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Author: Sombel Diaham
Publisher: BoD – Books on Demand
ISBN: 1838800972
Category : Technology & Engineering
Languages : en
Pages : 336
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Book Description
Polyimide is one of the most efficient polymers in many industries for its excellent thermal, electrical, mechanical, and chemical properties as well as its easy processability. In the electronic and electrical engineering industries, polyimide has widely been used for decades thanks to its very good dielectric and insulating properties at the high electric field and at high temperatures of around 200°C in long term-service. Moreover, polyimide appears essential for the development of new electronic devices where further considerations such as high power density, integration, higher temperature, thermal conduction management, energy storage, reliability, or flexibility are required in order to sustain the growing global electrical energy consumption. This book gathers interdisciplinary chapters on polyimide in various topics through state-of-the-art and original ongoing research.
Author: Sombel Diaham
Publisher: BoD – Books on Demand
ISBN: 1838800972
Category : Technology & Engineering
Languages : en
Pages : 336
Get Book Here
Book Description
Polyimide is one of the most efficient polymers in many industries for its excellent thermal, electrical, mechanical, and chemical properties as well as its easy processability. In the electronic and electrical engineering industries, polyimide has widely been used for decades thanks to its very good dielectric and insulating properties at the high electric field and at high temperatures of around 200°C in long term-service. Moreover, polyimide appears essential for the development of new electronic devices where further considerations such as high power density, integration, higher temperature, thermal conduction management, energy storage, reliability, or flexibility are required in order to sustain the growing global electrical energy consumption. This book gathers interdisciplinary chapters on polyimide in various topics through state-of-the-art and original ongoing research.
Author: Kash L. Mittal
Publisher: CRC Press
ISBN: 9067644226
Category : Technology & Engineering
Languages : en
Pages : 582
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Book Description
This volume chronicles the proceedings of the Third International Symposium on Polyimides and Other High Temperature Polymers: Synthesis, Characterization, and Applications, held in Orlando, December 17-19, 2003. This volume is divided into three parts. Part 1. “Synthesis, Properties and Bulk Characterization”; Part 2 “Hybrids and Composites” and Part 3 “Applications and General Papers”. The topics covered include: Synthesis, characterization and processing (including some novel approaches) of a variety of polyimides and other high temperature polymers; structure-property relationships; hybrids and nanocomposites using these materials and their characterization, properties and applications; segmental dynamics in polyimide materials; photoalignable polyimides; photoconductivity and photosensitivity of polyimides; ultrafiltration membranes from polyetherimide; polyimide as a tunneling barrier; polymer materials for nonlinear optical applications; alignment of SWNTs in rigid-rod polymer compositions; surface modification of polyimide; adhesion of Cu to polyimide surfaces; and polyimide erosion in a low Earth orbit space environment.
Author: J.H. Lai
Publisher: CRC Press
ISBN: 1351084356
Category : Mathematics
Languages : en
Pages : 247
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Book Description
The object of this book is to review and to discuss some important applications of polymers in electronics. The first three chapters discuss the current primary applications of polymers in semiconductor device manufacturing: polymers as resist materials for integrated circuit fabrication, polyimides as electronics packaging materials, and polymers as integrated circuits encapsulates.
Author: B. P. Nandeshwarappa
Publisher: BoD – Books on Demand
ISBN: 1839698845
Category : Technology & Engineering
Languages : en
Pages : 110
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Book Description
Polyimides are a new generation of polymers that exhibit excellent mechanical, thermal, chemical, and electrical properties. Hence, they are highly reliable with little change in physical properties over a long time. They are currently used for practical applications in aerospace, energy, automotive, and electronics industries. This book presents a comprehensive overview of polyimides, including their properties, synthesis, and applications, as well as future research directions and challenges.
Author: Shi-Yong Yang
Publisher: Elsevier
ISBN: 0128126418
Category : Technology & Engineering
Languages : en
Pages : 499
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Book Description
Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research. The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation. - Reviews the latest research, development and future prospective of polyimides - Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers - Presents a highly organized work that is composed of different sections that are easily compared
Author: C. P. Wong
Publisher: Elsevier
ISBN: 1483289397
Category : Technology & Engineering
Languages : en
Pages : 676
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Book Description
The most recent advances in the use of polymeric materials by the electronic industry can be found in Polymers for Electronic and Photonic Applications. This bookprovides in-depth coverage of photoresis for micro-lithography, microelectronic encapsulants and packaging, insulators, dielectrics for multichip packaging,electronic and photonic applications of polymeric materials, among many other topics. Intended for engineers and scientists who design, process, and manufacturemicroelectronic components, this book will also prove useful for hybrid and systems packaging managers who want to be informed of the very latest developments inthis field.* Presents most recent advances in the use of polymeric materials by the electronic industry* Contributions by foremost experts in the field
Author: R.R. Tummala
Publisher: Springer Science & Business Media
ISBN: 1461560373
Category : Computers
Languages : en
Pages : 1060
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Book Description
Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Author: Malay Ghosh
Publisher: CRC Press
ISBN: 1351423649
Category : Technology & Engineering
Languages : en
Pages : 920
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Book Description
Provides coverage on the full range of topics associated with polyimides, including structure, polymer fundamentals, and product areas. The text addresses both basic and applied aspects of the subject. It details the synthesis of polyimides, polyamideimides, and flourinated polyimides, explains the molecular design of photosensitive polyimides, and more.
Author: Kash L. Mittal
Publisher: CRC Press
ISBN: 9047424115
Category : Science
Languages : en
Pages : 436
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Book Description
This volume documents the proceedings of the "Second International Symposium on Polyimides and Other High Temperature Polymers: Synthesis, Characterization and Applications, held in Newark, New Jersey, December 3-6, 2001. Polyimides possess many desirable attributes, so this class of materials has found applications in many technologies ranging fro
Author: Hanna Dodiuk
Publisher: William Andrew
ISBN: 0323899943
Category : Technology & Engineering
Languages : en
Pages : 1118
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Book Description
Handbook of Thermoset Plastics, Fourth Edition provides complete coverage of the chemical processes, manufacturing techniques and design properties of each polymer, along with its applications. This new edition has been expanded to include the latest developments in the field, with new chapters on radiation curing, biological adhesives, vitrimers, and 3D printing. This detailed handbook considers the practical implications of using thermoset plastics and the relationships between processing, properties and applications, as well as analyzing the strengths and weakness of different methods and applications.The aim of the book is to help the reader to make the right decision and take the correct action on the basis of informed analysis – avoiding the pitfalls the authors' experience has uncovered. In industry, the book supports engineers, scientists, manufacturers and R&D professionals working with plastics. The information included will also be of interest to researchers and advanced students in plastics engineering, polymer chemistry, adhesives and coatings. - Offers a systematic approach, guiding the reader through chemistry, processing methods, properties and applications of thermosetting polymers - Includes thorough updates that discuss current practice and the new developments on biopolymers, nanotechnology, 3D printing, radiation curing and biological adhesives - Uses case studies to demonstrate how particular properties make different polymers suitable for different applications - Covers end-use and safety considerations
