Mitigating Process Variability and Soft Errors at Circuit-Level for FinFETs PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download Mitigating Process Variability and Soft Errors at Circuit-Level for FinFETs PDF full book. Access full book title Mitigating Process Variability and Soft Errors at Circuit-Level for FinFETs by Alexandra Zimpeck. Download full books in PDF and EPUB format.
Author: Alexandra Zimpeck
Publisher: Springer Nature
ISBN: 3030683680
Category : Technology & Engineering
Languages : en
Pages : 137
Get Book Here
Book Description
This book evaluates the influence of process variations (e.g. work-function fluctuations) and radiation-induced soft errors in a set of logic cells using FinFET technology, considering the 7nm technological node as a case study. Moreover, for accurate soft error estimation, the authors adopt a radiation event generator tool (MUSCA SEP3), which deals both with layout features and electrical properties of devices. The authors also explore four circuit-level techniques (e.g. transistor reordering, decoupling cells, Schmitt Trigger, and sleep transistor) as alternatives to attenuate the unwanted effects on FinFET logic cells. This book also evaluates the mitigation tendency when different levels of process variation, transistor sizing, and radiation particle characteristics are applied in the design. An overall comparison of all methods addressed by this work is provided allowing to trace a trade-off between the reliability gains and the design penalties of each approach regarding the area, performance, power consumption, single event transient (SET) pulse width, and SET cross-section.
Author: Alexandra Zimpeck
Publisher: Springer Nature
ISBN: 3030683680
Category : Technology & Engineering
Languages : en
Pages : 137
Get Book Here
Book Description
This book evaluates the influence of process variations (e.g. work-function fluctuations) and radiation-induced soft errors in a set of logic cells using FinFET technology, considering the 7nm technological node as a case study. Moreover, for accurate soft error estimation, the authors adopt a radiation event generator tool (MUSCA SEP3), which deals both with layout features and electrical properties of devices. The authors also explore four circuit-level techniques (e.g. transistor reordering, decoupling cells, Schmitt Trigger, and sleep transistor) as alternatives to attenuate the unwanted effects on FinFET logic cells. This book also evaluates the mitigation tendency when different levels of process variation, transistor sizing, and radiation particle characteristics are applied in the design. An overall comparison of all methods addressed by this work is provided allowing to trace a trade-off between the reliability gains and the design penalties of each approach regarding the area, performance, power consumption, single event transient (SET) pulse width, and SET cross-section.
Author: Jörg Henkel
Publisher: Springer Nature
ISBN: 303052017X
Category : Technology & Engineering
Languages : en
Pages : 606
Get Book Here
Book Description
This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems.
Author: Gennady Gildenblat
Publisher: Springer Science & Business Media
ISBN: 9048186145
Category : Technology & Engineering
Languages : en
Pages : 531
Get Book Here
Book Description
Most of the recent texts on compact modeling are limited to a particular class of semiconductor devices and do not provide comprehensive coverage of the field. Having a single comprehensive reference for the compact models of most commonly used semiconductor devices (both active and passive) represents a significant advantage for the reader. Indeed, several kinds of semiconductor devices are routinely encountered in a single IC design or in a single modeling support group. Compact Modeling includes mostly the material that after several years of IC design applications has been found both theoretically sound and practically significant. Assigning the individual chapters to the groups responsible for the definitive work on the subject assures the highest possible degree of expertise on each of the covered models.
Author: Ban Wong
Publisher: John Wiley & Sons
ISBN: 0471678864
Category : Technology & Engineering
Languages : en
Pages : 413
Get Book Here
Book Description
Based on the authors' expansive collection of notes taken over the years, Nano-CMOS Circuit and Physical Design bridges the gap between physical and circuit design and fabrication processing, manufacturability, and yield. This innovative book covers: process technology, including sub-wavelength optical lithography; impact of process scaling on circuit and physical implementation and low power with leaky transistors; and DFM, yield, and the impact of physical implementation.
Author: Rohit Dhiman
Publisher: Springer Nature
ISBN: 9811579377
Category : Technology & Engineering
Languages : en
Pages : 319
Get Book Here
Book Description
This book describes methodologies in the design of VLSI devices, circuits and their applications at nanoscale levels. The book begins with the discussion on the dominant role of power dissipation in highly scaled devices.The 15 Chapters of the book are classified under four sections that cover design, modeling, and simulation of electronic, magnetic and compound semiconductors for their applications in VLSI devices, circuits, and systems. This comprehensive volume eloquently presents the design methodologies for ultra–low power VLSI design, potential post–CMOS devices, and their applications from the architectural and system perspectives. The book shall serve as an invaluable reference book for the graduate students, Ph.D./ M.S./ M.Tech. Scholars, researchers, and practicing engineers working in the frontier areas of nanoscale VLSI design.
