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Author:
Publisher: iSmithers Rapra Publishing
ISBN: 9781859574461
Category : Technology & Engineering
Languages : en
Pages : 168
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Book Description
Rapra Technology Limited launched its first conference focusing on the bonding of both rubber and plastics to various substrates. The conference aimed to widen the area of discussion from a purely rubber or purely plastic based topic to include those additional related bonding application areas. Papers discussing bonding within the polymer industries and from academic researchers will enable the reader to more fully understand the problems and their solutions for the bonding between polymers and a wide range of substrates. Topics covered at Polymer Bonding 2004 include: latest material advances, new processing technologies, analysis of bonding techniques, progress in application technology, formulation advancement and business and industry issues. List Of Papers...Session 1: Technology Overview; A Review of Recent Developments in Bonding of Steel Products for Rubbers and Plastics Reinforcement Dr Daniel Mauer, N.V. Bekaert S.A. Bonds Factor: Effects from Processing and Chemistry Mr RJ DelVecchio, Technical Consulting Services, USA; Quantum Leap in Polymer Innovation Performance through Advanced Technology Management Dr Wolfram Keller, P R T M, Germany; Session 2: Polymer Bonding Analysis; Can Test Pieces Predict Component Performance? Dr Marina Fernando, Charles Forge & Jonathan Clarke, TARRC, UK; The Development and Exploitation of Accelerated Durability Tests - The; new ASTM D429 Method G immersion Test and Potential Future Developments; Mr Peter Hansen, MERL, UK; Analysis of Adhesion Differences by Nano-Indentation and Cure Kinetics; in a Rubber-Glass Composite Dr Chris Stevens, NGF Europe Ltd, UK; Session 3: Novel Bonding Techniques And Applications; Self-Adhesive Silicone Rubber: High Speed Processing in Conventional; Injection Moulding Dr Sascha Buechel, Wacker-Chemie GmbH, Germany; +++ Paper Unavailable At Time Of Print +++; Bonding Cellulosic Substrates to Polyolefins without Corona treatment; or use of a Primer. Greece; A Shift Toward Two Component Adhesive Packaging that Fits in Standard; Caulking Guns Ms Meghann Horner & Crispin Dean, TAH Europe Inc, UK &; Dan Mottram, TAH Industries, USA; Hybrid Nonisocyanate Polyurethane Adhesives; Prof. Oleg Figovsky, EFM -Enviromentally Friendly Materials GmbH; Germany; Bonding Plastics with Cyanoacrylates and UV Curing Adhesives Mr Bob; Goss, Henkel Loctite Adhesives Ltd, UK; Session 4: Developments In Bonding Technology; Reactive Fluid Bonding Systems; Dr Daniel L Neuman, DuPont Dow Elastomers, USA; Water Based Bonding Agents; Mr Greg Rawlinson & Dr Keith Worthington, Chemical Innovations Limited; (CIL), UK; Aramid as Reinforcement in TPE's: A Method for Measuring Adhesion Ms; Annamarie Zuuring, Teijin Twaron BV, The Netherlands; +++ Paper Unavaiable At Time Of Print +++; Non-Hygroscopic Polyamide Bonding TPV; Mr Synco de Vogel, Solvay Engineered Polymers GmbH, Germany; +++ Paper Unavaiable At Time Of Print +++; Hard-Soft Combinations with Silicone Rubber - Innovative Technical; Solutions Dr Joachim Hegge, & Stefan Rist, GE Bayer Silicone GmbH & Co.; Automotive; Parts Production Mr Aissa Benarous, Chemical Innovations Limited (CIL); UK; Rapra Technology 2004
Author:
Publisher: iSmithers Rapra Publishing
ISBN: 9781859574461
Category : Technology & Engineering
Languages : en
Pages : 168
Get Book Here
Book Description
Rapra Technology Limited launched its first conference focusing on the bonding of both rubber and plastics to various substrates. The conference aimed to widen the area of discussion from a purely rubber or purely plastic based topic to include those additional related bonding application areas. Papers discussing bonding within the polymer industries and from academic researchers will enable the reader to more fully understand the problems and their solutions for the bonding between polymers and a wide range of substrates. Topics covered at Polymer Bonding 2004 include: latest material advances, new processing technologies, analysis of bonding techniques, progress in application technology, formulation advancement and business and industry issues. List Of Papers...Session 1: Technology Overview; A Review of Recent Developments in Bonding of Steel Products for Rubbers and Plastics Reinforcement Dr Daniel Mauer, N.V. Bekaert S.A. Bonds Factor: Effects from Processing and Chemistry Mr RJ DelVecchio, Technical Consulting Services, USA; Quantum Leap in Polymer Innovation Performance through Advanced Technology Management Dr Wolfram Keller, P R T M, Germany; Session 2: Polymer Bonding Analysis; Can Test Pieces Predict Component Performance? Dr Marina Fernando, Charles Forge & Jonathan Clarke, TARRC, UK; The Development and Exploitation of Accelerated Durability Tests - The; new ASTM D429 Method G immersion Test and Potential Future Developments; Mr Peter Hansen, MERL, UK; Analysis of Adhesion Differences by Nano-Indentation and Cure Kinetics; in a Rubber-Glass Composite Dr Chris Stevens, NGF Europe Ltd, UK; Session 3: Novel Bonding Techniques And Applications; Self-Adhesive Silicone Rubber: High Speed Processing in Conventional; Injection Moulding Dr Sascha Buechel, Wacker-Chemie GmbH, Germany; +++ Paper Unavailable At Time Of Print +++; Bonding Cellulosic Substrates to Polyolefins without Corona treatment; or use of a Primer. Greece; A Shift Toward Two Component Adhesive Packaging that Fits in Standard; Caulking Guns Ms Meghann Horner & Crispin Dean, TAH Europe Inc, UK &; Dan Mottram, TAH Industries, USA; Hybrid Nonisocyanate