Author: R.A. Levy
Publisher: Springer Science & Business Media
ISBN: 9401134308
Category : Technology & Engineering
Languages : en
Pages : 284
Get Book Here
Book Description
Silicon, as an electronic substrate, has sparked a technological revolution that has allowed the realization of very large scale integration (VLSI) of circuits on a chip. These 6 fingernail-sized chips currently carry more than 10 components, consume low power, cost a few dollars, and are capable of performing data processing, numerical computations, and signal conditioning tasks at gigabit-per-second rates. Silicon, as a mechanical substrate, promises to spark another technological revolution that will allow computer chips to come with the eyes, ears, and even hands needed for closed-loop control systems. The silicon VLSI process technology which has been perfected over three decades can now be extended towards the production of novel structures such as epitaxially grown optoelectronic GaAs devices, buried layers for three dimensional integration, micromechanical mechanisms, integrated photonic circuits, and artificial neural networks. This book begins by addressing the processing of electronic and optoelectronic devices produced by using lattice mismatched epitaxial GaAs films on Si. Two viable technologies are considered. In one, silicon is used as a passive substrate in order to take advantage of its favorable properties over bulk GaAs; in the other, GaAs and Si are combined on the same chip in order to develop IC configurations with improved performance and increased levels of integration. The relationships between device operation and substrate quality are discussed in light of potential electronic and optoelectronic applications.
Author: O. Kononchuk
Publisher: Elsevier
ISBN: 0857099256
Category : Technology & Engineering
Languages : en
Pages : 503
Get Book Here
Book Description
Silicon-On-Insulator (SOI) Technology: Manufacture and Applications covers SOI transistors and circuits, manufacture, and reliability. The book also looks at applications such as memory, power devices, and photonics. The book is divided into two parts; part one covers SOI materials and manufacture, while part two covers SOI devices and applications. The book begins with chapters that introduce techniques for manufacturing SOI wafer technology, the electrical properties of advanced SOI materials, and modeling short-channel SOI semiconductor transistors. Both partially depleted and fully depleted SOI technologies are considered. Chapters 6 and 7 concern junctionless and fin-on-oxide field effect transistors. The challenges of variability and electrostatic discharge in CMOS devices are also addressed. Part two covers recent and established technologies. These include SOI transistors for radio frequency applications, SOI CMOS circuits for ultralow-power applications, and improving device performance by using 3D integration of SOI integrated circuits. Finally, chapters 13 and 14 consider SOI technology for photonic integrated circuits and for micro-electromechanical systems and nano-electromechanical sensors. The extensive coverage provided by Silicon-On-Insulator (SOI) Technology makes the book a central resource for those working in the semiconductor industry, for circuit design engineers, and for academics. It is also important for electrical engineers in the automotive and consumer electronics sectors. - Covers SOI transistors and circuits, as well as manufacturing processes and reliability - Looks at applications such as memory, power devices, and photonics
Author: Aminghasem Safarian
Publisher: Springer Science & Business Media
ISBN: 1402067224
Category : Technology & Engineering
Languages : en
Pages : 97
Get Book Here
Book Description
A comprehensive study of silicon-based distributed architectures in wideband circuits are presented in this book. Novel circuit architectures for ultra-wideband (UWB) wireless technologies are described. The book begins with an introduction of several transceiver architectures for UWB. The discussion then focuses on RF front-end of the UWB radio. Therefore, the book will be of interest to RF circuit designers and students.
Author: Federico Faggin
Publisher: Waterside Productions
ISBN: 9781949003413
Category : Biography & Autobiography
Languages : en
Pages : 306
Get Book Here
Book Description
"As soon as she heard me enter, Elvia awoke from a light sleep that had overcome her as she anxiously waited: 'How did it go?' Excited, I exclaimed: 'It works!' We embraced, almost overwhelmed with feelings of euphoria and happiness, aware that something epochal had happened. On that cold January night of 1971, the world's first microprocessor was born!" The creation of the microprocessor launched the digital age. The key technology allowing unprecedented integration, and the design of the world's first microprocessor, the Intel 4004, were the achievement of Federico Faggin. Shrinking an entire computer onto a tiny and inexpensive piece of silicon would come to define our daily lives, imbuing myriad devices and everyday objects with computational intelligence. In Silicon, internationally recognized inventor and entrepreneur Federico Faggin chronicles his "four lives" his formative years in war-torn Northern Italy; his pioneering work in American microelectronics; his successful career as a high-tech entrepreneur; and his more recent explorations into the mysteries of consciousness. In this heartfelt memoir, Faggin paints vivid anecdotes, steps readers through society-changing technological breakthroughs, and shares personal insights, as each of his lives propels the next.
