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Author:
Publisher:
ISBN:
Category : Microelectronic packaging
Languages : en
Pages : 382
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Book Description
Author:
Publisher:
ISBN:
Category : Microelectronic packaging
Languages : en
Pages : 382
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Book Description
Author: Ray T. Chen
Publisher: SPIE-International Society for Optical Engineering
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 378
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Book Description
Author: Michael R. Feldman
Publisher: SPIE-International Society for Optical Engineering
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 440
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Book Description
Author: Louay A. Eldada
Publisher: SPIE-International Society for Optical Engineering
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 272
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Book Description
Author: Glen Martin McWright
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 278
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Book Description
Author: Ted E. Batchman
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 400
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Book Description
Author:
Publisher:
ISBN:
Category : Optical communications
Languages : en
Pages : 406
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Book Description
Author: Alan R. Mickelson
Publisher: Wiley-Interscience
ISBN: 9780471111887
Category : Technology & Engineering
Languages : en
Pages : 0
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Book Description
The missing link in a dynamically growing field--a state-of-the-artreference on optoelectronic packaging The rapidly expanding field of packaging for optoelectronic deviceschallenges electrical engineers with a host of complex and dauntingproblems. The increasing intricacy of assemblage compounds thethorny interconnection issues associated with electronicpackaging-how to assemble an array with many elements efficientlywhile maintaining thermal tolerance and simultaneously overcomingthe ensuing modulation problems that generate electrical noise.Adding to these problems has been the absence, until now, of asingle authoritative reference on the subject. Optoelectronic Packaging is the first and only comprehensivesourcebook on optoelectronic assembly techniques. Foroptoelectronic packaging experts and professionals in adjuncttechnologies, it provides an overview of today's state-of-the-arttechnologies, packages now on the drawing board, and the futuredirection of packaging types. For the novice, it lays down thefundamentals of optics and packaging. This incomparable textfeatures contributions from hands-on practitioners and,supplemented with extensive illustrations, it * Covers detector, semiconductor laser, and optical amplifierpackaging * Discusses waveguide technologies, free-space interconnects, andhybrid technologies * Examines communication system interconnection structure andfiber-optic networks in telecommunications * Explores array device packaging and flip-chip assembly for smartpixel arrays * Includes case studies of packaged subassemblies
Author: G.G. Harman
Publisher: Springer Science & Business Media
ISBN: 9401151350
Category : Technology & Engineering
Languages : en
Pages : 295
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Book Description
MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.
Author: Horst Zimmermann
Publisher: Springer Science & Business Media
ISBN: 3662040182
Category : Science
Languages : en
Pages : 338
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Book Description
The book covers the entire topic from the basics of optoelectronics, device physics of photodetectors and light emitters, simulation of photodetectors, and technological aspects of optoelectronic integration in microelectronics to circuit aspects and practical applications. It summarizes the state of the art in integrated silicon optoelectronics and reviews recent publications on this topic. Results of basic research on silicon light emitters are included as well, while published results are compared with each other and with the work of the author.
