Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module PDF Download
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Author: K. Otsuka
Publisher: Springer Science & Business Media
ISBN: 9781851665792
Category : Technology & Engineering
Languages : en
Pages : 260
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Book Description
This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.
Author: K. Otsuka
Publisher: Springer Science & Business Media
ISBN: 9781851665792
Category : Technology & Engineering
Languages : en
Pages : 260
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Book Description
This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.
Author: Robert John Hussey
Publisher: Springer Science & Business Media
ISBN: 1441986626
Category : Technology & Engineering
Languages : en
Pages : 508
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Book Description
Advanced Technical Ceramics Directory and Databook is a world-wide directory of the properties and suppliers of advanced technical ceramic material used in, or proposed for, numerous engineering applications. The information is subdivided into sections based on the class of ceramic, e.g. Nitrides-silicon nitride, sialon, boron carbide, aluminium nitride etc. Each section consists of a short introduction, a table comparing basic data and a series of data sheets. The book adopts standardised data in order to help the reader in finding and comparing different data and identifying the required information. It is designed to complement the existing Chapman & Hall publications on high performance materials.
Author: A. Christou
Publisher: RIAC
ISBN: 1933904151
Category : Microelectronics
Languages : en
Pages : 410
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Book Description
Author: Wai-Kai Chen
Publisher: CRC Press
ISBN: 0203011503
Category : Technology & Engineering
Languages : en
Pages : 390
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Book Description
As their name implies, VLSI systems involve the integration of various component systems. While all of these components systems are rooted in semiconductor manufacturing, they involve a broad range of technologies. This volume of the Principles and Applications of Engineering series examines the technologies associated with VLSI systems, including
Author: Wai-Kai Chen
Publisher: CRC Press
ISBN: 9781420049671
Category : Technology & Engineering
Languages : en
Pages : 1788
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Book Description
Over the years, the fundamentals of VLSI technology have evolved to include a wide range of topics and a broad range of practices. To encompass such a vast amount of knowledge, The VLSI Handbook focuses on the key concepts, models, and equations that enable the electrical engineer to analyze, design, and predict the behavior of very large-scale integrated circuits. It provides the most up-to-date information on IC technology you can find. Using frequent examples, the Handbook stresses the fundamental theory behind professional applications. Focusing not only on the traditional design methods, it contains all relevant sources of information and tools to assist you in performing your job. This includes software, databases, standards, seminars, conferences and more. The VLSI Handbook answers all your needs in one comprehensive volume at a level that will enlighten and refresh the knowledge of experienced engineers and educate the novice. This one-source reference keeps you current on new techniques and procedures and serves as a review for standard practice. It will be your first choice when looking for a solution.
Author: Norman G. Einspruch
Publisher: Academic Press
ISBN: 1483217728
Category : Technology & Engineering
Languages : en
Pages : 417
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Book Description
VLSI Electronics: Microstructure Science, Volume 5 considers trends for the future of very large scale integration (VLSI) electronics and the scientific base that supports its development. This book discusses the automation for VLSI manufacture, silicon material properties for VLSI circuitry, and high-performance computer packaging and thin-film multichip module. The nanometer-scale fabrication techniques, high-density CCD memories, and solid-state infrared imaging are also elaborated. This text likewise covers the impact of microelectronics upon radar systems and quantum-mechanical limitations on device performance. This volume is a good source for scientists and engineers who wish to become familiar with VLSI electronics, device designers concerned with the fundamental character of and limitations to device performance, systems architects who will be charged with tying VLSI circuits together, and engineers conducting work on the utilization of VLSI circuits in specific areas of application.
Author:
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
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Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author:
Publisher:
ISBN:
Category : American literature
Languages : en
Pages : 2266
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Book Description
Author:
Publisher:
ISBN:
Category : American literature
Languages : en
Pages : 2264
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Book Description
A world list of books in the English language.
Author: R.R. Tummala
Publisher: Springer Science & Business Media
ISBN: 1461560373
Category : Computers
Languages : en
Pages : 1060
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Book Description
Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