Author: Frank Hartmann
Publisher: Springer Science & Business Media
ISBN: 3540250948
Category : Science
Languages : en
Pages : 211
Get Book Here
Book Description
In the post era of the Z and W discovery, after the observation of Jets at UA1 and UA2 at CERN, John Ellis visioned at a HEP conference at Lake Tahoe, California in 1983 “To proceed with high energy particle physics, one has to tag the avour of the quarks!” This statement re ects the need for a highly precise tracking device, being able to resolve secondary and tertiary vertices within high-particle densities. Since the d- tance between the primary interaction point and the secondary vertex is proportional tothelifetimeoftheparticipatingparticle,itisanexcellentquantitytoidentifypar- cle avour in a very fast and precise way. In colliding beam experiments this method was applied especially to tag the presence of b quarks within particle jets. It was rst introduced in the DELPHI experiment at LEP but soon followed by all collider - periments to date. The long expected t quark discovery was possible mainly with the help of the CDF silicon vertex tracker, providing the b quark information. In the beginning of the 21st century the new LHC experiments are beginning to take 2 shape. CMS with its 206m of silicon area is perfectly suited to cope with the high luminosity environment. Even larger detectors are envisioned for the far future, like the SiLC project for the International Linear Collider. Silicon sensors matured from small 1in. single-sided devices to large 6in. double-sided, double metal detectors and to 6in. single-sided radiation hard sensors.
Author: Robert A. Street
Publisher: Springer Science & Business Media
ISBN: 3662041413
Category : Technology & Engineering
Languages : en
Pages : 429
Get Book Here
Book Description
This book gives the first systematic and complete survey of technology and application of amorphous silicon, a material with a huge potential in electronic applications. The book features contributions by world-wide leading researchers in this field.
Author: Peter Jutzi
Publisher: John Wiley & Sons
ISBN: 3527611215
Category : Science
Languages : de
Pages : 506
Get Book Here
Book Description
The combined results from an international research project involving 40 interdisciplinary groups, providing the latest knowledge from the past few years. Adopting an application-oriented approach, this handy reference is a must-have for every silicon chemist, whether working in inorganic, organic, physical or polymer chemistry, materials science or physics.
Author: Y. Shiraki
Publisher: Elsevier
ISBN: 0444596895
Category : Science
Languages : en
Pages : 289
Get Book Here
Book Description
The preparation of silicon germanium microstructures, their physical, chemical and electrical characterization, and their device processing and application are reviewed in this book. Special emphasis is given to ultrathin Si/Ge superlattices. Topics covered include: Wafer preparation and epitaxial growth; surface effects driven phenomena, such as clustering, segregation, 'surfactants'; Analysis, both in situ and ex situ; Strain adjustment methods; High quality buffers; Modification of material properties by quantum wells and superlattices; Devices: Novel concepts, processing, modelling, demonstrators. The questions highlighted, particularly those articles comparing related or competing activities, will provide a wealth of knowledge for all those interested in the future avenues of theory and applications in this field.
Author: Subramanian S. Iyer
Publisher: Univ. Press of Mississippi
ISBN: 9780852960394
Category : Science
Languages : en
Pages : 180
Get Book Here
Book Description
This book describes the essentials of silicon wafer bonding from an engineering perspective. A beginning chapter deals with basic processes of wafer bonding in detail, and subsequent chapters cover bonding by mechanical removal, the Smart Cut method of hydrogen exfoliation, the ELTRAN thinning technique and hydrogen annealing, engineering methods of wafer characterization, and quality assurance for bonded wafers. A chapter on advanced applications looks at applications in optoelectronics, very large scale integration (VLSI), microelectromechanical systems (MEMS), and photonics. A glossary is included, plus a table comparing various bonding methods. The editors work in the private sector. Annotation copyrighted by Book News, Inc., Portland, OR
Author: John D. Cressler
Publisher: CRC Press
ISBN: 1498708277
Category : Science
Languages : en
Pages : 590
Get Book Here
Book Description
We are in the center of the most life-changing technological revolution the Earth has ever known. In little more than 65 years, an eye-blink in human history, a single technological invention has launched the proverbial thousand ships, producing the most sweeping and pervasive set of changes ever to wash over humankind; changes that are reshaping the very core of human existence, on a global scale, at a relentlessly accelerating pace. And we are just at the very beginning. Silicon Earth: Introduction to Microelectronics and Nanotechnology introduces readers with little or no technical background to the marvels of microelectronics and nanotechnology, using straightforward language, an intuitive approach, minimal math, and lots of pictures. The general scientific and engineering underpinnings of microelectronics and nanotechnology are described, as well as how this new technological revolution is transforming a broad array of interdisciplinary fields, and civilization as a whole. Special "widget deconstruction" chapters address the inner workings of ubiquitous micro/nano-enabled pieces of technology, such as smartphones, flash drives, and digital cameras. Completely updated and upgraded to full color, the Second Edition: Includes new material on the design of electronic systems, the future of electronics, and the societal impact of micro/nanotechnology Provides new widget deconstructions of cutting-edge tech gadgets like the GPS-enabled smartwatch Adds end-of-chapter study questions and hundreds of new color photos Silicon Earth: Introduction to Microelectronics and Nanotechnology, Second Edition is a pick-up-and-read-cover-to-cover book for those curious about the micro/nanoworld, as well as a classroom-tested, student-and-professor-approved text ideal for an undergraduate-level university course. Lecture slides, homework examples, a deconstruction project, and discussion threads are available via an author-maintained website.
