Author: Ronald L. Ferrari
Publisher:
ISBN:
Category : Electronics
Languages : en
Pages : 492
Book Description
Problems in Physical Electronics
Author: Ronald L. Ferrari
Publisher:
ISBN:
Category : Electronics
Languages : en
Pages : 492
Book Description
Publisher:
ISBN:
Category : Electronics
Languages : en
Pages : 492
Book Description
Semiconductor Physical Electronics
Author: Sheng S. Li
Publisher: Springer Science & Business Media
ISBN: 146130489X
Category : Science
Languages : en
Pages : 514
Book Description
The purpose of this book is to provide the reader with a self-contained treatment of fundamen tal solid state and semiconductor device physics. The material presented in the text is based upon the lecture notes of a one-year graduate course sequence taught by this author for many years in the ·Department of Electrical Engineering of the University of Florida. It is intended as an introductory textbook for graduate students in electrical engineering. However, many students from other disciplines and backgrounds such as chemical engineering, materials science, and physics have also taken this course sequence, and will be interested in the material presented herein. This book may also serve as a general reference for device engineers in the semiconductor industry. The present volume covers a wide variety of topics on basic solid state physics and physical principles of various semiconductor devices. The main subjects covered include crystal structures, lattice dynamics, semiconductor statistics, energy band theory, excess carrier phenomena and recombination mechanisms, carrier transport and scattering mechanisms, optical properties, photoelectric effects, metal-semiconductor devices, the p--n junction diode, bipolar junction transistor, MOS devices, photonic devices, quantum effect devices, and high speed III-V semiconductor devices. The text presents a unified and balanced treatment of the physics of semiconductor materials and devices. It is intended to provide physicists and mat erials scientists with more device backgrounds, and device engineers with a broader knowledge of fundamental solid state physics.
Publisher: Springer Science & Business Media
ISBN: 146130489X
Category : Science
Languages : en
Pages : 514
Book Description
The purpose of this book is to provide the reader with a self-contained treatment of fundamen tal solid state and semiconductor device physics. The material presented in the text is based upon the lecture notes of a one-year graduate course sequence taught by this author for many years in the ·Department of Electrical Engineering of the University of Florida. It is intended as an introductory textbook for graduate students in electrical engineering. However, many students from other disciplines and backgrounds such as chemical engineering, materials science, and physics have also taken this course sequence, and will be interested in the material presented herein. This book may also serve as a general reference for device engineers in the semiconductor industry. The present volume covers a wide variety of topics on basic solid state physics and physical principles of various semiconductor devices. The main subjects covered include crystal structures, lattice dynamics, semiconductor statistics, energy band theory, excess carrier phenomena and recombination mechanisms, carrier transport and scattering mechanisms, optical properties, photoelectric effects, metal-semiconductor devices, the p--n junction diode, bipolar junction transistor, MOS devices, photonic devices, quantum effect devices, and high speed III-V semiconductor devices. The text presents a unified and balanced treatment of the physics of semiconductor materials and devices. It is intended to provide physicists and mat erials scientists with more device backgrounds, and device engineers with a broader knowledge of fundamental solid state physics.
The Physical Basis of Electronics
Author: D. J. Harris
Publisher: Elsevier
ISBN: 1483156540
Category : Technology & Engineering
Languages : en
Pages : 279
Book Description
The Physical Basis of Electronics: An Introductory Course, Second Edition is an 11-chapter text that discusses the physical concepts of electronic devices. This edition deals with the considerable advances in electronic techniques, from the introduction of field effect transistors to the development of integrated circuits. The opening chapters discuss the fundamentals of vacuum electronics and solid-state electronics. The subsequent chapters deal with the other components of electronic devices and their functions, including semiconductor diode and transistor as an amplifier and a switch. The discussion then shifts to several types of field-effect transistor and the production of p-n junctions, transistors, and integrated circuits. A chapter highlights the four classifications of thermionic valves commonly used in electronic devices, namely, diodes, triodes, tetrodes, and pentodes. This chapter also considers the effect of small gas introduced to the characteristics of these valves. The concluding chapters discuss some of the basic modes of operation of electronic circuits and cathode-ray tube. This edition is of great value to undergraduate electronics students.
Publisher: Elsevier
ISBN: 1483156540
Category : Technology & Engineering
Languages : en
Pages : 279
Book Description
The Physical Basis of Electronics: An Introductory Course, Second Edition is an 11-chapter text that discusses the physical concepts of electronic devices. This edition deals with the considerable advances in electronic techniques, from the introduction of field effect transistors to the development of integrated circuits. The opening chapters discuss the fundamentals of vacuum electronics and solid-state electronics. The subsequent chapters deal with the other components of electronic devices and their functions, including semiconductor diode and transistor as an amplifier and a switch. The discussion then shifts to several types of field-effect transistor and the production of p-n junctions, transistors, and integrated circuits. A chapter highlights the four classifications of thermionic valves commonly used in electronic devices, namely, diodes, triodes, tetrodes, and pentodes. This chapter also considers the effect of small gas introduced to the characteristics of these valves. The concluding chapters discuss some of the basic modes of operation of electronic circuits and cathode-ray tube. This edition is of great value to undergraduate electronics students.
