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Author: Steven M. Sandler
Publisher: McGraw Hill Professional
ISBN: 0071831002
Category : Technology & Engineering
Languages : en
Pages : 352
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Book Description
PROVEN TECHNIQUES FOR GENERATING HIGH-FIDELITY MEASUREMENTS Power Integrity: Measuring, Optimizing, and Troubleshooting Power Related Parameters in Electronics Systems provides field-tested techniques for producing high-fidelity measurements using the appropriate equipment. The book thoroughly discusses measurement guidelines, test instrument selection and use, connecting the equipment to the device being tested, and interpreting the acquired data. The latest electronics technologies and their impact on measurement are discussed. Detailed photographs, screenshots, schematics, and equations are included throughout this practical guide. Learn how to accurately measure: Impedance Stability Power supply rejection ratio (PSRR) Reverse transfer and crosstalk Step load response Ripple and noise Edges High-frequency impedance
Author: Steven M. Sandler
Publisher: McGraw Hill Professional
ISBN: 0071831002
Category : Technology & Engineering
Languages : en
Pages : 352
Get Book Here
Book Description
PROVEN TECHNIQUES FOR GENERATING HIGH-FIDELITY MEASUREMENTS Power Integrity: Measuring, Optimizing, and Troubleshooting Power Related Parameters in Electronics Systems provides field-tested techniques for producing high-fidelity measurements using the appropriate equipment. The book thoroughly discusses measurement guidelines, test instrument selection and use, connecting the equipment to the device being tested, and interpreting the acquired data. The latest electronics technologies and their impact on measurement are discussed. Detailed photographs, screenshots, schematics, and equations are included throughout this practical guide. Learn how to accurately measure: Impedance Stability Power supply rejection ratio (PSRR) Reverse transfer and crosstalk Step load response Ripple and noise Edges High-frequency impedance
Author: Eric Bogatin
Publisher: Pearson Education
ISBN: 0132349795
Category : Technology & Engineering
Languages : en
Pages : 793
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Book Description
With the inclusion of the two new hot topics in signal integrity, power integrity and high speed serial links, this book will be the most up to date complete guide to understanding and designing for signal integrity.
Author: Larry D. Smith
Publisher: Prentice Hall
ISBN: 0132735628
Category : Technology & Engineering
Languages : en
Pages : 831
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Book Description
Consistently Design PDNs That Deliver Reliable Performance at the Right Cost Too often, PDN designs work inconsistently, and techniques that work in some scenarios seem to fail inexplicably in others. This book explains why and presents realistic processes for getting PDN designs right in any new product. Drawing on 60+ years of signal and power integrity experience, Larry Smith and Eric Bogatin show how to manage noise and electrical performance, and complement intuition with analysis to balance cost, performance, risk, and schedule. Throughout, they distill the essence of complex real-world problems, quantify core principles via approximation, and apply them to specific examples. For easy usage, dozens of key concepts and observations are highlighted as tips and listed in quick, chapter-ending summaries. Coverage includes • A practical, start-to-finish approach to consistently meeting PDN performance goals • Understanding how signals interact with interconnects • Identifying root causes of common problems, so you can avoid them • Leveraging analysis tools to efficiently explore design space and optimize tradeoffs • Analyzing impedance-related properties of series and parallel RLC circuits • Measuring low impedance for components and entire PDN ecologies • Predicting loop inductance from physical design features • Reducing peak impedances from combinations of capacitors • Understanding power and ground plane properties in the PDN interconnect • Taming signal integrity problems when signals change return planes • Reducing peak impedance created by on-die capacitance and package lead inductance • Controlling transient current waveform interactions with PDN features • Simple spreadsheet-based analysis techniques for quickly creating first-pass designs This guide will be indispensable for all engineers involved in PDN design, including product, board, and chip designers; system, hardware, component, and package engineers; power supply designers, SI and EMI engineers, sales engineers, and their managers.
Author: Madhavan Swaminathan
Publisher: Pearson Education
ISBN: 0132797178
Category : Technology & Engineering
Languages : en
Pages : 599
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Book Description
The First Comprehensive, Example-Rich Guide to Power Integrity Modeling Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art. Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise. The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications. The authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.
Author: Istvan Novak
Publisher: Intl. Engineering Consortiu
ISBN: 9781931695657
Category : Computers
Languages : en
Pages : 578
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Book Description
A series of cogently written articles by 49 industry experts, this collection fills the void on Power Distribution Network (PDN) design procedures, and addresses such related topics as DC–DC converters, selection of bypass capacitors, DDR2 memory systems, powering of FPGAs, and synthesis of impedance profiles. Through these contributions from such leading companies as Sun Microsystems, Sanyo, IBM, Hewlett-Packard, Intel, and Rambus, readers will come to understand why books on power integrity are only now becoming available to the public and can relate these topics to current industry trends.
