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Author: Michael R. Feldman
Publisher: SPIE-International Society for Optical Engineering
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 266
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Book Description
Author: Michael R. Feldman
Publisher: SPIE-International Society for Optical Engineering
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 266
Get Book Here
Book Description
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 212
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Book Description
Author: Paul H. Holloway
Publisher: Cambridge University Press
ISBN: 0080946143
Category : Technology & Engineering
Languages : en
Pages : 937
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Book Description
This book reviews the recent advances and current technologies used to produce microelectronic and optoelectronic devices from compound semiconductors. It provides a complete overview of the technologies necessary to grow bulk single-crystal substrates, grow hetero-or homoepitaxial films, and process advanced devices such as HBT's, QW diode lasers, etc.
Author: R.R. Tummala
Publisher: Springer Science & Business Media
ISBN: 1461560373
Category : Computers
Languages : en
Pages : 1060
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Book Description
Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Author: Rao Tummala
Publisher: Springer Science & Business Media
ISBN: 9780412084515
Category : Computers
Languages : en
Pages : 662
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Book Description
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
Author: Bernard C. Kress
Publisher: John Wiley & Sons
ISBN: 9780470022641
Category : Science
Languages : en
Pages : 638
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Book Description
Miniaturization and mass replications have begun to lead the optical industry in the transition from traditional analog to novel digital optics. As digital optics enter the realm of mainstream technology through the worldwide sale of consumer electronic devices, this timely book aims to present the topic of digital optics in a unified way. Ranging from micro-optics to nanophotonics, and design to fabrication through to integration in final products, it reviews the various physical implementations of digital optics in either micro-refractives, waveguide (planar lightwave chips), diffractive and hybrid optics or sub-wavelength structures (resonant gratings, surface plasmons, photonic crystals and metamaterials). Finally, it presents a comprehensive list of industrial and commercial applications that are taking advantage of the unique properties of digital optics. Applied Digital Optics is aimed primarily at optical engineers and product development and technical marketing managers; it is also of interest to graduate-level photonics students and micro-optic foundries. Helps optical engineers review and choose the appropriate software tools to design, model and generate fabrication files. Gives product managers access to an exhaustive list of applications available in today’s market for integrating such digital optics, as well as where the next potential application of digital optics might be. Provides a broad view for technical marketing managers in all aspects of digital optics, and how such optics can be classified. Explains the numerical implementation of optical design and modelling techniques. Enables micro-optics foundries to integrate the latest fabrication and replication techniques, and accordingly fine tune their own fabrication processes.
Author: Horst Zimmermann
Publisher: Springer
ISBN: 3030058220
Category : Science
Languages : en
Pages : 456
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Book Description
Explains the circuit design of silicon optoelectronic integrated circuits (OEICs), which are central to advances in wireless and wired telecommunications. The essential features of optical absorption are summarized, as is the device physics of photodetectors and their integration in modern bipolar, CMOS, and BiCMOS technologies. This information provides the basis for understanding the underlying mechanisms of the OEICs described in the main part of the book. In order to cover the topic comprehensively, Silicon Optoelectronic Integrated Circuits presents detailed descriptions of many OEICs for a wide variety of applications from various optical sensors, smart sensors, 3D-cameras, and optical storage systems (DVD) to fiber receivers in deep-sub-μm CMOS. Numerous detailed illustrations help to elucidate the material.
Author: Mario Dagenais
Publisher: Academic Press
ISBN: 1483288390
Category : Technology & Engineering
Languages : en
Pages : 704
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Book Description
Integrated optoelectronics is becoming ever more important to communications, computer, and consumer industries. It is the enabling technology in a variety of systems, ranging from low-cost, robust optical componentsin consumer electronics to high-performance broadband information networks capable of supporting video and multimedia conferencing. The requirements for producing low-cost, highly reliable components for deployment in these new systems have created a technology challenge. Integrated optoelectronics promises to meet the performance and cost objectives of these applications by integrating both optical and electronic components in a highly functional chip. This book provides an overview of this exciting newtechnology.Integrated Optoelectronics brings together a group of acknowledged experts from both universities and industry around the world to focus on a common theme of integration. These experts have reported not only on the state-of-the-art, but also on the physics and design experience that goes into implementing integrated chips and modules. This book is a cohesive series of articles that includes a discussion of the intimate trade-offs between materials, processes, devices, functional blocks, packaging,and systems requirements in a truly integrated technology. This integration encompasses electrical, optoelectronic, and optical devices onto monolithic or hybrid chips, and into multichip modules.This volume surveys state-of-the-art research activities in integrated optoelectronics and gathers most of the important references into a single place. It outlines the major issues involved in integrating both optical and electronic components, provides an overview of design and fabrication concepts, and discusses the issues involved in bringing these new chips to the marketplace.This exciting new book:Provides a broad overview of the optoelectronic field, including materials processing, devices, and systems applicationsFeatures authors who are acknowledged research experts in this field, from both industry and universities around the worldIncludes new information on device fabrication, including the latest epitaxial growth and lift-off techniques to permit the mixing of dissimilar materials onto single chipsCovers planar processed laser fabrication leading to wafer level automated testingDiscusses optimization of devices for integration, including a detailed treatment of the vertical emitting laser and theoretical and experimental coverage of optimization of photodetectors for integration into receiver chipsDescribes design approaches for multifunctional chips, including photonic circuits for all-optical networks and the design of integrated optoelectronic chips with lasers, photodiodes, and electronic ICsCovers the infrastructure needed to support an integrated technology, including automated design systems which treat both optical and electrical circuits, and multichip packaging approaches for both optical and IC chips
Author: Denis Flandre
Publisher: Springer Science & Business Media
ISBN: 1402030134
Category : Technology & Engineering
Languages : en
Pages : 358
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Book Description
This proceedings volume archives the contributions of the speakers who attended the NATO Advanced Research Workshop on “Science and Technology of Semiconductor-On-Insulator Structures and Devices Operating in a Harsh Environment” held at the Sanatorium Puscha Ozerna, th th Kyiv, Ukraine, from 25 to 29 April 2004. The semiconductor industry has maintained a very rapid growth during the last three decades through impressive technological achievements which have resulted in products with higher performance and lower cost per function. After many years of development semiconductor-on-insulator materials have entered volume production and will increasingly be used by the manufacturing industry. The wider use of semiconductor (especially silicon) on insulator materials will not only enable the benefits of these materials to be further demonstrated but, also, will drive down the cost of substrates which, in turn, will stimulate the development of other novel devices and applications. In itself this trend will encourage the promotion of the skills and ideas generated by researchers in the Former Soviet Union and Eastern Europe and their incorporation in future collaborations.
Author:
Publisher: World Scientific
ISBN: 9811209642
Category : Technology & Engineering
Languages : en
Pages : 1079
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Book Description
Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.
