Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement PDF Author: Yue Ma
Publisher: CRC Press
ISBN: 0429680074
Category : Computers
Languages : en
Pages : 226

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Book Description
As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.

Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement PDF Author: Yue Ma
Publisher: CRC Press
ISBN: 0429680074
Category : Computers
Languages : en
Pages : 226

Get Book Here

Book Description
As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.

Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement PDF Author: Yue Ma
Publisher: CRC Press
ISBN: 0429680066
Category : Computers
Languages : en
Pages : 262

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Book Description
As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.

Smart Power Integration

Smart Power Integration PDF Author: Mohamed Abouelatta
Publisher: John Wiley & Sons
ISBN: 139416954X
Category : Technology & Engineering
Languages : en
Pages : 324

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Book Description
Smart power integration is at the crossroads of different fields of electronics such as high and low power, engine control and electrothermal studies of devices and circuits. These circuits are complex and are heavily influenced by substrate coupling, especially where 3D integration is concerned. This book provides an overview of smart power integration, including high voltage devices, dedicated and compatible processes, as well as isolation techniques. Two types of integration are highlighted: modular or hybrid integration, together with compatible devices such as the insulated gate bipolar transistor (IGBT); and monolithic integration, specifically through the paradigm of functional integration. Smart Power Integration outlines the main MOS devices for high voltage integrated circuits, and explores into the fields of codesign, coupling hardware and software design, including applications to motor control. Studies focusing on heat pipes for electronics cooling are also outlined.

Analog Devices and Circuits 2

Analog Devices and Circuits 2 PDF Author: Christian Gontrand
Publisher: John Wiley & Sons
ISBN: 1394276753
Category : Technology & Engineering
Languages : en
Pages : 276

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Book Description
At the end of the Second World War, a new technological trend was born: integrated electronics. This trend relied on the enormous rise of integrable electronic devices. Analog Devices and Circuits is composed of two volumes: the first deals with analog components, and the second with associated analog circuits. The goal here is not to create an overly comprehensive analysis, but rather to break it down into smaller sections, thus highlighting the complexity and breadth of the field. This first volume, after a brief history, describes the two main devices, namely bipolar transistors and MOS, with particular importance given to the modeling aspect. In doing so, we deal with new devices dedicated to radio frequency, which touches on nanoelectronics. We will also address some of the notions related to quantum mechanics. Finally, Monte Carlo methods, by essence statistics, will be introduced, which have become more and more important since the middle of the twentieth century. The second volume deals with the circuits that "use" the analog components that were introduced in Volume 1. Here, a particular emphasis is placed on the main circuit: the operational amplifier.

DCIS2002

DCIS2002 PDF Author: Salvador Bracho del Pino
Publisher: Ed. Universidad de Cantabria
ISBN: 9788481023114
Category : Technology & Engineering
Languages : en
Pages : 756

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Book Description
Este libro contiene las presentaciones de la XVII Conferencia de Diseño de Circuitos y Sistemas Integrados celebrado en el Palacio de la Magdalena, Santander, en noviembre de 2002. Esta Conferencia ha alcanzado un alto nivel de calidad, como consecuencia de su tradición y madurez, que lo convierte en uno de los acontecimientos más importantes para los circuitos de microelectrónica y la comunidad de diseño de sistemas en el sur de Europa. Desde su origen tiene una gran contribución de Universidades españolas, aunque hoy los autores participan desde catorce países

Blindsight

Blindsight PDF Author: Peter Watts
Publisher: Macmillan
ISBN: 1429955198
Category : Fiction
Languages : en
Pages : 388

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Book Description
Hugo and Shirley Jackson award-winning Peter Watts stands on the cutting edge of hard SF with his acclaimed novel, Blindsight Two months since the stars fell... Two months of silence, while a world held its breath. Now some half-derelict space probe, sparking fitfully past Neptune's orbit, hears a whisper from the edge of the solar system: a faint signal sweeping the cosmos like a lighthouse beam. Whatever's out there isn't talking to us. It's talking to some distant star, perhaps. Or perhaps to something closer, something en route. So who do you send to force introductions with unknown and unknowable alien intellect that doesn't wish to be met? You send a linguist with multiple personalities, her brain surgically partitioned into separate, sentient processing cores. You send a biologist so radically interfaced with machinery that he sees x-rays and tastes ultrasound. You send a pacifist warrior in the faint hope she won't be needed. You send a monster to command them all, an extinct hominid predator once called vampire, recalled from the grave with the voodoo of recombinant genetics and the blood of sociopaths. And you send a synthesist—an informational topologist with half his mind gone—as an interface between here and there. Pray they can be trusted with the fate of a world. They may be more alien than the thing they've been sent to find. At the Publisher's request, this title is being sold without Digital Rights Management Software (DRM) applied.

Power Management Techniques for Integrated Circuit Design

Power Management Techniques for Integrated Circuit Design PDF Author: Ke-Horng Chen
Publisher: John Wiley & Sons
ISBN: 1118896831
Category : Technology & Engineering
Languages : en
Pages : 774

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Book Description
This book begins with the premise that energy demands are directing scientists towards ever-greener methods of power management, so highly integrated power control ICs (integrated chip/circuit) are increasingly in demand for further reducing power consumption. A timely and comprehensive reference guide for IC designers dealing with the increasingly widespread demand for integrated low power management Includes new topics such as LED lighting, fast transient response, DVS-tracking and design with advanced technology nodes Leading author (Chen) is an active and renowned contributor to the power management IC design field, and has extensive industry experience Accompanying website includes presentation files with book illustrations, lecture notes, simulation circuits, solution manuals, instructors’ manuals, and program downloads

Silicon Photonics II

Silicon Photonics II PDF Author: David J. Lockwood
Publisher: Springer Science & Business Media
ISBN: 3642105068
Category : Science
Languages : en
Pages : 264

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Book Description
This book is volume II of a series of books on silicon photonics. It gives a fascinating picture of the state-of-the-art in silicon photonics from a component perspective. It presents a perspective on what can be expected in the near future. It is formed from a selected number of reviews authored by world leaders in the field, and is written from both academic and industrial viewpoints. An in-depth discussion of the route towards fully integrated silicon photonics is presented. This book will be useful not only to physicists, chemists, materials scientists, and engineers but also to graduate students who are interested in the fields of micro- and nanophotonics and optoelectronics.

Carbon Nanotubes for Interconnects

Carbon Nanotubes for Interconnects PDF Author: Aida Todri-Sanial
Publisher: Springer
ISBN: 9783319806426
Category : Technology & Engineering
Languages : en
Pages : 333

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Book Description
This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

Cal/OSHA Pocket Guide for the Construction Industry

Cal/OSHA Pocket Guide for the Construction Industry PDF Author:
Publisher:
ISBN: 9781622701070
Category :
Languages : en
Pages :

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Book Description
The Cal/OSHA Pocket Guide for the Construction Industry is a handy guide for workers, employers, supervisors, and safety personnel. This latest 2011 edition is a quick field reference that summarizes selected safety standards from the California Code of Regulations. The major subject headings are alphabetized and cross-referenced within the text, and it has a detailed index. Spiral bound, 8.5 x 5.5"