Author: Nadine Azemard
Publisher: Springer
ISBN: 3540744428
Category : Computers
Languages : en
Pages : 596
Get Book Here
Book Description
This volume features the refereed proceedings of the 17th International Workshop on Power and Timing Modeling, Optimization and Simulation. Papers cover high level design, low power design techniques, low power analog circuits, statistical static timing analysis, power modeling and optimization, low power routing optimization, security and asynchronous design, low power applications, modeling and optimization, and more.
Author: Vojislav Kecman
Publisher: MIT Press
ISBN: 9780262112550
Category : Computers
Languages : en
Pages : 556
Get Book Here
Book Description
This textbook provides a thorough introduction to the field of learning from experimental data and soft computing. Support vector machines (SVM) and neural networks (NN) are the mathematical structures, or models, that underlie learning, while fuzzy logic systems (FLS) enable us to embed structured human knowledge into workable algorithms. The book assumes that it is not only useful, but necessary, to treat SVM, NN, and FLS as parts of a connected whole. Throughout, the theory and algorithms are illustrated by practical examples, as well as by problem sets and simulated experiments. This approach enables the reader to develop SVM, NN, and FLS in addition to understanding them. The book also presents three case studies: on NN-based control, financial time series analysis, and computer graphics. A solutions manual and all of the MATLAB programs needed for the simulated experiments are available.
Author: Jyotsna Kumar Mandal
Publisher: Springer
ISBN: 9811374031
Category : Technology & Engineering
Languages : en
Pages : 782
Get Book Here
Book Description
The book covers cutting-edge and advanced research in modelling and graphics. Gathering high-quality papers presented at the First International Conference on Emerging Technology in Modelling and Graphics, held from 6 to 8 September 2018 in Kolkata, India, it addresses topics including: image processing and analysis, image segmentation, digital geometry for computer imaging, image and security, biometrics, video processing, medical imaging, and virtual and augmented reality.
Author: G.C. Messenger
Publisher: Springer Science & Business Media
ISBN: 1461560438
Category : Technology & Engineering
Languages : en
Pages : 367
Get Book Here
Book Description
This monograph is written for neophytes, students, and practitioners to aid in their understanding of single event phenomena. It attempts to collect the highlights as well as many of the more detailed aspects of this field into an entity that portrays the theoretical as well as the practical applications of this subject. Those who claim that "theory" is not for them can skip over the earlier chapters dealing with the fundamental and theoretical portions and find what they need in the way of hands-on guidelines and pertinent formulas in the later chapters. Perhaps, after a time they will return to peruse the earlier chapters for a more complete rendition and appreciation of the subject matter. It is felt that the reader should have some acquaintance with the electronics of semiconductors and devices, some broad atomic physics introduction, as well as a respectable level of mathematics through calculus, including simple differential equations. A large part of the preceding can be obtained informally, through job experience, self-study, evening classes, as well as from a formal college curriculum.
Author: Shimeng Yu
Publisher: Morgan & Claypool Publishers
ISBN: 162705930X
Category : Technology & Engineering
Languages : en
Pages : 81
Get Book Here
Book Description
RRAM technology has made significant progress in the past decade as a competitive candidate for the next generation non-volatile memory (NVM). This lecture is a comprehensive tutorial of metal oxide-based RRAM technology from device fabrication to array architecture design. State-of-the-art RRAM device performances, characterization, and modeling techniques are summarized, and the design considerations of the RRAM integration to large-scale array with peripheral circuits are discussed. Chapter 2 introduces the RRAM device fabrication techniques and methods to eliminate the forming process, and will show its scalability down to sub-10 nm regime. Then the device performances such as programming speed, variability control, and multi-level operation are presented, and finally the reliability issues such as cycling endurance and data retention are discussed. Chapter 3 discusses the RRAM physical mechanism, and the materials characterization techniques to observe the conductive filaments and the electrical characterization techniques to study the electronic conduction processes. It also presents the numerical device modeling techniques for simulating the evolution of the conductive filaments as well as the compact device modeling techniques for circuit-level design. Chapter 4 discusses the two common RRAM array architectures for large-scale integration: one-transistor-one-resistor (1T1R) and cross-point architecture with selector. The write/read schemes are presented and the peripheral circuitry design considerations are discussed. Finally, a 3D integration approach is introduced for building ultra-high density RRAM array. Chapter 5 is a brief summary and will give an outlook for RRAM’s potential novel applications beyond the NVM applications.
