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Author: M. Sugawara
Publisher: OUP Oxford
ISBN: 0191590290
Category : Technology & Engineering
Languages : en
Pages : 362
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Book Description
The focus of this book is the remarkable advances in understanding of low pressure RF (radio frequency) glow discharges. A basic analytical theory and plasma physics are explained. Plasma diagnostics are also covered before the practicalities of etcher use are explored.
Author: M. Sugawara
Publisher: OUP Oxford
ISBN: 0191590290
Category : Technology & Engineering
Languages : en
Pages : 362
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Book Description
The focus of this book is the remarkable advances in understanding of low pressure RF (radio frequency) glow discharges. A basic analytical theory and plasma physics are explained. Plasma diagnostics are also covered before the practicalities of etcher use are explored.
Author: Kazuo Nojiri
Publisher: Springer
ISBN: 3319102958
Category : Technology & Engineering
Languages : en
Pages : 126
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Book Description
This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc.
Author: Dennis M.. Manos
Publisher:
ISBN:
Category : Plasma etching
Languages : en
Pages : 0
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Book Description
Author: R.J. Shul
Publisher: Springer Science & Business Media
ISBN: 3642569897
Category : Technology & Engineering
Languages : en
Pages : 664
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Book Description
Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of the cornerstone techniques for modern integrated cir cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed "trial-and-error" approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved.
Author: A.J. van Roosmalen
Publisher: Springer Science & Business Media
ISBN: 148992566X
Category : Science
Languages : en
Pages : 247
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Book Description
This book has been written as part of a series of scientific books being published by Plenum Press. The scope of the series is to review a chosen topic in each volume. To supplement this information, the abstracts to the most important references cited in the text are reprinted, thus allowing the reader to find in-depth material without having to refer to many additional publications. This volume is dedicated to the field of dry (plasma) etching, as applied in silicon semiconductor processing. Although a number of books have appeared dealing with this area of physics and chemistry, these all deal with parts of the field. This book is unique in that it gives a compact, yet complete, in-depth overview of fundamentals, systems, processes, tools, and applications of etching with gas plasmas for VLSI. Examples are given throughout the fundamental sections, in order to give the reader a better insight in the meaning and magnitude of the many parameters relevant to dry etching. Electrical engineering concepts are emphasized to explain the pros and cons of reactor concepts and excitation frequency ranges. In the description of practical applications, extensive use is made of cross-referencing between processes and materials, as well as theory and practice. It is thus intended to provide a total model for understanding dry etching. The book has been written such that no previous knowledge of the subject is required. It is intended as a review of all aspects of dry etching for silicon semiconductor processing.
Author: Riccardo d'Agostino
Publisher: Elsevier
ISBN: 0323139086
Category : Technology & Engineering
Languages : en
Pages : 544
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Book Description
Plasma Deposition, Treatment, and Etching of Polymers takes a broad look at the basic principles, the chemical processes, and the diagnostic procedures in the interaction of plasmas with polymer surfaces. This recent technology has yielded a large class of new materials offering many applications, including their use as coatings for chemical fibers and films. Additional applications include uses for the passivation of metals, the surface hardening of tools, increased biocompatibility of biomedical materials, chemical and physical sensors, and a variety of micro- and optoelectronic devices. - Appeals to a broad range of industries from microelectronics to space technology - Discusses a wide array of new uses for plasma polymers - Provides a tutorial introduction to the field - Surveys various classes of plasma polymers, their chemical and morphological properties, effects of plasma process parameters on the growth and structure of these synthetic materials, and techniques for characterization - Interests scientists, engineers, and students alike
Author: Brian Chapman
Publisher: Wiley-Interscience
ISBN:
Category : Science
Languages : en
Pages : 434
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Book Description
Develops detailed understanding of the deposition and etching of materials by sputtering discharge, and of etching of materials by chemically active discharge. Treats glow discharge at several levels from basic phenomena to industrial applications--practical techniques diligently related to fundamentals. Subjects range from voltage, distributions encountered in plasma etching systems to plasma-electron interactions that contribute to sustaining the discharge.
Author: R.A. Powell
Publisher: Elsevier
ISBN: 0080983588
Category : Technology & Engineering
Languages : en
Pages : 312
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Book Description
This volume collects together for the first time a series of in-depth, critical reviews of important topics in dry etching, such as dry processing of III-V compound semiconductors, dry etching of refractory metal silicides and dry etching aluminium and aluminium alloys. This topical format provides the reader with more specialised information and references than found in a general review article. In addition, it presents a broad perspective which would otherwise have to be gained by reading a large number of individual research papers. An additional important and unique feature of this book is the inclusion of an extensive literature review of dry processing, compiled by search of computerized data bases. A subject index allows ready access to the key points raised in each of the chapters.
Author: G. S. Mathad
Publisher: The Electrochemical Society
ISBN: 9781566772532
Category : Integrated circuits
Languages : en
Pages : 396
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Book Description
Author: G. S. Mathad
Publisher: The Electrochemical Society
ISBN: 9781566770668
Category : Technology & Engineering
Languages : en
Pages : 452
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Book Description
