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Author:
Publisher: Iulia Tomut
ISBN:
Category :
Languages : en
Pages : 170
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Book Description
Author:
Publisher: Iulia Tomut
ISBN:
Category :
Languages : en
Pages : 170
Get Book Here
Book Description
Author:
Publisher: Iulia Tomut
ISBN:
Category :
Languages : en
Pages : 159
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Book Description
Author: Chuan Seng Tan
Publisher: Springer Science & Business Media
ISBN: 0387765344
Category : Technology & Engineering
Languages : en
Pages : 365
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Book Description
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
Author: Masayoshi Esashi
Publisher: John Wiley & Sons
ISBN: 3527823255
Category : Technology & Engineering
Languages : en
Pages : 528
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Book Description
Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Author: Robin Shannon
Publisher: Scientific e-Resources
ISBN: 1839472413
Category :
Languages : en
Pages : 312
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Book Description
An analog chip is a set of miniature electronic analog circuits formed on a single piece of semiconductor material. The voltage and current at specified points in the circuits of analog chips vary continuously in time. In contrast, digital chips only use and create voltages or currents at discrete levels, with no intermediate values. In addition to Transistors, analog chips often have a larger number of passive elements than digital chips typically do. Inductors tend to be avoided because of their large size and a transistor and capacitor together can do the work of an inductor. The book broadly deals with: Direct and capacitor coupled Opamp amplifiers; Frequency response and compensation to improve the performance of Opamp circuits; Voltage and current sources, instrumentation amplifiers and precision rectifiers, limiting and clamping circuits; Log and antilog amplifiers, etc. The book covers the syllabus prescribed for B.E. Care is taken to develop the subject logically so that the book could also be used by B.Sc. and diploma students. Neatly drawn diagrams, stepwise illustrations, and graded numerical examples, are included in every chapter to support the contents.
Author: Paul D. Franzon
Publisher: John Wiley & Sons
ISBN: 3527338551
Category : Technology & Engineering
Languages : en
Pages : 488
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Book Description
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Author: Bernd Höfflinger
Publisher: Springer
ISBN: 3319220934
Category : Science
Languages : en
Pages : 342
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Book Description
The release of this second volume of CHIPS 2020 coincides with the 50th anniversary of Moore’s Law, a critical year marked by the end of the nanometer roadmap and by a significantly reduced annual rise in chip performance. At the same time, we are witnessing a data explosion in the Internet, which is consuming 40% more electrical power every year, leading to fears of a major blackout of the Internet by 2020. The messages of the first CHIPS 2020, published in 2012, concerned the realization of quantum steps for improving the energy efficiency of all chip functions. With this second volume, we review these messages and amplify upon the most promising directions: ultra-low-voltage electronics, nanoscale monolithic 3D integration, relevant-data, brain- and human-vision-inspired processing, and energy harvesting for chip autonomy. The team of authors, enlarged by more world leaders in low-power, monolithic 3D, video, and Silicon brains, presents new vistas in nanoelectronics, promising Moore-like exponential growth sustainable through to the 2030s.
Author: Banqiu Wu
Publisher: McGraw Hill Professional
ISBN: 0071741968
Category : Technology & Engineering
Languages : en
Pages : 543
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Book Description
The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. 3D IC Stacking Technology covers: High density through silicon stacking (TSS) technology Practical design ecosystem for heterogeneous 3D IC products Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack Process integration for TSV manufacturing High-aspect-ratio silicon etch for TSV Dielectric deposition for TSV Barrier and seed deposition Copper electrodeposition for TSV Chemical mechanical polishing for TSV applications Temporary and permanent bonding Assembly and test aspects of TSV technology
Author: Aida Todri-Sanial
Publisher: CRC Press
ISBN: 1351830198
Category : Technology & Engineering
Languages : en
Pages : 409
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Book Description
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Author: Lennart Bamberg
Publisher: Springer Nature
ISBN: 3030982297
Category : Technology & Engineering
Languages : en
Pages : 403
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Book Description
This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.
