On-Wafer Microwave Measurements and De-embedding PDF Download
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Author: Errikos Lourandakis
Publisher: Artech House
ISBN: 1630813710
Category : Technology & Engineering
Languages : en
Pages : 251
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Book Description
This new authoritative resource presents the basics of network analyzer measurement equipment and troubleshooting errors involved in the on-wafer microwave measurement process. This book bridges the gap between theoretical and practical information using real-world practices that address all aspects of on-wafer passive device characterization in the microwave frequency range up to 60GHz. Readers find data and measurements from silicon integrated passive devices fabricated and tested in advance CMOS technologies. Basic circuit equations, terms and fundamentals of time and frequency domain analysis are covered. This book also explores the basics of vector network analyzers (VNA), two port S-parameter measurement routines, signal flow graphs, network theory, error models and VNA calibrations with the use of calibration standards.
Author: Errikos Lourandakis
Publisher: Artech House
ISBN: 1630813710
Category : Technology & Engineering
Languages : en
Pages : 251
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Book Description
This new authoritative resource presents the basics of network analyzer measurement equipment and troubleshooting errors involved in the on-wafer microwave measurement process. This book bridges the gap between theoretical and practical information using real-world practices that address all aspects of on-wafer passive device characterization in the microwave frequency range up to 60GHz. Readers find data and measurements from silicon integrated passive devices fabricated and tested in advance CMOS technologies. Basic circuit equations, terms and fundamentals of time and frequency domain analysis are covered. This book also explores the basics of vector network analyzers (VNA), two port S-parameter measurement routines, signal flow graphs, network theory, error models and VNA calibrations with the use of calibration standards.
Author: Giovanni Crupi
Publisher: Academic Press
ISBN: 0124045928
Category : Technology & Engineering
Languages : en
Pages : 481
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Book Description
This groundbreaking book is the first to give an introduction to microwave de-embedding, showing how it is the cornerstone for waveform engineering. The authors of each chapter clearly explain the theoretical concepts, providing a foundation that supports linear and non-linear measurements, modelling and circuit design. Recent developments and future trends in the field are covered throughout, including successful strategies for low-noise and power amplifier design. This book is a must-have for those wishing to understand the full potential of the microwave de-embedding concept to achieve successful results in the areas of measurements, modelling, and design at high frequencies. With this book you will learn: - The theoretical background of high-frequency de-embedding for measurements, modelling, and design - Details on applying the de-embedding concept to the transistor's linear, non-linear, and noise behaviour - The impact of de-embedding on low-noise and power amplifier design - The recent advances and future trends in the field of high-frequency de-embedding - Presents the theory and practice of microwave de-embedding, from the basic principles to recent advances and future trends - Written by experts in the field, all of whom are leading researchers in the area - Each chapter describes theoretical background and gives experimental results and practical applications - Includes forewords by Giovanni Ghione and Stephen Maas
Author: Gilles Dambrine
Publisher: Elsevier Inc. Chapters
ISBN: 0128068566
Category : Technology & Engineering
Languages : en
Pages : 42
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Book Description
This chapter aims to describe experimental tools and techniques used for on-wafer millimeter (mm)-wave characterizations of silicon-based devices under the small-signal regime. We discuss the basics of scattering parameters (S parameters), high-frequency (HF) noise concept and measurement facilities, and expert details concerning experimental procedures. In this chapter, we describe first the basic notions of the S-parameters concept and its limitations, as well of as those HF noise. Secondly, the main experimental tools such as mm-wave vectorial network analyzer, noise setup, and on-wafer station are depicted. The third part concerns the description and the methodology of on-wafer calibration and de-embedding techniques applied for mm-wave advanced silicon devices. Finally, the last section focuses on the presentation and description of several examples of device characterizations. The main objective of this chapter is to propose a tradeoff between basic information and details of experience.
Author: Sotirios Goudos
Publisher: BoD – Books on Demand
ISBN: 9535128671
Category : Technology & Engineering
Languages : en
Pages : 436
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Book Description
Microwave systems are key components of every modern wireless communication system. The main objective of this book was to collect as many different state-of-the-art studies as possible in order to cover in a single volume the main aspects of microwave systems and applications. This book contains 17 chapters written by acknowledged experts, researchers, academics, and microwave engineers, providing comprehensive information and covering a wide range of topics on all aspects of microwave systems and applications. This book is divided into four parts. The first part is devoted to microwave components. The second part deals with microwave ICs and innovative techniques for on-chip antenna design. The third part presents antenna design cases for microwave systems. Finally, the last part covers different applications of microwave systems.
Author: Scott A. Wartenberg
Publisher: Artech House
ISBN: 9781580532730
Category : Technology & Engineering
Languages : en
Pages : 256
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Book Description
The recent explosion of the RF wireless integrated circuits (IC), coupled with higher operating speeds in digital IC's has made accurate RF testing of IC's vital. This ground-breaking resource explains the fundamentals of performing accurate RF measurements of die and packages. It offers you practical advice on how to use coplanar probes and test fixtures in the lab for RF on-wafer die and package characterization. It also details how to build separate RF test systems for noise, high-power, and thermal testing as well as de-embed the test system's parasitic effects to get the die's RF performance. This book is a handy, practical resource for RFIC and MMIC designers as well as high-frequency digital IC designers, IC test engineers, and IC manufacturing test engineers.
