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Author: Masanori Hashimoto
Publisher: McGraw Hill Professional
ISBN: 0071787771
Category : Technology & Engineering
Languages : en
Pages : 417
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Book Description
Proven methods for noise-tolerant nanoscale integrated circuit design This leading-edge guide discusses the impact of power integrity from a design perspective, emphasizing phenomena and problems induced by power integrity degradation and the latest design trends, including low-power design. Power Integrity for Nanoscale Integrated Systems describes how these problems can be forecast early in the design process and the countermeasures that can be used to address them, such as the inclusion of inductance and accurate modeling for PI analysis, as well as robust circuit design. Detailed examples and a case study on the IBM POWER7+ processor illustrate real-world applications of the techniques presented in this practical resource. Coverage includes: Significance of power integrity for integrated circuits Supply and substrate noise impact on circuits Clock generation and distribution with power integrity Signal and power integrity design for I/O circuits Power integrity degradation and modeling Lumped, distributed, and 3D modeling for power integrity Chip temperature and PI impact Low-power techniques and PI impact Power integrity case study using the IBM POWER7+ processor chip Carbon nanotube interconnects for power delivery
Author: Masanori Hashimoto
Publisher: McGraw Hill Professional
ISBN: 0071787771
Category : Technology & Engineering
Languages : en
Pages : 417
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Book Description
Proven methods for noise-tolerant nanoscale integrated circuit design This leading-edge guide discusses the impact of power integrity from a design perspective, emphasizing phenomena and problems induced by power integrity degradation and the latest design trends, including low-power design. Power Integrity for Nanoscale Integrated Systems describes how these problems can be forecast early in the design process and the countermeasures that can be used to address them, such as the inclusion of inductance and accurate modeling for PI analysis, as well as robust circuit design. Detailed examples and a case study on the IBM POWER7+ processor illustrate real-world applications of the techniques presented in this practical resource. Coverage includes: Significance of power integrity for integrated circuits Supply and substrate noise impact on circuits Clock generation and distribution with power integrity Signal and power integrity design for I/O circuits Power integrity degradation and modeling Lumped, distributed, and 3D modeling for power integrity Chip temperature and PI impact Low-power techniques and PI impact Power integrity case study using the IBM POWER7+ processor chip Carbon nanotube interconnects for power delivery
Author: Guanglu Sun
Publisher: Springer Nature
ISBN: 3030350959
Category : Education
Languages : en
Pages : 449
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Book Description
This book constitutes the proceedings of the 5th International Conference on e-Learning, e-Education, and Online Training, eLEOT 2019, held in Kunming, China, in August 2019. The 46 revised full papers presented were carefully reviewed and selected from 99 submissions. They focus on most recent and innovative trends in this broad area, ranging from distance education to collaborative learning, from interactive learning environments to the modelling of STEM (Science, Technology, Mathematics, Engineering) curricula.
Author: Larry D. Smith
Publisher: Prentice Hall
ISBN: 0132735628
Category : Technology & Engineering
Languages : en
Pages : 831
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Book Description
Consistently Design PDNs That Deliver Reliable Performance at the Right Cost Too often, PDN designs work inconsistently, and techniques that work in some scenarios seem to fail inexplicably in others. This book explains why and presents realistic processes for getting PDN designs right in any new product. Drawing on 60+ years of signal and power integrity experience, Larry Smith and Eric Bogatin show how to manage noise and electrical performance, and complement intuition with analysis to balance cost, performance, risk, and schedule. Throughout, they distill the essence of complex real-world problems, quantify core principles via approximation, and apply them to specific examples. For easy usage, dozens of key concepts and observations are highlighted as tips and listed in quick, chapter-ending summaries. Coverage includes • A practical, start-to-finish approach to consistently meeting PDN performance goals • Understanding how signals interact with interconnects • Identifying root causes of common problems, so you can avoid them • Leveraging analysis tools to efficiently explore design space and optimize tradeoffs • Analyzing impedance-related properties of series and parallel RLC circuits • Measuring low impedance for components and entire PDN ecologies • Predicting loop inductance from physical design features • Reducing peak impedances from combinations of capacitors • Understanding power and ground plane properties in the PDN interconnect • Taming signal integrity problems when signals change return planes • Reducing peak impedance created by on-die capacitance and package lead inductance • Controlling transient current waveform interactions with PDN features • Simple spreadsheet-based analysis techniques for quickly creating first-pass designs This guide will be indispensable for all engineers involved in PDN design, including product, board, and chip designers; system, hardware, component, and package engineers; power supply designers, SI and EMI engineers, sales engineers, and their managers.
Author: Er-Ping Li
Publisher: John Wiley & Sons
ISBN: 1118166744
Category : Technology & Engineering
Languages : en
Pages : 394
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Book Description
New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.
Author: Eric Bogatin
Publisher: Prentice Hall Professional
ISBN: 9780130669469
Category : Technology & Engineering
Languages : en
Pages : 612
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Book Description
This thorough review of the fundamental principles associated with signal integrity provides engineering principles behind signal integrity effects, and applies this understanding to solving problems.
