Openscenegraph 3.0 PDF Download
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Author: Rui Wang
Publisher: Packt Publishing Ltd
ISBN: 1849512833
Category : Computers
Languages : en
Pages : 664
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Book Description
Create high-performance virtual reality applications with OpenSceneGraph, one of the best 3D graphics engines.
Author: Rui Wang
Publisher: Packt Publishing Ltd
ISBN: 1849512833
Category : Computers
Languages : en
Pages : 664
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Book Description
Create high-performance virtual reality applications with OpenSceneGraph, one of the best 3D graphics engines.
Author: Ofelia Prodan
Publisher: Rex Bookstore, Inc.
ISBN: 9789732331224
Category :
Languages : en
Pages : 1110
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Book Description
Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 420
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Book Description
Author: United States. Congress. House. Committee on Merchant Marine and Fisheries. Subcommittee on Fisheries and Wildlife Conservation and the Environment
Publisher:
ISBN:
Category : Aquaculture
Languages : en
Pages : 610
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Book Description
Author: American Society for Testing Materials
Publisher:
ISBN:
Category : Building materials
Languages : en
Pages : 1224
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Book Description
Vol. 12 includes under the same cover the society's year-book for 1912.
![Soil Survey of ... [various Counties, Etc.]. PDF](https://books.google.com/books/content/images/frontcover/d4AnFvdtXjUC?fife=w80-h100)
Author:
Publisher:
ISBN:
Category : Soil surveys
Languages : en
Pages : 520
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Author:
Publisher:
ISBN:
Category : Soil surveys
Languages : en
Pages : 226
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Book Description
Author: Muhannad S. Bakir
Publisher: Artech House
ISBN: 1596932473
Category : Technology & Engineering
Languages : en
Pages : 551
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Book Description
This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
Author: United States. Army. Air Corps
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 870
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Book Description
Author: United States. Army Medical Service
Publisher:
ISBN:
Category : Federal aid to medical research
Languages : en
Pages : 666
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Book Description
