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Author: Mitsuharu Konuma
Publisher: Springer Science & Business Media
ISBN: 3642845118
Category : Science
Languages : en
Pages : 234
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Book Description
Properties of thin films depend strongly upon the deposition technique and conditions chosen. In order to achieve the desired film, optimum deposition conditions have to be found by carrying out experiments in a trial-and error fashion with varying parameters. The data obtained on one growth apparatus are often not transferable to another. This is especially true for film deposition processes using a cold plasma because of our poor under standing of the mechanisms. Relatively precise studies have been carried out on the role that physical effects play in film formation such as sputter deposition. However, there are many open questions regarding processes that involve chemical reactions, for example, reactive sputter deposition or plasma enhanced chemical vapor deposition. Much further research is re quired in order to understand the fundamental deposition processes. A sys tematic collection of basic data, some of which may be readily available in other branches of science, for example, reaction cross sections for gases with energetic electrons, is also required. The need for pfasma deposition techniques is felt strongly in industrial applications because these techniques are superior to traditional thin-film deposition techniques in many ways. In fact, plasma deposition techniques have developed rapidly in the semiconductor and electronics industries. Fields of possible application are still expanding. A reliable plasma reactor with an adequate in situ system for monitoring the deposition conditions and film properties must be developed to improve reproducibility and pro ductivity at the industrial level.
Author: Mitsuharu Konuma
Publisher: Springer Science & Business Media
ISBN: 3642845118
Category : Science
Languages : en
Pages : 234
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Book Description
Properties of thin films depend strongly upon the deposition technique and conditions chosen. In order to achieve the desired film, optimum deposition conditions have to be found by carrying out experiments in a trial-and error fashion with varying parameters. The data obtained on one growth apparatus are often not transferable to another. This is especially true for film deposition processes using a cold plasma because of our poor under standing of the mechanisms. Relatively precise studies have been carried out on the role that physical effects play in film formation such as sputter deposition. However, there are many open questions regarding processes that involve chemical reactions, for example, reactive sputter deposition or plasma enhanced chemical vapor deposition. Much further research is re quired in order to understand the fundamental deposition processes. A sys tematic collection of basic data, some of which may be readily available in other branches of science, for example, reaction cross sections for gases with energetic electrons, is also required. The need for pfasma deposition techniques is felt strongly in industrial applications because these techniques are superior to traditional thin-film deposition techniques in many ways. In fact, plasma deposition techniques have developed rapidly in the semiconductor and electronics industries. Fields of possible application are still expanding. A reliable plasma reactor with an adequate in situ system for monitoring the deposition conditions and film properties must be developed to improve reproducibility and pro ductivity at the industrial level.
Author: Dale M. Brown
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 0
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Book Description
Author: Werner Kern
Publisher: Elsevier
ISBN: 0080524214
Category : Technology & Engineering
Languages : en
Pages : 881
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Book Description
This sequel to the 1978 classic, Thin Film Processes, gives a clear, practical exposition of important thin film deposition and etching processes that have not yet been adequately reviewed. It discusses selected processes in tutorial overviews with implementation guide lines and an introduction to the literature. Though edited to stand alone, when taken together, Thin Film Processes II and its predecessor present a thorough grounding in modern thin film techniques. - Provides an all-new sequel to the 1978 classic, Thin Film Processes - Introduces new topics, and several key topics presented in the original volume are updated - Emphasizes practical applications of major thin film deposition and etching processes - Helps readers find the appropriate technology for a particular application
Author: Harvey C. Hoch
Publisher: Cambridge University Press
ISBN: 9780521462648
Category : Medical
Languages : en
Pages : 448
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Book Description
The book also aims to stimulate innovative, productive interactions among materials scientists, engineers, and biologists, and to explore ways in which materials scientists and engineers can exploit biological principles and biological assemblies to produce new and ever smaller devices.