Author: Manuel Yarlequé
Publisher: Elsevier Inc. Chapters
ISBN: 0128068620
Category : Technology & Engineering
Languages : en
Pages : 99
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Book Description
This chapter aims to describe methodologies and techniques for de-embedding device measurements from extrinsic measurements by characterizing the parasitic network surrounding the intrinsic device, through the use of a three-dimensional (3D) physical model of the network and its electromagnetic (EM) analysis. The electromagnetic behavior is obtained employing 3D EM solvers and internal ports. In the first part, the de-embedding processes for field-effect transistor (FET) devices to be used for monolithic microwave integrated circuit designs are studied by four different approaches; in the second part of this chapter, the de-embedding of FET devices for hybrid circuit design purposes is described.
Author: Andrej Rumiantsev
Publisher: CRC Press
ISBN: 1000792854
Category : Technology & Engineering
Languages : en
Pages : 279
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Book Description
The increasing demand for more content, services, and security drives the development of high-speed wireless technologies, optical communication, automotive radar, imaging and sensing systems and many other mm-wave and THz applications. S-parameter measurement at mm-wave and sub-mm wave frequencies plays a crucial role in the modern IC design debug. Most importantly, however, is the step of device characterization for development and optimization of device model parameters for new technologies. Accurate characterization of the intrinsic device in its entire operation frequency range becomes extremely important and this task is very challenging. This book presents solutions for accurate mm-wave characterization of advanced semiconductor devices. It guides through the process of development, implementation and verification of the in-situ calibration methods optimized for high-performance silicon technologies. Technical topics discussed in the book include: Specifics of S-parameter measurements of planar structures Complete mathematical solution for lumped-standard based calibration methods, including the transfer Thru-Match-Reflect (TMR) algorithms Design guideline and examples for the on-wafer calibration standards realized in both advanced SiGe BiCMOS and RF CMOS processes Methods for verification of electrical characteristics of calibration standards and accuracy of the in-situ calibration results Comparison of the new technique vs. conventional approaches: the probe-tip calibration and the pad parasitic de-embedding for various device types, geometries and model parameters New aspects of the on-wafer RF measurements at mmWave frequency range and calibration assurance.
Author: Fadhel M. Ghannouchi
Publisher: Springer Science & Business Media
ISBN: 9400744617
Category : Science
Languages : en
Pages : 241
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Book Description
This first book on load-pull systems is intended for readers with a broad knowledge of high frequency transistor device characterization, nonlinear and linear microwave measurements, RF power amplifiers and transmitters. Load-Pull Techniques with Applications to Power Amplifier Design fulfills the demands of users, designers, and researchers both from industry and academia who have felt the need of a book on this topic. It presents a comprehensive reference spanning different load-pull measurement systems, waveform measurement and engineering systems, and associated calibration procedures for accurate large signal characterization. Besides, this book also provides in-depth practical considerations required in the realization and usage of load-pull and waveform engineering systems. In addition, it also provides procedure to design application specific load-pull setup and includes several case studies where the user can customize architecture of load-pull setups to meet any specific measurement requirements. Furthermore, the materials covered in this book can be part of a full semester graduate course on microwave device characterization and power amplifier design.
Author: R.J. Collier
Publisher: IET
ISBN: 0863417353
Category : Technology & Engineering
Languages : en
Pages : 506
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Book Description
The book covers the following areas: microwave measurement.
Author: Vadim Issakov
Publisher: Springer Science & Business Media
ISBN: 3642135986
Category : Technology & Engineering
Languages : en
Pages : 218
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Book Description
There are continuous efforts focussed on improving road traffic safety worldwide. Numerous vehicle safety features have been invented and standardized over the past decades. Particularly interesting are the driver assistance systems, since these can considerably reduce the number of accidents by supporting drivers’ perception of their surroundings. Many driver assistance features rely on radar-based sensors. Nowadays the commercially available automotive front-end sensors are comprised of discrete components, thus making the radar modules highly-priced and suitable for integration only in premium class vehicles. Realization of low-cost radar fro- end circuits would enable their implementation in inexpensive economy cars, c- siderably contributing to traffic safety. Cost reduction requires high-level integration of the microwave front-end c- cuitry, specifically analog and digital circuit blocks co-located on a single chip. - cent developments of silicon-based technologies, e.g. CMOS and SiGe:C bipolar, make them suitable for realization of microwave sensors. Additionally, these te- nologies offer the necessary integration capability. However, the required output power and temperature stability, necessary for automotive radar sensor products, have not yet been achieved in standard digital CMOS technologies. On the other hand, SiGe bipolar technology offers excellent high-frequency characteristics and necessary output power for automotive applications, but has lower potential for - alization of digital blocks than CMOS.
