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Author: Candace Ellicott
Publisher: Rockport Publishers
ISBN: 1610580672
Category : Design
Languages : en
Pages : 209
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Book Description
This book outlines and demonstrates basic package design guidelines and rules through 100 principles in the areas of research, planning, and execution. This book is a quick reference and primer on package design, and the principles that make design projects successful. Highly visual and appealing to beginning designers, students, and working designers as a resource. The content helps to establish the rules and guides designers in knowing when and where to bend them. Visual examples demonstrate each principle so readers can see the principle at work in applied design.
Author: Candace Ellicott
Publisher: Rockport Publishers
ISBN: 1610580672
Category : Design
Languages : en
Pages : 209
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Book Description
This book outlines and demonstrates basic package design guidelines and rules through 100 principles in the areas of research, planning, and execution. This book is a quick reference and primer on package design, and the principles that make design projects successful. Highly visual and appealing to beginning designers, students, and working designers as a resource. The content helps to establish the rules and guides designers in knowing when and where to bend them. Visual examples demonstrate each principle so readers can see the principle at work in applied design.
Author: Puligandla Viswanadham
Publisher: American Society of Mechanical Engineers
ISBN: 9780791859667
Category : Technology & Engineering
Languages : en
Pages : 0
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Book Description
ASME Press Book Series on Electronic Packaging. Series Editor: Dereje Agonafer. This book provides the basic essentials and fundamentals of electronic packaging technology. It introduces the language and terminology, as well as the basic building blocks of information processing technology such as: a) printed wiring boards and laminates, b) various types of components and packages, c) materials and processes, d) fundamentals of reliability and relevant reliability enhancement methods, and e) typical failures observed are described. A fully tested semiconductor device is the starting point for this text. Thus, no background in the semiconductor design or fabrication is assumed. The reader is exposed to the interaction and convergence of various disciplines such as chemistry, physics, materials science, metallurgy, process engineering in the fabrication of an electronic appliance. The reader is also made aware of the emerging trends in electronic packaging to prepare him or her for the near-term miniaturization and integration of technology trends.
Author: Grip
Publisher: Adams Media
ISBN: 1592538134
Category : Design
Languages : en
Pages : 194
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Book Description
DIVGain strategic insights on all aspects of package design. From starting with a blank slate all the way up to a finished product, learn the steps of executing effective package design solutions. /div
Author: Catharine Fishel
Publisher: Rockport Publishers
ISBN: 1616736453
Category : Design
Languages : en
Pages : 352
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Book Description
A volume "packed" with insight and ideas The packaging industry is more competitive every day so creating a new package that is innovative, adds value, and makes a connection with the consumer is a challenge often met with limited success. Dynamic and unusual package designs can really make a statement in overcrowded markets. What makes a package successful? How do designers find the inspiration and execute the designs that really work? This compendium of package design answers all that and more. The content covers inspiration, process, design research, working with clients, planning, and execution of some of the most effective packages on the market today. Insight from top packaging designers worldwide is provided on pages that are packed with images of great designs. Unlike most packaging books, this volume is stuffed with content in a compact, portable, and easy-to-use format
Author: Anne Emblem
Publisher: Elsevier
ISBN: 0857095706
Category : Technology & Engineering
Languages : en
Pages : 601
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Book Description
Packaging is a complex and wide-ranging subject. Comprehensive in scope and authoritative in its coverage, Packaging technology provides the ideal introduction and reference for both students and experienced packaging professionals.Part one provides a context for the book, discussing fundamental issues relating to packaging such as its role in society and its diverse functions, the packaging supply chain and legislative, environmental and marketing issues. Part two reviews the principal packaging materials such as glass, metal, plastics, paper and paper board. It also discusses closures, adhesives and labels. The final part of the book discusses packaging processes, from design and printing to packaging machinery and line operations, as well as hazard and risk management in packaging.With its distinguished editors and expert contributors, Packaging technology is a standard text for the packaging industry. The book is designed both to meet the needs of those studying for the Diploma in Packaging Technology and to act as a comprehensive reference for packaging professionals. - Provides the ideal introduction and reference for both students and experienced packaging professionals - Examines fundamental issues relating to packaging, such as its role in society, its diverse functions, the packaging supply chain and legislative, environmental and marketing issues - Reviews the principal packaging materials such as glass, metal, plastics, paper and paper board
Author: Rao Tummala
Publisher: McGraw Hill Professional
ISBN: 0071500596
Category : Technology & Engineering
Languages : en
Pages : 979
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Book Description
LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing
Author: Sola Somade
Publisher: iUniverse
ISBN: 1532043791
Category : Technology & Engineering
Languages : en
Pages : 89
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Book Description
Packaging remains the most effective medium through which goods can be made available to the consumer wherever he resides. The Essentials of Packaging: A Guide for Micro, Small, and Medium Sized Businesses has been written to guide manufacturers or anyone who has any marketable product to package. As the books title shows, some emphasis has been focused on MSMEs that are at a disadvantage for various reasons, among which is their lack of financial muscle to engage full-time packaging professionals to handle their packaging needs on a routine basis.
Author: Giles Calver
Publisher: Rotovision
ISBN: 9782940361885
Category : Design
Languages : en
Pages : 255
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Book Description
Laying foundations and guidelines for best practice when designing contemporary packaging, this title tackles design basics such as format, layout and typography and takes into account genre-specific elements such as product information, branding, marketing and legislation.
Author: Vickie A. Vaclavik
Publisher: Springer Science & Business Media
ISBN: 0387699406
Category : Technology & Engineering
Languages : en
Pages : 565
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Book Description
Essentials of Food Science covers the basics of foods, food science, and food technology. The book is meant for the non-major intro course, whether taught in the food science or nutrition/dietetics department. In previous editions the book was organized around the USDA Food Pyramid which has been replaced. The revised pyramid will now be mentioned in appropriate chapters only. Other updates include new photos, website references, and culinary alerts for culinary and food preparation students. Two added topics include RFID (Radio frequency ID) tags, and trans fat disclosures. Includes updates on: food commodities, optimizing quality, laws, and food safety.
Author: Institute of Packaging Professionals
Publisher:
ISBN: 9780615709345
Category : Containers
Languages : en
Pages : 748
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Book Description
