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Author:
Publisher:
ISBN:
Category : Optical communications
Languages : en
Pages : 388
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Book Description
Author:
Publisher:
ISBN:
Category : Optical communications
Languages : en
Pages : 388
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Book Description
Author: Ray T. Chen
Publisher: Morgan & Claypool Publishers
ISBN: 1598290665
Category : Integrated circuits
Languages : en
Pages : 105
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Book Description
This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical interconnects, many stumbling blocks need to be addressed such as thin-film transmitter and detector, thermal management, process compatibility, reliability, cost effective fabrication process, and easy integration. The material presented eventually will relieve such concerns and make the integration of optical interconnection highly feasible. The hybrid integration of the optical interconnection layer and electrical layers is ongoing.
Author: Elena Degoli
Publisher:
ISBN:
Category : Electronic circuit design
Languages : en
Pages : 80
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Book Description
1. Executive summary - 2. The general interconnect issue - 3. Light sources - 4. Detectors - 5. Optical pathways - 6. Summary of achievemnets - 7. References - 8. Project information - 9. Acronyms.
Author: Henk Neefs
Publisher:
ISBN:
Category : Electronic circuit design
Languages : en
Pages : 92
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Book Description
Author: Shigeru Kawai
Publisher: CRC Press
ISBN: 1351836854
Category : Computers
Languages : en
Pages : 317
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Book Description
As we reach the data transmission limits of copper wire and communications experts seek to bring the speed of long-haul fiber optics networks closer to access points, optical interconnects promise to provide efficient, high-speed data transmission for the next generation of networks and systems. They offer higher bit-rates, virtually no crosstalk, lower demands on power requirements and thermal management, and the possibility of two-dimensional channel arrays for chip-to-chip communication. The Handbook of Optical Interconnects introduces the systems and devices that will bring the speed and quality of optical transmission closer to the circuit board. Contributed by active experts, most from leading technology companies in the US and Japan, this outstanding handbook details various low-cost and small-size configurations, illustrates the discussion with more than 300 figures, and offers a look at the applications and future of this exciting and rapidly growing field. The book includes a detailed introduction to vertical cavity surface-emitting lasers (VCSELs); the use of optical interconnects in metropolitan, local-area, and access networks through FTTP (FTTH); and Jisso technologies, which are critical for developing low-cost, small-size modules. Driving down the size and cost of optical interconnects is vital for integrating these technologies into the network and onto microprocessors, and the Handbook of Optical Interconnects provides the knowledge and tools necessary to accomplish these goals.
Author: Philippe Lalanne
Publisher: Springer Science & Business Media
ISBN: 3642492649
Category : Computers
Languages : en
Pages : 420
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Book Description
This volume is a monograph on parallel optical interconnects. It presents not only the state of-the-art in this domain but also the necessary physical and chemical background. It also provides a discussion of the potential for future devices. Both experts and newcomers to the area will appreciate the authors' proficiency in providing the complete picture of this rapidly growing field. Optical interconnects are already established in telecommunications and should eventually find their way being applied to chip and even gate level connections in integrated systems. The inspiring environment of the Basic Research Working Group on Optical Information Technology WOIT (3199), together with the excellent and complementary skills of its participants, make this contribution highly worthwhile. G. Metakides Table of contents 1 Perspectives for parallel optical interconnects: introduction . . . . . . . . . . . . . . . . . . . . . . . . . l Pierre Chavel and Philippe lAlanne 1. 1 Optical Interconnects and ESPRIT BRA WOIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1. 2 What are optical interconnects? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1. 3 Optical interconnects: how ? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1. 3. 1 Passive devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1. 3. 2 Active devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1. 3. 3 Schemes for parallel optical interconnects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1. 3. 4 Limits of optical interconnects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1. 4 Optical interconnects: why ? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Acknowledgetnents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 First Section: Components Part 1. 1 Passive interconnect components 2 Free space interconnects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Philippe Lalanne and Pierre ChaveZ 2. 1 Introduction: 3D optical interconnects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2. 2 Optical free space channels and their implementations . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2. 2. 1 Diffraction and degrees of freedom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2. 2. 2 Two Qasic interconnect setups . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Author: Ray T. Chen
Publisher: SPIE-International Society for Optical Engineering
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 476
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Book Description
Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Author: Lorenzo Pavesi
Publisher: Springer
ISBN: 3540289127
Category : Science
Languages : en
Pages : 397
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Book Description
Optical Interconnects provides a fascinating picture of the state of the art in optical interconnects and a perspective on what can be expected in the near future. It is composed of selected reviews authored by world leaders in the field, and these reviews are written from either an academic or industrial viewpoint. An in-depth discussion of the path towards fully-integrated optical interconnects in microelectronics is presented. This book will be useful not only to physicists, chemists, materials scientists, and engineers but also to graduate students who are interested in the fields of microelectronics and optoelectronics.
Author:
Publisher:
ISBN:
Category : Optical communications
Languages : en
Pages : 406
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Book Description
Author: Michael R. Feldman
Publisher: SPIE-International Society for Optical Engineering
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 440
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Book Description
