Polymeric Materials for Electronics Packaging and Interconnection PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download Polymeric Materials for Electronics Packaging and Interconnection PDF full book. Access full book title Polymeric Materials for Electronics Packaging and Interconnection by . Download full books in PDF and EPUB format.
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 499
Get Book Here
Book Description
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 499
Get Book Here
Book Description
Author: John H. Lupinski
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 520
Get Book Here
Book Description
From a symposium of the ACS 196th meeting, Los Angeles, CA, Sept. 1988. Thirty-nine chapters cover a broad spectrum of topics in four general areas: physical chemistry of materials, properties and applications of encapsulants and gels, and printed circuit board substrates and materials. Also includes a review of the marketing trends which drive packaging technology. Annotation copyrighted by Book News, Inc., Portland, OR
Author: John R. Susko
Publisher:
ISBN:
Category : Electrochemistry
Languages : en
Pages : 228
Get Book Here
Book Description
Author: C. P. Wong
Publisher: Elsevier
ISBN: 1483289397
Category : Technology & Engineering
Languages : en
Pages : 676
Get Book Here
Book Description
The most recent advances in the use of polymeric materials by the electronic industry can be found in Polymers for Electronic and Photonic Applications. This bookprovides in-depth coverage of photoresis for micro-lithography, microelectronic encapsulants and packaging, insulators, dielectrics for multichip packaging,electronic and photonic applications of polymeric materials, among many other topics. Intended for engineers and scientists who design, process, and manufacturemicroelectronic components, this book will also prove useful for hybrid and systems packaging managers who want to be informed of the very latest developments inthis field.* Presents most recent advances in the use of polymeric materials by the electronic industry* Contributions by foremost experts in the field
Author: Deborah D.L. Chung
Publisher: Elsevier
ISBN: 0080511171
Category : Technology & Engineering
Languages : en
Pages : 383
Get Book Here
Book Description
Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems. - Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors - Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science - Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems
Author: James E. Morris
Publisher: Springer Science & Business Media
ISBN: 9400904398
Category : Technology & Engineering
Languages : en
Pages : 459
Get Book Here
Book Description
Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.
Author: Zulkifli Ahmad
Publisher: Elsevier
ISBN: 0323983901
Category : Technology & Engineering
Languages : en
Pages : 450
Get Book Here
Book Description
Polymers in Electronics: Optoelectronic Properties, Design, Fabrication, and Applications brings together the fundamentals and latest advances in polymeric materials for electronic device applications, supporting researchers, scientists and advanced students, and approaching the topic from a range of disciplines. The book begins by introducing polymeric materials, their dielectric, optical, and thermal properties, and the essential principles and techniques for polymers as applied to electronics. This is followed by detailed coverage of the key steps in the preparation of polymeric materials for opto-electronic devices, including fabrication methods, materials design, rheology, encapsulation, and conductive polymer mechanisms. The final part of the book focuses on the latest developments in advanced devices, covering the areas of photovoltaics, transistors, light-emitting diodes, and stretchable electronics. In addition, it explains mechanisms, design, fabrication techniques, and end applications. This is a highly valuable resource for researchers, advanced students, engineers and R&D professionals from a range of disciplines. Offers introductory coverage of polymeric materials for electronics, including principles, design, properties, fabrication and applications Focuses on key issues such as materials selection, structure-property relationships and challenges in application Explores advanced applications of polymers in photovoltaics, transistors, sensors, light-emitting diodes and stretchable electronics
Author: M. Goosey
Publisher: Springer Science & Business Media
ISBN: 9400949421
Category : Science
Languages : en
Pages : 386
Get Book Here
Book Description
Much of the progress towards ever greater miniaturisation made by the electronics industry, from the early days of valves to the development of the transistor and later the integrated circuit, has only been made possible because of the availability of various polymeric materials. Indeed, many new plastics have been developed specifically for electri cal and electronic device applications and as a consequence the plastics and electronics industries have continued to grow side-by-side. Electronic components are one of the few groups of products in which the real cost performance function has declined significantly over the years, and part of the reason can be directly attributed to the availability and performance of new polymeric materials. The evolu tion of the personal computer is a specific example, where improve ments in polymer-based photoresists and plastic encapsulation techni ques have allowed the mass production of high-density memories and microprocessors at a cost which yields machines more powerful than mainframe computers of 30 years ago for little more than the price of a toy. Today, plastic materials are widely used throughout all areas of electrical and electronic device production in diverse applications ranging from alpha particle barriers on memory devices to insulator mouldings for the largest bushings and transformers. Plastics, or more correctly polymers, find use as packaging materials for individual microcircuits, protective coatings, wire and cable insulators, printed circuit board components, die attach adhesives, equipment casings and a host of other applications.
Author: Andrew E Fletcher
Publisher: Elsevier
ISBN: 1483165612
Category : Science
Languages : en
Pages : 231
Get Book Here
Book Description
Advanced Organics for Electronic Substrates and Packages provides information on packaging, which is one of the most technologically intensive activities in the electronics industry. The electronics packaging community has realized that while semiconductor devices continue to be improved upon for performance, cost, and reliability, it is the interconnection or packaging of these devices that will limit the performance of the systems. Technology must develop packaging for transistor chips, with high levels of performance and integration providing cooling, power, and interconnection, and yet preserve the performance of the semiconductors with minimum package delay to the system. Trends in each of the major packaging technologies include chip level connection, providing the required connections between the chip and the semiconductor package. The power distribution to the chip and heat removal from the chip; first level packages providing all the necessary wiring; interconnections and power distribution; first-to-second level interconnections; and second level packages providing all the necessary wiring, connections, power distribution, and power supply connection are included as well. This book is a useful and informative reference to students or individuals studying or conducting research within the field of electronic engineering.
Author: Charles E. Carraher Jr.
Publisher: Springer Science & Business Media
ISBN: 1461306698
Category : Science
Languages : en
Pages : 506
Get Book Here
Book Description
Research on metal-containing polymers began in the early 1960's when several workers found that vinyl ferrocene and other vinylic transition metal TI -complexes would undergo polymerization under the same conditions as conventional organic monomers to form high polymers which incorporated a potentially reactive metal as an integral part of the polymer structures. Some of these materials could act as semi conductors and possessed one or two dimensional conductivity. Thus applications in electronics could be visualized immediately. Other workers found that reactions used to make simple metal chelates could be used to prepare polymers if the ligands were designed properly. As interest in homogeneous catalysts developed in the late 60's and early 70's, several investigators began binding homogeneous catalysts onto polymers, where the advantage of homogeneous catalysis - known reaction mechanisms and the advantage of heterogeneous catalysis - simplicity and ease of recovery of catalysts could both be obtained. Indeed the polymer matrix itself often enhanced the selectivity of the catalyst. The first symposium on Organometallic Polymers, held at the National Meeting of the American Chemical Society in September 1977, attracted a large number of scientists interested in this field, both established investigators and newcomers. Subsequent symposia in 1977, 1979, 1983, and 1987 have seen the field mature. Hundreds of papers and patents have been published.