Author: Joseph D Martin
Publisher: World Scientific
ISBN: 981120764X
Category : Science
Languages : en
Pages : 621
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Book Description
This book is indexed in Chemical Abstracts ServiceThis book offers a comprehensive sketch of the tools used in material research and the rich and diverse stories of how those tools came to be. We aim to give readers a sense of what tools materials researchers required in the late 20th century, and how those tools were developed and became accessible. The book is in a sense a collective biography of the components of what the philosopher of science, Ian Hacking, calls the 'instrumentarium' of materials research. Readers should gain an appreciation of the work materials researchers put into developing and using such tools, and of the tremendous variety of such tools. They should also gain some insight into the material (and hence financial) prerequisites for materials research. Materials research requires funding for the availability and maintenance of its tools; and the category of tools encompasses a broad range of substances, apparatus, institutions, and infrastructure.
Author: D. Widmann
Publisher: Springer Science & Business Media
ISBN: 366204160X
Category : Technology & Engineering
Languages : en
Pages : 355
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Book Description
This is the first book to comprehensively record the authors’ authoritative knowledge and practical experience of IC manufacturing, including the tremendous developments of recent years. With its strong application orientation, this is a must-have book for professionals in semiconductor industries.
Author: R.A. Levy
Publisher: Springer Science & Business Media
ISBN: 9400909179
Category : Technology & Engineering
Languages : en
Pages : 992
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Book Description
The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon circuits. It represents the cumulative effort of experts from academia and industry who have come together to blend their expertise into a tutorial overview and cohesive update of this rapidly expanding field. A balance of fundamental and applied contributions cover the basics of microelectronics materials and process engineering. Subjects in materials science include silicon, silicides, resists, dielectrics, and interconnect metallization. Subjects in process engineering include crystal growth, epitaxy, oxidation, thin film deposition, fine-line lithography, dry etching, ion implantation, and diffusion. Other related topics such as process simulation, defects phenomena, and diagnostic techniques are also included. This book is the result of a NATO-sponsored Advanced Study Institute (AS!) held in Castelvecchio Pascoli, Italy. Invited speakers at this institute provided manuscripts which were edited, updated, and integrated with other contributions solicited from non-participants to this AS!.
Author: Yuri P. Raizer
Publisher: CRC Press
ISBN: 135141996X
Category : Science
Languages : en
Pages : 305
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Book Description
The first publication of its kind in the field, this book describes comprehensively and systematically radio-frequency (rf) capacitive gas discharges of intermediate and low pressure and their application to gas laser excitation and to plasma processing. Text presents the physics underlying rf discharges along with techniques for obtaining such discharges, experimental methods and results, and theoretical and numerical modeling findings. Radio-Frequency Capacitive Discharges is written by well-known specialists in the field, authors of many theoretical and experimental works. They provide simple and clear discussions of complicated physical phenomena. A complete review on the state of the art is included. This interesting new book can be used as a textbook for students and postgraduates and as a comprehensive guidebook by specialists.
Author: A.J. van Roosmalen
Publisher: Springer Science & Business Media
ISBN: 148992566X
Category : Science
Languages : en
Pages : 247
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Book Description
This book has been written as part of a series of scientific books being published by Plenum Press. The scope of the series is to review a chosen topic in each volume. To supplement this information, the abstracts to the most important references cited in the text are reprinted, thus allowing the reader to find in-depth material without having to refer to many additional publications. This volume is dedicated to the field of dry (plasma) etching, as applied in silicon semiconductor processing. Although a number of books have appeared dealing with this area of physics and chemistry, these all deal with parts of the field. This book is unique in that it gives a compact, yet complete, in-depth overview of fundamentals, systems, processes, tools, and applications of etching with gas plasmas for VLSI. Examples are given throughout the fundamental sections, in order to give the reader a better insight in the meaning and magnitude of the many parameters relevant to dry etching. Electrical engineering concepts are emphasized to explain the pros and cons of reactor concepts and excitation frequency ranges. In the description of practical applications, extensive use is made of cross-referencing between processes and materials, as well as theory and practice. It is thus intended to provide a total model for understanding dry etching. The book has been written such that no previous knowledge of the subject is required. It is intended as a review of all aspects of dry etching for silicon semiconductor processing.
Author: M. Meyyappan
Publisher: The Electrochemical Society
ISBN: 9781566771368
Category : Technology & Engineering
Languages : en
Pages : 366
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Book Description