Author: Joseph T. DiBene, II
Publisher: John Wiley & Sons
ISBN: 1118826345
Category : Technology & Engineering
Languages : en
Pages : 279
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Book Description
An all-encompassing text that focuses on the fundamentals of power integrity Power integrity is the study of power distribution from the source to the load and the system level issues that can occur across it. For computer systems, these issues can range from inside the silicon to across the board and may egress into other parts of the platform, including thermal, EMI, and mechanical. With a focus on computer systems and silicon level power delivery, this book sheds light on the fundamentals of power integrity, utilizing the author’s extensive background in the power integrity industry and unique experience in silicon power architecture, design, and development. Aimed at engineers interested in learning the essential and advanced topics of the field, this book offers important chapter coverage of fundamentals in power distribution, power integrity analysis basics, system-level power integrity considerations, power conversion in computer systems, chip-level power, and more. Fundamentals of Power Integrity for Computer Platforms and Systems: Introduces readers to both the field of power integrity and to platform power conversion Provides a unique focus on computer systems and silicon level power delivery unavailable elsewhere Offers detailed analysis of common problems in the industry Reviews electromagnetic field and circuit representation Includes a detailed bibliography of references at the end of each chapter Works out multiple example problems within each chapter Including additional appendixes of tables and formulas, Fundamentals of Power Integrity for Computer Platforms and Systems is an ideal introductory text for engineers of power integrity as well as those in the chip design industry, specifically physical design and packaging.
Author: Masanori Hashimoto
Publisher: McGraw Hill Professional
ISBN: 0071787771
Category : Technology & Engineering
Languages : en
Pages : 417
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Book Description
Proven methods for noise-tolerant nanoscale integrated circuit design This leading-edge guide discusses the impact of power integrity from a design perspective, emphasizing phenomena and problems induced by power integrity degradation and the latest design trends, including low-power design. Power Integrity for Nanoscale Integrated Systems describes how these problems can be forecast early in the design process and the countermeasures that can be used to address them, such as the inclusion of inductance and accurate modeling for PI analysis, as well as robust circuit design. Detailed examples and a case study on the IBM POWER7+ processor illustrate real-world applications of the techniques presented in this practical resource. Coverage includes: Significance of power integrity for integrated circuits Supply and substrate noise impact on circuits Clock generation and distribution with power integrity Signal and power integrity design for I/O circuits Power integrity degradation and modeling Lumped, distributed, and 3D modeling for power integrity Chip temperature and PI impact Low-power techniques and PI impact Power integrity case study using the IBM POWER7+ processor chip Carbon nanotube interconnects for power delivery
Author: Er-Ping Li
Publisher: John Wiley & Sons
ISBN: 0470623462
Category : Technology & Engineering
Languages : en
Pages : 394
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Book Description
New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.
Author: John MacArthur
Publisher: Crossway
ISBN: 1433517981
Category : Religion
Languages : en
Pages : 194
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Book Description
We live in a society that has largely abandoned moral standards and Christian principles. Unkept campaign promises, false advertising, exaggerated tax exemptions, employee theft—compromise has become a way of life. Such moral concession has even invaded the church. Faced with an opportunity to proclaim Christ to unbelievers, we feel intimidated and keep silent. Or we water down God's Word on ethical issues at work or in our community to avoid rejection. Too often we prefer hypocrisy to integrity. But God longs for His people to be different—to maintain a commitment to His standards, no matter what the cost. Is consistent obedience to God—integrity—attainable in this world of sin and self? By the grace and power of God, yes! One of the nation's most respected pastors points the way to persevering character in Christ. Drawing from scriptural examples of godly men who modeled integrity during severe testing, MacArthur makes a compelling case for the impact a man or woman of integrity can have in our world. A helpful study guide for individuals or groups is included.
Author: George Antaki
Publisher: Butterworth-Heinemann
ISBN: 0124173063
Category : Business & Economics
Languages : en
Pages : 355
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Book Description
One of the most critical requirements for safe and reliable nuclear power plant operations is the availability of competent maintenance personnel. However, just as the nuclear power industry is experiencing a renaissance, it is also experiencing an exodus of seasoned maintenance professionals due to retirement. The perfect guide for engineers just entering the field or experienced maintenance supervisors who need to keep abreast of the latest industry best practices, Nuclear Power Plant Maintenance: Mechanical Systems, Equipment and Safety covers the most common issues faced in day-to-day operations and provides practical, technically proven solutions. The book also explains how to navigate the various maintenance codes, standards and regulations for the nuclear power industry. - Discusses 50 common issues faced by engineers in the nuclear power plant field - Provides advice for complying with international codes and standards (including ASME) - Describes safety classification for systems and components - Includes case studies to clearly explain the lessons learned over decades in the nuclear power industry
