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Author: Giles Humpston
Publisher: ASM International
ISBN: 1615031707
Category : Technology & Engineering
Languages : en
Pages : 284
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Book Description
Author: Giles Humpston
Publisher: ASM International
ISBN: 1615031707
Category : Technology & Engineering
Languages : en
Pages : 284
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Book Description
Author: David M. Jacobson
Publisher: ASM International
ISBN: 1615031049
Category : Technology & Engineering
Languages : zh-CN
Pages : 268
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Book Description
Author: Ning-Cheng Lee
Publisher: Newnes
ISBN: 0750672188
Category : Technology & Engineering
Languages : en
Pages : 282
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Book Description
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process
Author: Mel Schwartz
Publisher: ASM International
ISBN: 1627080589
Category : Technology & Engineering
Languages : en
Pages : 207
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Book Description
Covers various soldering methods and techniques as well as the latest on solder alloys, solder films, surface preparation, fluxes and cleaning methods, heating methods, inspection techniques, and quality control and reliability. Geared to scientists, material engineers, designers, manufacturing engineers, and technologists who need immediate practical guidance rather than theoretical instruction.
Author: Giles Humpston
Publisher: ASM International(OH)
ISBN: 9780871704627
Category : Technology & Engineering
Languages : en
Pages : 281
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Book Description
Author: Balázs Illés
Publisher: Elsevier
ISBN: 0128185066
Category : Technology & Engineering
Languages : en
Pages : 295
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Book Description
Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. This is followed by three chapters exploring: Infrared ovens, convection ovens, Vapor Phase Soldering (VPS), and special reflow ovens. Each of these chapters includes a discussion of the physical background, structure and working principle, and characterization of the heating, flow and vapor parameters; and concludes with a review of the application of the techniques and typical solder failures. The book concludes with a discussion of the various numerical simulations of the different ovens. This book will be useful for researchers and process and quality and research and design engineers within the electronics and manufacturing industries. - Provides an overview and comparison of the existing reflow apparatus, heating methods, and working principles - Analyses and compares the different reflow ovens - Discusses useful tools such as characterization and measurement methods and includes numerical case studies to assist in solving soldering problems and improve soldering quality - Introduces Vapor Phase Soldering (VPS) technology
Author: Marc de Vinck
Publisher: Maker Media, Inc.
ISBN: 1680453815
Category : Technology & Engineering
Languages : en
Pages : 165
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Book Description
Getting Started with Soldering not only teaches new makers and experimenters the core principles of soldering, it also functions as an excellent reference and resource for beginners and more advanced makers alike. The book guides readers through the fundamentals of soldering, explains the tools and materials, demonstrates proper techniques, and shows how to fix mistakes or broken connections. It even includes guidance on more advanced techniques such as surface-mount soldering for electronics. From choosing the right soldering iron to making perfect connections, readers will acquire the knowledge and skills needed to form a strong foundation for a lifetime of making. Soldering is a core concept in making, electronics prototyping, and home repairs The many different types of soldering -- requiring different materials and tools -- are explained with easy-to-follow instructions Full-color photographs and illustrations throughout create a visually engaging format for learning Pricing and technical considerations help readers select the best tools for their budgets and needs Troubleshooting guidelines show how to repair solder connections that have failed from improper technique or from age
Author: Howard H. Manko
Publisher: McGraw-Hill Companies
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 376
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Book Description
Get the latest developments in solder technology You can't work in electronics without solder -- and you shouldn't work with solder without Solders and Soldering, Fourth Edition. Profusely illustrated, this book by the world's top solder educator has been the leader in its field for two decades. You'll learn 29 different methods for soldering and heating (for both automatic and manual procedures), and learn about the strengths and weaknesses of each method for varying applications. This up-to-date edition deals at length with modern cleaning materials and processes, emphasizing EPA and OSHA guidelines and regulations, and provides you with state-of-the-art techniques for soldering with miniaturized circuit boards.
Author: R. Sengupta
Publisher: New Age International
ISBN: 9788122411096
Category :
Languages : en
Pages : 122
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Book Description
Soldering, Though Being An Age Old Phenomenon, Is Still Perhaps A Difficult Subject To Understand, Due To Its Interdisciplinary Nature. In This Book, Efforts Have Been Made To Describe The Physical Theories Responsible For Making A Good Joint, The Chemical Actions During Its Formation And The Electrical, Thermal And Mechanical Requirements Essential To Ensure Its Reliability. The Four M'S; Material, Machine, Method And Man, Necessary For Designing A Solder Joint Have Been Described In Detail. Further, Process Control, Solder Joint Inspection Criteria, Solder Joint Defect Analysis And Its Repair/Rework Are Also Discussed.Additionally, Brief Introductions To Surface Mount Devices (Smd) And Surface Mount Technology (Smt) Have Been Included A Annexures. The Book Will Be Useful In Industry, And To Design Production, Process Planning And Quality Control Engineers, As Well As In Engineering/Technical Colleges To Students As A Reference Book For The Present And, Hopefully, Future Modified Courses. The Academicians May Find This Book Useful For Redesigning The Present Diploma (Electronics), B.Sc. (Electronics), B.Sc. (Instrumentation), B.E. And M.E. / M.Tech (Electrical, Electronic, Instrumentation) Syllabus.
Author: RUDOLF STRAUSS
Publisher: Elsevier
ISBN: 0080480977
Category : Technology & Engineering
Languages : en
Pages : 389
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Book Description
Surface Mount Technology has had a profound influence on the electronics industry, and has led to the use of new materials, techniques and manufacturing processes. Since the first edition of this book was written, electronic assemblies have continued to become still smaller and more complex, while soldering still remains the dominant connecting technique. This is a comprehensive guide to current methods of soldering components to their substrates, written by one of the founding fathers of the technology. It also covers component placement, the post-CFC technology of cleaning after soldering, and the principles and methods of quality control and rework. New sections deal with Ball-Grid-Array (BGA) technology, lead-free solders, no-clean fluxes, and the current standard specifications for solders and fluxes. Dr Rudolf Strauss has spent most of his working life with a leading manufacturer of solders and fluxes. He was responsible for a number of innovations including the concept of wave soldering, and for many years has been active as lecturer, consultant, and technical author. His book explains the principles of soldering and surface mount technology in practical terms and plain language, free from jargon. It is addressed to the man, or woman, who has to do the job, but it will also be of help in planning manufacturing strategy and in making purchasing decisions relating to consumables and equipment. - Written by founding father of SMT technology - Standard specifications have been fully updated - New chapter covering Ball Grid Array (BGA) technology
