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Author: Daryl Ann Doane
Publisher: Springer Science & Business Media
ISBN: 1461531004
Category : Computers
Languages : en
Pages : 895
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Book Description
Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.
Author: Daryl Ann Doane
Publisher: Springer Science & Business Media
ISBN: 1461531004
Category : Computers
Languages : en
Pages : 895
Get Book Here
Book Description
Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.
Author: Glenn R. Blackwell
Publisher: CRC Press
ISBN: 9781420049848
Category : Technology & Engineering
Languages : en
Pages : 648
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Book Description
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
Author: Peter A. Sandborn
Publisher: Springer Science & Business Media
ISBN: 1475748418
Category : Technology & Engineering
Languages : en
Pages : 270
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Book Description
Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modeling), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis.
Author: Wai-Kai Chen
Publisher: CRC Press
ISBN: 1420005960
Category : Technology & Engineering
Languages : en
Pages : 2322
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Book Description
For the new millenium, Wai-Kai Chen introduced a monumental reference for the design, analysis, and prediction of VLSI circuits: The VLSI Handbook. Still a valuable tool for dealing with the most dynamic field in engineering, this second edition includes 13 sections comprising nearly 100 chapters focused on the key concepts, models, and equations. Written by a stellar international panel of expert contributors, this handbook is a reliable, comprehensive resource for real answers to practical problems. It emphasizes fundamental theory underlying professional applications and also reflects key areas of industrial and research focus. WHAT'S IN THE SECOND EDITION? Sections on... Low-power electronics and design VLSI signal processing Chapters on... CMOS fabrication Content-addressable memory Compound semiconductor RF circuits High-speed circuit design principles SiGe HBT technology Bipolar junction transistor amplifiers Performance modeling and analysis using SystemC Design languages, expanded from two chapters to twelve Testing of digital systems Structured for convenient navigation and loaded with practical solutions, The VLSI Handbook, Second Edition remains the first choice for answers to the problems and challenges faced daily in engineering practice.
Author: Ian Grout
Publisher: Elsevier
ISBN: 008055850X
Category : Computers
Languages : en
Pages : 763
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Book Description
Digital Systems Design with FPGAs and CPLDs explains how to design and develop digital electronic systems using programmable logic devices (PLDs). Totally practical in nature, the book features numerous (quantify when known) case study designs using a variety of Field Programmable Gate Array (FPGA) and Complex Programmable Logic Devices (CPLD), for a range of applications from control and instrumentation to semiconductor automatic test equipment.Key features include:* Case studies that provide a walk through of the design process, highlighting the trade-offs involved.* Discussion of real world issues such as choice of device, pin-out, power supply, power supply decoupling, signal integrity- for embedding FPGAs within a PCB based design.With this book engineers will be able to:* Use PLD technology to develop digital and mixed signal electronic systems* Develop PLD based designs using both schematic capture and VHDL synthesis techniques* Interface a PLD to digital and mixed-signal systems* Undertake complete design exercises from design concept through to the build and test of PLD based electronic hardwareThis book will be ideal for electronic and computer engineering students taking a practical or Lab based course on digital systems development using PLDs and for engineers in industry looking for concrete advice on developing a digital system using a FPGA or CPLD as its core. - Case studies that provide a walk through of the design process, highlighting the trade-offs involved. - Discussion of real world issues such as choice of device, pin-out, power supply, power supply decoupling, signal integrity- for embedding FPGAs within a PCB based design.
Author: Terry C. Edwards
Publisher: John Wiley & Sons
ISBN: 1118936191
Category : Technology & Engineering
Languages : en
Pages : 688
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Book Description
Building on the success of the previous three editions, Foundations for Microstrip Circuit Design offers extensive new, updated and revised material based upon the latest research. Strongly design-oriented, this fourth edition provides the reader with a fundamental understanding of this fast expanding field making it a definitive source for professional engineers and researchers and an indispensable reference for senior students in electronic engineering. Topics new to this edition: microwave substrates, multilayer transmission line structures, modern EM tools and techniques, microstrip and planar transmision line design, transmission line theory, substrates for planar transmission lines, Vias, wirebonds, 3D integrated interposer structures, computer-aided design, microstrip and power-dependent effects, circuit models, microwave network analysis, microstrip passive elements, and slotline design fundamentals.
Author: Vojin G. Oklobdzija
Publisher: CRC Press
ISBN: 1351838105
Category : Computers
Languages : en
Pages : 1775
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Book Description
New design architectures in computer systems have surpassed industry expectations. Limits, which were once thought of as fundamental, have now been broken. Digital Systems and Applications details these innovations in systems design as well as cutting-edge applications that are emerging to take advantage of the fields increasingly sophisticated capabilities. This book features new chapters on parallelizing iterative heuristics, stream and wireless processors, and lightweight embedded systems. This fundamental text— Provides a clear focus on computer systems, architecture, and applications Takes a top-level view of system organization before moving on to architectural and organizational concepts such as superscalar and vector processor, VLIW architecture, as well as new trends in multithreading and multiprocessing. includes an entire section dedicated to embedded systems and their applications Discusses topics such as digital signal processing applications, circuit implementation aspects, parallel I/O algorithms, and operating systems Concludes with a look at new and future directions in computing Features articles that describe diverse aspects of computer usage and potentials for use Details implementation and performance-enhancing techniques such as branch prediction, register renaming, and virtual memory Includes a section on new directions in computing and their penetration into many new fields and aspects of our daily lives
Author: Frank Suli
Publisher: Woodhead Publishing
ISBN: 008102391X
Category : Technology & Engineering
Languages : en
Pages : 490
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Book Description
Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions.
Author: Ian A. Grout
Publisher: Springer Science & Business Media
ISBN: 9781846280238
Category : Technology & Engineering
Languages : en
Pages : 396
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Book Description
Using the book and the software provided with it, the reader can build his/her own tester arrangement to investigate key aspects of analog-, digital- and mixed system circuits Plan of attack based on traditional testing, circuit design and circuit manufacture allows the reader to appreciate a testing regime from the point of view of all the participating interests Worked examples based on theoretical bookwork, practical experimentation and simulation exercises teach the reader how to test circuits thoroughly and effectively
Author: Robert R. Luise
Publisher: CRC Press
ISBN: 1351078224
Category : Science
Languages : en
Pages : 266
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Book Description
A gathering of leading experts in the field of high temperature polymers unite in this exciting compilation to discuss applications and marketing projections in this ever-expanding field. The authors represent a diverse group of academicians, industrial researchers, consultants, managers, and marketing forecasters and present a broad-based view of polymer technology. Topics include: liquid crystalline polymers; high temperature polyimides; heat-resistant engineering polymers; and high temperature organic polymers, including their chemistry and key functional properties in moldings, films, fibers, and coatings, as well as applications in electronics, packaging, and friction/wear. This is an essential source of data on high temperature polymers.
