Author:
Publisher:
ISBN: 9781665416191
Category :
Languages : en
Pages :
Book Description
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
Author:
Publisher:
ISBN: 9781665416191
Category :
Languages : en
Pages :
Book Description
Publisher:
ISBN: 9781665416191
Category :
Languages : en
Pages :
Book Description
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
Author: IEEE Staff
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
Book Description
EPTC 2022 will feature keynotes, technical sessions, short courses, forums, exhibitions, social and networking activities It aims to provide a good coverage of technology developments in all areas of electronics packaging from design to manufacturing and operation It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts Since its inauguration in 1997, EPTC has developed into a highly reputed electronics packaging conference in the Asia Pacific and is well attended by experts in all aspects of packaging technology from all over the world EPTC is the flagship conference of IEEE EPS in Region 10
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
Book Description
EPTC 2022 will feature keynotes, technical sessions, short courses, forums, exhibitions, social and networking activities It aims to provide a good coverage of technology developments in all areas of electronics packaging from design to manufacturing and operation It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts Since its inauguration in 1997, EPTC has developed into a highly reputed electronics packaging conference in the Asia Pacific and is well attended by experts in all aspects of packaging technology from all over the world EPTC is the flagship conference of IEEE EPS in Region 10
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
Author:
Publisher:
ISBN: 9781538676684
Category : Electronic packaging
Languages : en
Pages :
Book Description
Publisher:
ISBN: 9781538676684
Category : Electronic packaging
Languages : en
Pages :
Book Description
EPTC
Author:
Publisher:
ISBN: 9781538630426
Category : Electronic packaging
Languages : en
Pages :
Book Description
Publisher:
ISBN: 9781538630426
Category : Electronic packaging
Languages : en
Pages :
Book Description
Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000)
Author: Thiam Beng Lim
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 492
Book Description
Topics covered by this title include: packaging materials; packaging trends; thermal design and modelling; solder joint metallurgy; process and reliability modelling; thermal characterization; materials characterization techniques; and assembly/manufacturing technologies.
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 492
Book Description
Topics covered by this title include: packaging materials; packaging trends; thermal design and modelling; solder joint metallurgy; process and reliability modelling; thermal characterization; materials characterization techniques; and assembly/manufacturing technologies.
Electronics Packaging Technology Conference
Author:
Publisher: Springer
ISBN: 9780780388215
Category : Electronic packaging
Languages : en
Pages : 804
Book Description
Publisher: Springer
ISBN: 9780780388215
Category : Electronic packaging
Languages : en
Pages : 804
Book Description
Proceedings of 7th Electronics Packaging Technology Conference (EPTC 2005)
Author:
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages :
Book Description
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages :
Book Description
"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)".
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
Book Description
Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)
Author:
Publisher:
ISBN: 9781728138350
Category :
Languages : en
Pages :
Book Description
Publisher:
ISBN: 9781728138350
Category :
Languages : en
Pages :
Book Description