Author:
Publisher:
ISBN:
Category : Microelectronic packaging
Languages : en
Pages : 272

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Author: Lukas Chrostowski
Publisher: Cambridge University Press
ISBN: 1107085454
Category : Science
Languages : en
Pages : 439

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Book Description
This hands-on introduction to silicon photonics engineering equips students with everything they need to begin creating foundry-ready designs.

Author: Jia-ming Liu
Publisher: Cambridge University Press
ISBN: 9781139441148
Category : Technology & Engineering
Languages : en
Pages : 1108

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Book Description
Photonic devices lie at the heart of the communications revolution, and have become a large and important part of the electronic engineering field, so much so that many colleges now treat this as a subject in its own right. With this in mind, the author has put together a unique textbook covering every major photonic device, and striking a careful balance between theoretical and practical concepts. The book assumes a basic knowledge of optics, semiconductors and electromagnetic waves. Many of the key background concepts are reviewed in the first chapter. Devices covered include optical fibers, couplers, electro-optic devices, magneto-optic devices, lasers and photodetectors. Problems are included at the end of each chapter and a solutions set is available. The book is ideal for senior undergraduate and graduate courses, but being device driven it is also an excellent engineers' reference.

Author:
Publisher:
ISBN:
Category : Microelectronic packaging
Languages : en
Pages : 286

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Author: Michael R. Feldman
Publisher: SPIE-International Society for Optical Engineering
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 440

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Author: C.P. Wong
Publisher: Springer Science & Business Media
ISBN: 1441900403
Category : Technology & Engineering
Languages : en
Pages : 761

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Book Description
Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.

Author: Madeleine Glick
Publisher: Elsevier
ISBN: 032391831X
Category : Technology & Engineering
Languages : en
Pages : 523

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Book Description
Integrated Photonics for Data Communications Applications reviews the key concepts, design principles, performance metrics and manufacturing processes from advanced photonic devices to integrated photonic circuits. The book presents an overview of the trends and commercial needs of data communication in data centers and high-performance computing, with contributions from end users presenting key performance indicators. In addition, the fundamental building blocks are reviewed, along with the devices (lasers, modulators, photodetectors and passive devices) that are the individual elements that make up the photonic circuits. These chapters include an overview of device structure and design principles and their impact on performance. Following sections focus on putting these devices together to design and fabricate application-specific photonic integrated circuits to meet performance requirements, along with key areas and challenges critical to the commercial manufacturing of photonic integrated circuits and the supply chains being developed to support innovation and market integration are discussed. This series is led by Dr. Lionel Kimerling Executive at AIM Photonics Academy and Thomas Lord Professor of Materials Science and Engineering at MIT and Dr. Sajan Saini Education Director at AIM Photonics Academy at MIT. Each edited volume features thought-leaders from academia and industry in the four application area fronts (data communications, high-speed wireless, smart sensing, and imaging) and addresses the latest advances. - Includes contributions from leading experts and end-users across academia and industry working on the most exciting research directions of integrated photonics for data communications applications - Provides an overview of data communication-specific integrated photonics starting from fundamental building block devices to photonic integrated circuits to manufacturing tools and processes - Presents key performance metrics, design principles, performance impact of manufacturing variations and operating conditions, as well as pivotal performance benchmarks

Author: José Capmany
Publisher:
ISBN: 0198844409
Category : Science
Languages : en
Pages : 361

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Book Description
This is the first comprehensive, self-contained introduction to the emergent field of Programmable Integrated Photonics. It covers theoretical and practical aspects ranging from basic technologies and the building of photonic component blocks, to design alternatives and principles of complex programmable photonic circuits, and their applications.

Author: John H. Lau
Publisher: Springer
ISBN: 9811372241
Category : Technology & Engineering
Languages : en
Pages : 381

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Book Description
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

Author:
Publisher: American Society of Mechanical Engineers
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 632

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Book Description