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Author: Michael Anthony Nastasi
Publisher: Springer Science & Business Media
ISBN: 9780792321958
Category : Science
Languages : en
Pages : 646
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Book Description
This book focuses on the emerging class of new materials characterized by ultra-fine microstrucures. The NATO ASI which produced this book was the first international scientific meeting devoted to a discussion of the mechanical properties and deformation behavior of materials having grain sizes down to a few nanometers. Topics covered include superplasticity, tribology, and the supermodulus effect. Review chapters cover a variety of other themes including synthesis, characterization, thermodynamic stability, and general physical properties. Much of the work is concerned with the issue of how far conventional techniques and concepts can be extended toward atomic scale probing. Another key issue concerns the structure of nanocrystalline materials, in particular, what is the structure and composition of the internal boundaries. These ultra-fine microstructures have proved to challenge even the finest probes that the materials science community has today.
Author: Michael Anthony Nastasi
Publisher: Springer Science & Business Media
ISBN: 9780792321958
Category : Science
Languages : en
Pages : 646
Get Book Here
Book Description
This book focuses on the emerging class of new materials characterized by ultra-fine microstrucures. The NATO ASI which produced this book was the first international scientific meeting devoted to a discussion of the mechanical properties and deformation behavior of materials having grain sizes down to a few nanometers. Topics covered include superplasticity, tribology, and the supermodulus effect. Review chapters cover a variety of other themes including synthesis, characterization, thermodynamic stability, and general physical properties. Much of the work is concerned with the issue of how far conventional techniques and concepts can be extended toward atomic scale probing. Another key issue concerns the structure of nanocrystalline materials, in particular, what is the structure and composition of the internal boundaries. These ultra-fine microstructures have proved to challenge even the finest probes that the materials science community has today.
Author: Andrés A. Leòn Baldelli
Publisher:
ISBN:
Category :
Languages : en
Pages : 169
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Book Description
We study the problem of mechanical failure of thin films on a rigid substrate. This is a problem of technological interest as thin films of various kinds play a critical role in electronic devices and as protective coatings. In addition, it raises a fundamental interest in the mechanical modeling, analytic treatment and numerical experimentation. In all these systems, a change in temperature, moisture or other environmental condition results in unequal spontaneous deformation of the film and substrate. This leads to mechanical stress and failure in the form of film fracture, debonding, film buckling, grooving etc. This thesis considers situations where the film is subjected to tensile stress so that the first two mechanisms of failure are active in the context of a variational model for fracture. The thesis begins with a broad overview of the issues involved in the problem, a survey of the literature and a summary of the theoretical framework that is used. It then provides a detailed analysis of a idealized problem in one dimension using a phenomenological model. This analysis is carefully conducted and provides important insights into the critical issues. Then, the phenomenological model is rigorously justified with an asymptotic approach.It is performed rigorously in the scalar setting and heuristically in the physically relevant vector setting. The final chapter is dedicated to numerical studies of the problem using a regularized model.
Author: Simon S. Wang
Publisher: Cambridge Scholars Publishing
ISBN: 1527585123
Category : Technology & Engineering
Languages : en
Pages : 346
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Book Description
Layered materials and thin film coatings are ubiquitous in today’s science, engineering, and technology sectors. To name just a few examples: fibre-reinforced composite laminates in aircraft structures, thermal barrier coatings in aero-engines and power turbines, multilayer Mo/Si mirrors of nanometre thickness in synchrotrons, telescope optics, extreme ultraviolet optical systems, etc. The inherent weak interfaces in these materials are extremely vulnerable to fracture which often causes thin film blisters of various morphologies. The authors of the present work have made some significant research progress on this topic; the book gathers these advancements to provide researchers and engineers with more theoretical tools to study and design such material systems. Furthermore, this book can be used as a textbook in advanced courses for postgraduate students. To suit these purposes, each chapter focuses on a relatively independent topic and consists of both theoretical development and experimental applications. Many figures and numerical tables are used to help readers with mechanical understanding and self-practice.
Author: Eva Preiß
Publisher:
ISBN: 9783961471171
Category :
Languages : en
Pages :
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Book Description
Author:
Publisher:
ISBN: 9788793237278
Category :
Languages : en
Pages :
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Book Description
Author: L. B. Freund
Publisher: Cambridge University Press
ISBN: 9781139449823
Category : Technology & Engineering
Languages : en
Pages : 772
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Book Description
Thin film mechanical behavior and stress presents a technological challenge for materials scientists, physicists and engineers. This book provides a comprehensive coverage of the major issues and topics dealing with stress, defect formation, surface evolution and allied effects in thin film materials. Physical phenomena are examined from the continuum down to the sub-microscopic length scales, with the connections between the structure of the material and its behavior described. Theoretical concepts are underpinned by discussions on experimental methodology and observations. Fundamental scientific concepts are embedded through sample calculations, a broad range of case studies with practical applications, thorough referencing, and end of chapter problems. With solutions to problems available on-line, this book will be essential for graduate courses on thin films and the classic reference for researchers in the field.
Author: Matthew R. Begley
Publisher: Cambridge University Press
ISBN: 1107131863
Category : Science
Languages : en
Pages : 289
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Book Description
A comprehensive treatment of the mechanics of multilayers and its implications for reliability, with easy-to-use software to compute key results.
Author: Dietmar Gross
Publisher: Springer Science & Business Media
ISBN: 3642192408
Category : Science
Languages : en
Pages : 336
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Book Description
- self-contained and well illustrated - complete and comprehensive derivation of mechanical/mathematical results with enphasis on issues of practical importance - combines classical subjects of fracture mechanics with modern topics such as microheterogeneous materials, piezoelectric materials, thin films, damage - mechanically and mathematically clear and complete derivations of results
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 6
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Book Description
Thin films are used in many applications where special properties are needed to insure performance and reliability. Of particular interest are thin tantalum nitride films. They are used extensively in microelectronic applications because of their long term stability and low thermal coefficient of resistance. They are sputter deposited which produces films with a high structural defect content and high compressive residual stresses both of which can alter the physical and mechanical properties of microelectronic thin films. Although these films are strong heat generators, they exhibit no changes in structure or composition of the interface with aluminum oxide substrates that degrade performance or reliability. However, the use of high power density components is driving a move to replace aluminum oxide with aluminum nitride for greater heat transfer. 6 This replacement substrate creates concern as residual stresses and long-term operation could induce detrimental changes along the thin film interface not observed in aluminum oxide devices. As a result, the authors employed nanoindentation and continuous nanoscratch testing to determine the effects of the intrinsic compressive residual stresses on the properties and fracture resistance of the thin tantalum nitride films. These techniques sample small volumes of material while preserving the production configuration of a free surface. Although nanoscratch tests lack a rigorous derivation of stress distributions and strain energy release rates, good approximations for strain energy release rates can be obtained using mechanics-based models for blister formation where residual stresses dominate interfacial fracture behavior. When combined with scanning and transmission electron microscopy, the results define structure-property relationships and resistance to fracture of these hard films.
Author: Jack L. Beuth
Publisher:
ISBN:
Category : Fracture mechanics
Languages : en
Pages : 244
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Book Description
