods and explains how to use nature as a guide. It provides a better understanding of how to match different manufacturing options with a given application that students can use to identify additional killer MEMS and NEMS applications. Other volumes in the set include: Solid-State Physics, Fluidics, and Analytical Techniques in Micro- and Nanotechnology Manufacturing Techniques for Microfabrication and Nanotechnology
Author: Ephraim Suhir
Publisher: Springer Science & Business Media
ISBN: 0387329897
Category : Technology & Engineering
Languages : en
Pages : 1471
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Book Description
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Author: John R. Koza
Publisher: Morgan Kaufmann
ISBN: 9781558605435
Category : Computers
Languages : en
Pages : 1516
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Book Description
Genetic programming (GP) is a method for getting a computer to solve a problem by telling it what needs to be done instead of how to do it. Koza, Bennett, Andre, and Keane present genetically evolved solutions to dozens of problems of design, control, classification, system identification, and computational molecular biology. Among the solutions are 14 results competitive with human-produced results, including 10 rediscoveries of previously patented inventions.
