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Author: Andrey Mezhiba
Publisher: Springer Science & Business Media
ISBN: 146150399X
Category : Technology & Engineering
Languages : en
Pages : 287
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Book Description
Distributing power in high speed, high complexity integrated circuits has become a challenging task as power levels exceeding tens of watts have become commonplace while the power supply is plunging toward one volt. This book is dedicated to this important subject. The primary purpose of this monograph is to provide insight and intuition into the behavior and design of power distribution systems for high speed, high complexity integrated circuits.
Author: Andrey Mezhiba
Publisher: Springer Science & Business Media
ISBN: 146150399X
Category : Technology & Engineering
Languages : en
Pages : 287
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Book Description
Distributing power in high speed, high complexity integrated circuits has become a challenging task as power levels exceeding tens of watts have become commonplace while the power supply is plunging toward one volt. This book is dedicated to this important subject. The primary purpose of this monograph is to provide insight and intuition into the behavior and design of power distribution systems for high speed, high complexity integrated circuits.
Author: Mikhail Popovich
Publisher: Springer Science & Business Media
ISBN: 0387716017
Category : Technology & Engineering
Languages : en
Pages : 532
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Book Description
This book provides insight into the behavior and design of power distribution systems for high speed, high complexity integrated circuits. Also presented are criteria for estimating minimum required on-chip decoupling capacitance. Techniques and algorithms for computer-aided design of on-chip power distribution networks are also described; however, the emphasis is on developing circuit intuition and understanding the principles that govern the design and operation of power distribution systems.
Author: Renatas Jakushokas
Publisher: Springer Science & Business Media
ISBN: 1441978712
Category : Technology & Engineering
Languages : en
Pages : 636
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Book Description
This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power distribution systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this second edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.
Author: Inna P. Vaisband
Publisher: Springer
ISBN: 3319293958
Category : Technology & Engineering
Languages : en
Pages : 750
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Book Description
This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power delivery and management systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this fourth edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.
Author: Yehea I. Ismail
Publisher: Springer Science & Business Media
ISBN: 1461516854
Category : Technology & Engineering
Languages : en
Pages : 310
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Book Description
The appropriate interconnect model has changed several times over the past two decades due to the application of aggressive technology scaling. New, more accurate interconnect models are required to manage the changing physical characteristics of integrated circuits. Currently, RC models are used to analyze high resistance nets while capacitive models are used for less resistive interconnect. However, on-chip inductance is becoming more important with integrated circuits operating at higher frequencies, since the inductive impedance is proportional to the frequency. The operating frequencies of integrated circuits have increased dramatically over the past decade and are expected to maintain the same rate of increase over the next decade, approaching 10 GHz by the year 2012. Also, wide wires are frequently encountered in important global nets, such as clock distribution networks and in upper metal layers, and performance requirements are pushing the introduction of new materials for low resistance interconnect, such as copper interconnect already used in many commercial CMOS technologies. On-Chip Inductance in High Speed Integrated Circuits deals with the design and analysis of integrated circuits with a specific focus on on-chip inductance effects. It has been described throughout this book that inductance can have a tangible effect on current high speed integrated circuits. For example, neglecting inductance and using an RC interconnect model in a production 0.25 mum CMOS technology can cause large errors (over 35%) in estimates of the propagation delay of on-chip interconnect. It has also been shown that including inductance in the repeater insertion design process as compared to using an RC model improves the overall repeater solution in terms of area, power, and delay with average savings of 40.8%, 15.6%, and 6.7%, respectively. On-Chip Inductance in High Speed Integrated Circuits is full of design and analysis techniques for RLC interconnect. These techniques are compared to techniques traditionally used for RC interconnect design to emphasize the effect of inductance. emOn-Chip Inductance in High Speed Integrated Circuits will be of interest to researchers in the area of high frequency interconnect, noise, and high performance integrated circuit design.
Author: Andrey Mezhiba
Publisher:
ISBN: 9781461504009
Category :
Languages : en
Pages : 308
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Book Description
Author: Vasilis F. Pavlidis
Publisher: Morgan Kaufmann
ISBN: 0080921868
Category : Technology & Engineering
Languages : en
Pages : 324
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Book Description
With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future. This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing effective solutions to specific challenging problems concerning the design of 3-D integrated circuits. A handy, comprehensive reference or a practical design guide, this book provides a sound foundation for the design of 3-D integrated circuits. Demonstrates how to overcome "interconnect bottleneck" with 3-D integrated circuit design...leading edge design techniques offer solutions to problems (performance/power consumption/price) faced by all circuit designers The FIRST book on 3-D integrated circuit design...provides up-to-date information that is otherwise difficult to find Focuses on design issues key to the product development cycle...good design plays a major role in exploiting the implementation flexibilities offered in the 3-D Provides broad coverage of 3-D integrated circuit design, including interconnect prediction models, thermal management techniques, and timing optimization...offers practical view of designing 3-D circuits
Author: Istvan Novak
Publisher: Intl. Engineering Consortiu
ISBN: 9781931695657
Category : Computers
Languages : en
Pages : 578
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Book Description
A series of cogently written articles by 49 industry experts, this collection fills the void on Power Distribution Network (PDN) design procedures, and addresses such related topics as DC–DC converters, selection of bypass capacitors, DDR2 memory systems, powering of FPGAs, and synthesis of impedance profiles. Through these contributions from such leading companies as Sun Microsystems, Sanyo, IBM, Hewlett-Packard, Intel, and Rambus, readers will come to understand why books on power integrity are only now becoming available to the public and can relate these topics to current industry trends.
Author: Vassilis Paliouras
Publisher: Springer Science & Business Media
ISBN: 3540290133
Category : Computers
Languages : en
Pages : 767
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Book Description
This book constitutes the refereed proceedings of the 15th International Workshop on Power and Timing Optimization and Simulation, PATMOS 2005, held in Leuven, Belgium in September 2005. The 74 revised full papers presented were carefully reviewed and selected from numerous submissions. The papers are organized in topical sections on low-power processors, code optimization for low-power, high-level design, telecommunications and signal processing, low-power circuits, system-on-chip design, busses and interconnections, modeling, design automation, low-power techniques, memory and register files, applications, digital circuits, and analog and physical design.
Author: Qing K. Zhu
Publisher: John Wiley & Sons
ISBN: 9780471657200
Category : Technology & Engineering
Languages : en
Pages : 232
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Book Description
A hands-on troubleshooting guide for VLSI network designers The primary goal in VLSI (very large scale integration) power network design is to provide enough power lines across a chip to reduce voltage drops from the power pads to the center of the chip. Voltage drops caused by the power network's metal lines coupled with transistor switching currents on the chip cause power supply noises that can affect circuit timing and performance, thus providing a constant challenge for designers of high-performance chips. Power Distribution Network Design for VLSI provides detailed information on this critical component of circuit design and physical integration for high-speed chips. A vital tool for professional engineers (especially those involved in the use of commercial tools), as well as graduate students of engineering, the text explains the design issues, guidelines, and CAD tools for the power distribution of the VLSI chip and package, and provides numerous examples for its effective application. Features of the text include: * An introduction to power distribution network design * Design perspectives, such as power network planning, layout specifications, decoupling capacitance insertion, modeling, and analysis * Electromigration phenomena * IR drop analysis methodology * Commands and user interfaces of the VoltageStorm(TM) CAD tool * Microprocessor design examples using on-chip power distribution * Flip-chip and package design issues * Power network measurement techniques from real silicon The author includes several case studies and a glossary of key words and basic terms to help readers understand and integrate basic concepts in VLSI design and power distribution.