Polyurethane Adhesives; Prof. Oleg Figovsky, EFM -Enviromentally Friendly Materials GmbH; Germany; Bonding Plastics with Cyanoacrylates and UV Curing Adhesives Mr Bob; Goss, Henkel Loctite Adhesives Ltd, UK; Session 4: Developments In Bonding Technology; Reactive Fluid Bonding Systems; Dr Daniel L Neuman, DuPont Dow Elastomers, USA; Water Based Bonding Agents; Mr Greg Rawlinson & Dr Keith Worthington, Chemical Innovations Limited; (CIL), UK; Aramid as Reinforcement in TPE's: A Method for Measuring Adhesion Ms; Annamarie Zuuring, Teijin Twaron BV, The Netherlands; +++ Paper Unavaiable At Time Of Print +++; Non-Hygroscopic Polyamide Bonding TPV; Mr Synco de Vogel, Solvay Engineered Polymers GmbH, Germany; +++ Paper Unavaiable At Time Of Print +++; Hard-Soft Combinations with Silicone Rubber - Innovative Technical; Solutions Dr Joachim Hegge, & Stefan Rist, GE Bayer Silicone GmbH & Co.; Automotive; Parts Production Mr Aissa Benarous, Chemical Innovations Limited (CIL); UK; Rapra Technology 2004
Author: G. Polaski
Publisher: iSmithers Rapra Publishing
ISBN: 9781859574959
Category : Science
Languages : en
Pages : 154
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Book Description
This review has been written as a practical approach to bonding various kinds of elastomers to substrates such as steel and plastics, as used in the manufacture of diverse products such as rubber covered rolls, urethane fork lift wheels, rubber lining for chemical storage or solid rocket motors, engine bushes and mounts, seals for transmissions, electrical power connectors and military tank track pads. Based on the authors' years of experience working closely with end-use customers and it offers a thorough overview of how to successfully bond rubber to a given substrate in the manufacture of quality rubber engineered components. This review is supported by an indexed section containing several hundred key references and abstracts selected from the Rapra Abstracts database.
Author: Masayoshi Esashi
Publisher: John Wiley & Sons
ISBN: 3527823255
Category : Technology & Engineering
Languages : en
Pages : 528
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Book Description
Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Author: Vikas Mittal
Publisher: CRC Press
ISBN: 1439856702
Category : Technology & Engineering
Languages : en
Pages : 345
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Book Description
With their broad range of properties, polymer blends are widely used in adhesion, colloidal stability, the design of composite and biocompatible materials, and other areas. As the science and technology of polymer blends advances, an increasing number of polymer blend systems and applications continue to be developed. Functional Polymer Blends: Syn
Author: Sabu Thomas
Publisher: Elsevier
ISBN: 0128040858
Category : Technology & Engineering
Languages : en
Pages : 440
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Book Description
Polyurethane Polymers: Blends and Interpenetrating Networks deals with almost all aspects of blends and IPNs formed by polyurethane, including the thermal, mechanical, morphological, and viscoelastic properties of each blend presented in the book. In addition, major applications related to these blends and IPNs are mentioned. - Provides an elaborate coverage of the chemistry of polyurethane, including its synthesis and properties - Includes available characterization techniques - Relates types of polyurethanes to their potential properties - Discusses blends options
Author: Oleg Figovsky
Publisher: CRC Press
ISBN: 1466590327
Category : Science
Languages : en
Pages : 270
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Book Description
One way of improving performance attributes of building structures is to use a new class of materials—polymer composites. They have unique properties that combine high strength with features of non-metallic materials. Polymer concretes (PC) appear to offer many possibilities for producing new materials with desired physical and mechanical characteristics, such as improved mechanical strength, low permeability, and greater chemical resistance. Advanced Polymer Concretes and Compounds presents the results of theoretical and experimental research on efficient building material composites based on advanced polymer binders. This book examines the composition and properties of two new polymer concretes that have potential to solve various construction issues: rubber concrete based on a polybutadiene binder and silicate polymer concrete with an organo-silicate matrix. It examines the physical, mechanical, and technological properties of these PCs as well as their behavior in harsh environments and durability and reliability issues. The authors describe a new environmentally friendly polymer for monolithic industrial floor coverings and coatings—nonisocyanate polyurethanes. They also discuss advanced crack-resistant coatings based on water dispersion of chlorosulfonated polyethylene, which can be used on concrete, metal, and plastic for various industrial uses such as aircraft, automobiles, paint, and in shipbuilding and civil engineering. The book covers a new type of epoxy composition with nano-heterogenic structure with potential for better mechanical properties and chemical resistance, acid-resistant building materials based on a nanostructured binder, and an advanced environmentally friendly and weather-resistant fire-protective coating for indoor and outdoor application to flammable substrates. With a focus on novel concretes and protective compounds for a variety of environments, this book reflects the newest developments in the rapidly growing field of building materials engineering.
