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Author:
Publisher: Iulia Tomut
ISBN:
Category :
Languages : en
Pages : 159
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Book Description
Author:
Publisher: Iulia Tomut
ISBN:
Category :
Languages : en
Pages : 159
Get Book Here
Book Description
Author:
Publisher: Iulia Tomut
ISBN:
Category :
Languages : en
Pages : 170
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Book Description
Author: Paul D. Franzon
Publisher: John Wiley & Sons
ISBN: 3527338551
Category : Technology & Engineering
Languages : en
Pages : 488
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Book Description
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Author: Aida Todri-Sanial
Publisher: CRC Press
ISBN: 1351830198
Category : Technology & Engineering
Languages : en
Pages : 409
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Book Description
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Author: CMOS Emerging Technologies Research
Publisher: CMOS Emerging Technologies Research
ISBN: 1927500680
Category :
Languages : en
Pages : 312
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Book Description
Presentation slides for the Materials track at CMOSETR 2015, May 20-22, 2015.
Author: Bernd Höfflinger
Publisher: Springer
ISBN: 3319220934
Category : Science
Languages : en
Pages : 342
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Book Description
The release of this second volume of CHIPS 2020 coincides with the 50th anniversary of Moore’s Law, a critical year marked by the end of the nanometer roadmap and by a significantly reduced annual rise in chip performance. At the same time, we are witnessing a data explosion in the Internet, which is consuming 40% more electrical power every year, leading to fears of a major blackout of the Internet by 2020. The messages of the first CHIPS 2020, published in 2012, concerned the realization of quantum steps for improving the energy efficiency of all chip functions. With this second volume, we review these messages and amplify upon the most promising directions: ultra-low-voltage electronics, nanoscale monolithic 3D integration, relevant-data, brain- and human-vision-inspired processing, and energy harvesting for chip autonomy. The team of authors, enlarged by more world leaders in low-power, monolithic 3D, video, and Silicon brains, presents new vistas in nanoelectronics, promising Moore-like exponential growth sustainable through to the 2030s.
Author: Simon Deleonibus
Publisher: CRC Press
ISBN: 9814411426
Category : Technology & Engineering
Languages : en
Pages : 518
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Book Description
This book gives a state-of-the-art overview by internationally recognized researchers of the architectures of breakthrough devices required for future intelligent integrated systems. The first section highlights Advanced Silicon-Based CMOS Technologies. New device and functional architectures are reviewed in chapters on Tunneling Field-Effect Transistors and 3-D monolithic Integration, which the alternative materials could possibly use in the future. The way we can augment silicon technologies is illustrated by the co-integration of new types of devices, such as molecular and resistive spintronics-based memories and smart sensors, using nanoscale features co-integrated with silicon CMOS or above it.
Author: Lennart Bamberg
Publisher: Springer Nature
ISBN: 3030982297
Category : Technology & Engineering
Languages : en
Pages : 403
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Book Description
This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.
Author: Tadahiro Kuroda
Publisher: Cambridge University Press
ISBN: 110889822X
Category : Technology & Engineering
Languages : en
Pages : 338
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Book Description
Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.
Author: Mark Tehranipoor
Publisher: CRC Press
ISBN: 1351965891
Category : Computers
Languages : en
Pages : 455
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Book Description
The research community lacks both the capability to explain the effectiveness of existing techniques and the metrics to predict the security properties and vulnerabilities of the next generation of nano-devices and systems. This book provides in-depth viewpoints on security issues and explains how nano devices and their unique properties can address the opportunities and challenges of the security community, manufacturers, system integrators, and end users. This book elevates security as a fundamental design parameter, transforming the way new nano-devices are developed. Part 1 focuses on nano devices and building security primitives. Part 2 focuses on emerging technologies and integrations.