Introduction to Physical Electronics
Author: Karl Erik Lonngren
Publisher: Allyn & Bacon
ISBN:
Category : Science
Languages : en
Pages : 344
Book Description
Publisher: Allyn & Bacon
ISBN:
Category : Science
Languages : en
Pages : 344
Book Description
Reliability and Failure of Electronic Materials and Devices
Author: Milton Ohring
Publisher: Academic Press
ISBN: 0080575528
Category : Technology & Engineering
Languages : en
Pages : 759
Book Description
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Publisher: Academic Press
ISBN: 0080575528
Category : Technology & Engineering
Languages : en
Pages : 759
Book Description
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Introduction to Physical Electronics
Author: Bill Wilson
Publisher: Orange Groove Books
ISBN: 9781616100445
Category : Technology & Engineering
Languages : en
Pages : 263
Book Description
Publisher: Orange Groove Books
ISBN: 9781616100445
Category : Technology & Engineering
Languages : en
Pages : 263
Book Description
New Physical Problems In Electronic Materials - Proceedings Of The 6th Iscmp
Author: Borissov M
Publisher: #N/A
ISBN: 981456947X
Category :
Languages : en
Pages : 572
Book Description
This proceedings feature lectures and contributions identifying and exploring major new trends in contemporary materials science, in particular electronic and optoelectronic materials. Various aspects of the preparative technology, characterisation techniques, physical and physicochemical properties and device applications of new electronic and optoelectronic materials (amorphous, polycrystalline, crystalline semiconductors, magnetic media, high Tc superconductors, polymeric thin films, ferroelectrics, etc.) are treated via in depth reviews.
Publisher: #N/A
ISBN: 981456947X
Category :
Languages : en
Pages : 572
Book Description
This proceedings feature lectures and contributions identifying and exploring major new trends in contemporary materials science, in particular electronic and optoelectronic materials. Various aspects of the preparative technology, characterisation techniques, physical and physicochemical properties and device applications of new electronic and optoelectronic materials (amorphous, polycrystalline, crystalline semiconductors, magnetic media, high Tc superconductors, polymeric thin films, ferroelectrics, etc.) are treated via in depth reviews.
Physical Limitations of Semiconductor Devices
Author: Vladislav A. Vashchenko
Publisher: Springer Science & Business Media
ISBN: 0387745149
Category : Technology & Engineering
Languages : en
Pages : 337
Book Description
Providing an important link between the theoretical knowledge in the field of non-linier physics and practical application problems in microelectronics, the purpose of the book is popularization of the physical approach for reliability assurance. Another unique aspect of the book is the coverage given to the role of local structural defects, their mathematical description, and their impact on the reliability of the semiconductor devices.
Publisher: Springer Science & Business Media
ISBN: 0387745149
Category : Technology & Engineering
Languages : en
Pages : 337
Book Description
Providing an important link between the theoretical knowledge in the field of non-linier physics and practical application problems in microelectronics, the purpose of the book is popularization of the physical approach for reliability assurance. Another unique aspect of the book is the coverage given to the role of local structural defects, their mathematical description, and their impact on the reliability of the semiconductor devices.
Introduction to the Physics of Electronics
Author: Myron F. Uman
Publisher: Prentice Hall
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 440
Book Description
Publisher: Prentice Hall
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 440
Book Description
Physical Assurance
Author: Navid Asadizanjani
Publisher: Springer Nature
ISBN: 3030626091
Category : Technology & Engineering
Languages : en
Pages : 193
Book Description
This book provides readers with a comprehensive introduction to physical inspection-based approaches for electronics security. The authors explain the principles of physical inspection techniques including invasive, non-invasive and semi-invasive approaches and how they can be used for hardware assurance, from IC to PCB level. Coverage includes a wide variety of topics, from failure analysis and imaging, to testing, machine learning and automation, reverse engineering and attacks, and countermeasures.
Publisher: Springer Nature
ISBN: 3030626091
Category : Technology & Engineering
Languages : en
Pages : 193
Book Description
This book provides readers with a comprehensive introduction to physical inspection-based approaches for electronics security. The authors explain the principles of physical inspection techniques including invasive, non-invasive and semi-invasive approaches and how they can be used for hardware assurance, from IC to PCB level. Coverage includes a wide variety of topics, from failure analysis and imaging, to testing, machine learning and automation, reverse engineering and attacks, and countermeasures.