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Author: Norman G. Einspruch
Publisher: Academic Press
ISBN: 1483217752
Category : Technology & Engineering
Languages : en
Pages : 544
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Book Description
VLSI Electronics: Microstructure Science, Volume 8: Plasma Processing for VLSI (Very Large Scale Integration) discusses the utilization of plasmas for general semiconductor processing. It also includes expositions on advanced deposition of materials for metallization, lithographic methods that use plasmas as exposure sources and for multiple resist patterning, and device structures made possible by anisotropic etching. This volume is divided into four sections. It begins with the history of plasma processing, a discussion of some of the early developments and trends for VLSI. The second section, Deposition, discusses deposition techniques for VLSI such as sputtering metals for metallization and contacts, plasma-enhanced chemical vapor deposition of metals and suicides, and plasma enhanced chemical vapor deposition of dielectrics. The part on Lithography presents the high-resolution trilayer resist system, pulsed x-ray sources for submicrometer x-ray lithography, and high-intensity deep-UV sources. The last part, Etching, provides methods in etching, like ion-beam etching using reactive gases, low-pressure reactive ion etching, and the uses of inert-gas ion milling. The theory and mechanisms of plasma etching are described and a number of new device structures made possible by anisotropic etching are enumerated as well. Scientists, engineers, researchers, device designers, and systems architects will find the book useful.
Author: Norman G. Einspruch
Publisher: Academic Press
ISBN: 1483217752
Category : Technology & Engineering
Languages : en
Pages : 544
Get Book Here
Book Description
VLSI Electronics: Microstructure Science, Volume 8: Plasma Processing for VLSI (Very Large Scale Integration) discusses the utilization of plasmas for general semiconductor processing. It also includes expositions on advanced deposition of materials for metallization, lithographic methods that use plasmas as exposure sources and for multiple resist patterning, and device structures made possible by anisotropic etching. This volume is divided into four sections. It begins with the history of plasma processing, a discussion of some of the early developments and trends for VLSI. The second section, Deposition, discusses deposition techniques for VLSI such as sputtering metals for metallization and contacts, plasma-enhanced chemical vapor deposition of metals and suicides, and plasma enhanced chemical vapor deposition of dielectrics. The part on Lithography presents the high-resolution trilayer resist system, pulsed x-ray sources for submicrometer x-ray lithography, and high-intensity deep-UV sources. The last part, Etching, provides methods in etching, like ion-beam etching using reactive gases, low-pressure reactive ion etching, and the uses of inert-gas ion milling. The theory and mechanisms of plasma etching are described and a number of new device structures made possible by anisotropic etching are enumerated as well. Scientists, engineers, researchers, device designers, and systems architects will find the book useful.
Author: Claudia Riccardi
Publisher: World Scientific
ISBN: 9811275947
Category : Science
Languages : en
Pages : 296
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Book Description
This book explores the exciting and evolving world of plasma physics in materials manufacturing and processing. From ionized discharges to non-thermal equilibrium plasmas, new phenomena in physics are constantly emerging. Written, organized, and edited by internationally recognized experts, the various chapters delve into diverse issues in plasma science, including new applications at the nanoscale to the development of diagnostic tools and simulations. The interactions between the plasma state and matter, both surface and bulk, as well as gases and liquids, are explored. As electric discharges in plasmas continue to expand towards new horizons, anyone interested in this fascinating field would benefit from this book as an up-to-date and essential resource.
Author: Norman G. Einspruch
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 552
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Book Description
Author: National Institute of Standards and Technology (U.S.)
Publisher:
ISBN:
Category :
Languages : en
Pages : 480
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Book Description
Author:
Publisher:
ISBN:
Category : Chemistry
Languages : en
Pages : 2540
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Book Description
Author:
Publisher: Newnes
ISBN: 0080965334
Category : Technology & Engineering
Languages : en
Pages : 5485
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Book Description
Comprehensive Materials Processing, Thirteen Volume Set provides students and professionals with a one-stop resource consolidating and enhancing the literature of the materials processing and manufacturing universe. It provides authoritative analysis of all processes, technologies, and techniques for converting industrial materials from a raw state into finished parts or products. Assisting scientists and engineers in the selection, design, and use of materials, whether in the lab or in industry, it matches the adaptive complexity of emergent materials and processing technologies. Extensive traditional article-level academic discussion of core theories and applications is supplemented by applied case studies and advanced multimedia features. Coverage encompasses the general categories of solidification, powder, deposition, and deformation processing, and includes discussion on plant and tool design, analysis and characterization of processing techniques, high-temperatures studies, and the influence of process scale on component characteristics and behavior. Authored and reviewed by world-class academic and industrial specialists in each subject field Practical tools such as integrated case studies, user-defined process schemata, and multimedia modeling and functionality Maximizes research efficiency by collating the most important and established information in one place with integrated applets linking to relevant outside sources
Author: United States. National Bureau of Standards
Publisher:
ISBN:
Category : Government publications
Languages : en
Pages : 480
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Book Description
Author:
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 1904
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Book Description
Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 702
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Book Description
Author: Peter M. Martin
Publisher: William Andrew
ISBN: 0815520328
Category : Technology & Engineering
Languages : en
Pages : 932
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Book Description
This 3e, edited by Peter M. Martin, PNNL 2005 Inventor of the Year, is an extensive update of the many improvements in deposition technologies, mechanisms, and applications. This long-awaited revision includes updated and new chapters on atomic layer deposition, cathodic arc deposition, sculpted thin films, polymer thin films and emerging technologies. Extensive material was added throughout the book, especially in the areas concerned with plasma-assisted vapor deposition processes and metallurgical coating applications.