Author: A. Al-Shawaf
Publisher: Elsevier Inc. Chapters
ISBN: 0128088400
Category : Technology & Engineering
Languages : en
Pages : 47
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Book Description
This chapter addresses all aspects pertaining to stresses inherent within civil applications of advanced composites, particularly the critical interfacial adhesive stresses usually controlling the design strength for externally bonded FRP composites. Informed discussions and explanations are presented on influential aspects closely affecting the distribution and magnitude of interfacial stresses along the bondline. Traditional and promising experimental methods for stress estimation are addressed, together with a corresponding brief literature review highlighting their evolution and practical advantages and disadvantages. Theoretical and numerical methods for interfacial stress analyses are also reviewed for different FRP bonding applications, and their stress prediction capabilities are verified with experimental validations. Finally, key conclusions and recommendations for future trends in the stress characterizations of adhesive joints are provided.
Author: Peter Ramm
Publisher: John Wiley & Sons
ISBN: 3527644237
Category : Technology & Engineering
Languages : en
Pages : 435
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Book Description
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Author: Vincent Rotello
Publisher: John Wiley & Sons
ISBN: 0470384042
Category : Science
Languages : en
Pages : 492
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Book Description
State-of-the-art techniques for tapping the vast potential of polymers The use of specific non-covalent interactions to control polymer structure and properties is a rapidly emerging field with applications in diverse disciplines. Molecular Recognition and Polymers covers the fundamental aspects and applications of molecular recognition—in the creation of novel polymeric materials for use in drug delivery, sensors, tissue engineering, molecular imprinting, and other areas. This reference begins by explaining the fundamentals of supramolecular polymers; it progresses to cover polymer formation and self-assembly with a wide variety of examples, and then includes discussions of biomolecular recognition using polymers. With chapters contributed by the foremost experts in their fields, this resource: Provides an integrated resource for supramolecular chemistry, polymer science, and interfacial science Covers advanced, state-of-the-art techniques used in the design and characterization of non-covalent interactions in polymers Illustrates how to tailor the properties of polymeric materials for various applications Stand-alone chapters address specific applications independently for easy reference. This is a premier resource for graduate students and researchers in polymer chemistry, supramolecular chemistry, materials science, and physical organic chemistry.
Author: Sebastian Seiffert
Publisher: Springer
ISBN: 3319154044
Category : Technology & Engineering
Languages : en
Pages : 293
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Book Description
The series Advances in Polymer Science presents critical reviews of the present and future trends in polymer and biopolymer science. It covers all areas of research in polymer and biopolymer science including chemistry, physical chemistry, physics, material science. The thematic volumes are addressed to scientists, whether at universities or in industry, who wish to keep abreast of the important advances in the covered topics. Advances in Polymer Science enjoys a longstanding tradition and good reputation in its community. Each volume is dedicated to a current topic and each review critically surveys one aspect of that topic, to place it within the context of the volume. The volumes typically summarize the significant developments of the last 5 to 10 years and discuss them critically, presenting selected examples, explaining and illustrating the important principles and bringing together many important references of primary literature. On that basis, future research directions in the area can be discussed. Advances in Polymer Science volumes thus are important references for every polymer scientist, as well as for other scientists interested in polymer science - as an introduction to a neighboring field, or as a compilation of detailed information for the specialist. Review articles for the individual volumes are invited by the volume editors. Single contributions can be specially commissioned. Readership: Polymer scientists, or scientists in related fields interested in polymer and biopolymer science, at universities or in industry, graduate students.