Author: Raj Nair
Publisher: Prentice Hall
ISBN: 9780134185958
Category : Integrated circuits
Languages : en
Pages : 432
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Book Description
New Techniques and Tools for Ensuring On-Chip Power Integrity--Down to Nanoscale As chips continue to scale, power integrity issues are introducing unexpected project complexity and cost. In this book, two leading industry innovators thoroughly discuss the power integrity challenges that engineers face in designing at nanoscale levels, introduce new analysis and management techniques for addressing these issues, and provide breakthrough tools for hands-on problem solving. Raj Nair and Dr. Donald Bennett first provide a complete foundational understanding of power integrity, including ULSI issues, practical aspects of power delivery, and the benefits of a total power integrity approach to optimizing chip physical designs. They introduce advanced power distribution network modeling, design, and analysis techniques that highlight abstraction and physics-based analysis, while also incorporating traditional circuit- and field-solver based approaches. They also present advanced techniques for floorplanning and power integrity management, and help designers anticipate emerging challenges associated with increased integration. Anasim RLCSim.exe, a new tool for power integrity aware floorplanning, is downloadable for free atanasim.com/category/software. The authors Systematically explore power integrity implications, analysis, and management for integrated circuits Present practical examples and industry best practices for a broad spectrum of chip design applications Discuss distributed and high-bandwidth voltage regulation, differential power path design, and the significance of on-chip inductance to power integrity Review both traditional and advanced modeling techniques for integrated circuit power integrity analysis, and introduce continuum modeling Explore chip, package, and board interactions for power integrity and EMI, and bring together industry best practices and examples Introduce advanced concepts for power integrity management, including non-linear capacitance devices, impedance modulation, and active noise regulation Power Integrity Analysis and Management for Integrated Circuits ' coverage of both fundamentals and advanced techniques will make this book indispensable to all engineers responsible for signal integrity, power integrity, hardware, or system design--especially those working at the nanoscale level.
Author: Emre Salman
Publisher: McGraw Hill Professional
ISBN: 0071635769
Category : Technology & Engineering
Languages : en
Pages : 738
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Book Description
The latest techniques for designing robust, high performance integrated circuits in nanoscale technologies Focusing on a new technological paradigm, this practical guide describes the interconnect-centric design methodologies that are now the major focus of nanoscale integrated circuits (ICs). High Performance Integrated Circuit Design begins by discussing the dominant role of on-chip interconnects and provides an overview of technology scaling. The book goes on to cover data signaling, power management, synchronization, and substrate-aware design. Specific design constraints and methodologies unique to each type of interconnect are addressed. This comprehensive volume also explains the design of specialized circuits such as tapered buffers and repeaters for data signaling, voltage regulators for power management, and phase-locked loops for synchronization. This is an invaluable resource for students, researchers, and engineers working in the area of high performance ICs. Coverage includes: Technology scaling Interconnect modeling and extraction Signal propagation and delay analysis Interconnect coupling noise Global signaling Power generation Power distribution networks CAD of power networks Techniques to reduce power supply noise Power dissipation Synchronization theory and tradeoffs Synchronous system characteristics On-chip clock generation and distribution Substrate noise in mixed-signal ICs Techniques to reduce substrate noise
Author: Raj Nair
Publisher:
ISBN: 9788131744536
Category : Integrated circuits
Languages : en
Pages : 432
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Book Description
New Techniques and Tools for Ensuring On-Chip Power Integrity-Down to Nanoscale As chips continue to scale, power integrity issues are introducing unexpected project complexity and cost. In this book, two leading industry innovators thoroughly discuss the power integrity challenges that engineers face in designing at nanoscale levels, introduce new analysis and management techniques for addressing these issues, and provide breakthrough tools for hands-on problem solving. Raj Nair and Dr. Donald Bennett first provide a complete foundational understanding of power integrity, including ULSI issues, practical aspects of power delivery, and the benefits of a total power integrity approach to optimizing chip physical designs. They introduce advanced power distribution network modeling, design, and analysis techniques that highlight abstraction and physics-based analysis, while also incorporating traditional circuit- and field-solver based approaches. They also present advanced techniques for floorplanning and power integrity management, and help designers anticipate emerging challenges associated with increased integration. Anasim RLCSim.exe, a new tool for power integrity aware floorplanning, is downloadable for free at anasim.com/category/software. The authors Systematically explore power integrity implications, analysis, and management for integrated circuits Present practical examples and industry best practices for a broad spectrum of chip design applications Discuss distributed and high-bandwidth voltage regulation, differential power path design, and the significance of on-chip inductance to power integrity Review both traditional and advanced modeling techniques for integrated circuit power integrity analysis, and introduce continuum modeling Explore chip, package, and board interactions for power integrity and EMI, and bring together industry best practices and examples Introduce advanced concepts for power integrity management, including non-linear capacitance devices, impedance modulation, and active noise regulation Power Integrity Analysis and Management for Integrated Circuits ' coverage of both fundamentals and advanced techniques will make this book indispensable to all engineers responsible for signal integrity, power integrity, hardware, or system design-especially those working at the nanoscale level.
Author: Yang Yi
Publisher: BoD – Books on Demand
ISBN: 1838805222
Category : Computers
Languages : en
Pages : 296
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Book Description
The book “Intelligent System and Computing” reports the theory, mathematical models, algorithms, design methods, and applications of intelligent systems and computing. It covers various disciplines including computer and information science, electrical and computer engineering, natural sciences, economics, and neuroscience. The broad-ranging discussion covers the key disciplines in computational science and artificial intelligence as well as advances in neuromorphic computing, deep learning, the Internet of Things, computer vision, and many others. This volume provides both academics and professionals with a comprehensive overview of the field and presents areas for future research.
Author: Aida Todri-Sanial
Publisher: CRC Press
ISBN: 1351830198
Category : Technology & Engineering
Languages : en
Pages : 409
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Book Description
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
